KR100809816B1 - Lead frame, light emitting device package using same, and method for manufacturing same - Google Patents

Abstract

The present invention relates to a lead frame, a light emitting device package using the same, and a manufacturing method thereof, comprising: a first frame having a light emitting device mounted thereon, and having a heat sink having grooves formed on both sides of an upper surface thereof; First and second leads mounted on the first frame and not in contact with the heat sink by grooves of the heat sink are connected, mounted on the heat sink between the grooves, and the light emitting device is positioned therein. It is composed of a second frame is connected to the structure having a through hole.

Therefore, the present invention can prevent the molding resin from flowing into the bonding region of the light emitting device by blocking the bonding area of the light emitting device with a structure serving as a reflector, and emits light emitted from the side of the light emitting device upwards, There is an effect that can improve the reliability of the light emitting device package.

In addition, the present invention by forming a groove to prevent contact with the leads on the heat sink, it is possible to increase the size of the heat sink in the same package, it is possible to efficiently discharge heat generated in the light emitting device package There is.

Lead frame, light emitting device, package, lens, lens holder, exposure, heat, emission

Description

Lead frame, light emitting device package using same and manufacturing method thereof {Lead frame, light emitting device package using the same and fabricating method

1A to 1G are cross-sectional views illustrating a manufacturing process of a light emitting diode package according to the prior art.

2 is a perspective view of a lead frame for a light emitting device according to the present invention;

3 is a plan view schematically showing a state in which a lead frame for a light emitting device package according to the present invention is coupled;

4 is a cross-sectional view taken along the line A-A 'of FIG.

5A to 5F are cross-sectional views illustrating a process of manufacturing a light emitting device package using a lead frame according to the present invention.

6A and 6B are cross-sectional views illustrating another process of manufacturing a light emitting device package according to the present invention.

7 is another cross-sectional view of a light emitting device package according to the present invention;

8 is another cross-sectional view of a light emitting device package according to the present invention;

9A and 9B are another cross-sectional view of a light emitting device package according to the present invention.

10 is a perspective view illustrating a state in which a lead frame for manufacturing a plurality of light emitting device packages is coupled according to the present invention;

<Description of the symbols for the main parts of the drawings>

100,200: frame 110: heatsink

111,112,310: Leads 211,212: Leads

230: structure 231: through hole

300: molding part 320: ring-shaped protrusion

400: light emitting element 511 512: wire

600: filler 700: molding part

The present invention relates to a lead frame, a light emitting device package using the same, and a method of manufacturing the same, and more particularly, to prevent the molding resin from flowing into the bonding area of the light emitting device by blocking the bonding area of the light emitting device with a structure serving as a reflector. It is possible to prevent, and to emit light emitted from the side of the light emitting device to the top to improve the reliability of the light emitting device package, to form a groove on the heat sink to prevent contact with the leads, the heat in the same package The present invention relates to a lead frame, a light emitting device package using the same, and a method of manufacturing the same, which can increase the size of the sink and efficiently perform heat emission generated from the light emitting device package.

Conventional light emitting diodes (Light Emitign Diode) was a low-brightness product, but as the luminous efficiency of the light emitting diode is improved, it is now widely used as a light source for display, lighting / automotive, and is widely used for home and industrial lighting. It is expected to lose.

Meanwhile, as the light emitting diode efficiency is increased, the conventional simple light emitting package structure cannot cope with the high brightness package, and the size is also very compact so that it can be applied to a light source for a display, a camera element, and a display element.

In addition, the conventional cup-type package has been developed from the surface mount (Surface mount) type package.

1A to 1G are cross-sectional views illustrating a manufacturing process of a light emitting diode package according to the prior art. First, a lead is wrapped around a lead of a lead frame having a pair of leads 10a and 10b spaced apart from each other. Molded plastic bodies 11a and 11b are formed (FIG. 1A).

Thereafter, the heat sink 12 is inserted between the plastic bodies 11a and 11b to bond the heat sink 12 and the plastic bodies 11a and 11b (FIG. 1B).

Subsequently, a light emitting diode 13 is bonded on the heat sink 12 (FIG. 1C).

Then, the light emitting diodes 13 and the leads 10a and 10b are bonded to the wires 14, and a resin 15 in which the phosphors surrounding the light emitting diodes 13 are dispersed is coated. (FIG. 1D)

Subsequently, a lens 16 surrounding the light emitting diode 13 and the wire 14 is bonded to the plastic bodies 11a and 11b (FIG. 1E).

After that, the silicon 17 is filled in the lens 16 (FIG. 1F).

Finally, the leads 10a and 10b are bent (Fig. 1G).

Here, when a plurality of heat sinks are bonded to the lead frame, the leads 10a and 10b are cut and then the leads are bent.

When the package is mounted on a printed circuit board, the flat portion of the bent lead facilitates bonding to the printed circuit board.

As described above, there is a conventional method of packaging using a lead frame, and there is also a method of packaging using a printed circuit board, a ceramic substrate, or the like other than the lead frame.

In the light emitting device package process of the prior art, a package process is performed by inserting a heat sink between plastic bodies, and thus, a high process speed cannot be expected.

In addition, when the width between the plastic bodies and the width of the heat sink do not coincide, there is a problem that the insertion of the heat sink is not smooth.

The present invention integrates the first and second frames by a molding process, and does not perform a molding process after the light emitting device bonding and the wire bonding process, thereby preventing a defect in which the wire is swept away by the molding resin and the wire is broken. And a light emitting device package using the same, and a method of manufacturing the same.

Another object of the present invention is to block the bonding region of the light emitting device with a structure serving as a reflector, to prevent the molding resin from flowing into the bonding region of the light emitting device, a lead frame that can improve the reliability of the light emitting device package, It is providing the light emitting element package using the same, and its manufacturing method.

Another object of the present invention is to form a groove on the heat sink to prevent contact with the leads, to increase the size of the heat sink in the same package, it is possible to efficiently discharge heat generated in the light emitting device package The present invention provides a lead frame, a light emitting device package using the same, and a method of manufacturing the same.

A first preferred aspect for achieving the above objects of the present invention is

A first frame having a light emitting device mounted thereon and having a heat sink having grooves formed at both sides of an upper surface thereof;

First and second leads mounted on the first frame and not in contact with the heat sink by grooves of the heat sink are connected, mounted on the heat sink between the grooves, and the light emitting device is positioned therein. Provided is a lead frame composed of a second frame to which a structure having a through hole is connected.

A second preferred aspect for achieving the above objects of the present invention is

Heat sinks each having grooves on both sides of the upper surface thereof;

First and second leads respectively positioned above the grooves of the heat sink and not in contact with the heat sink;

A structure mounted on the heat sink between the grooves and having a through hole;

Grooves exposing the lower surface of the heat sink and exposing the upper end surface of the first and second leads, the upper surface of the structure, and the inside of the through hole of the structure, are formed in the upper portion, A molding part surrounding the heat sink;

A light emitting device bonded to an upper portion of the heat sink in the through hole of the structure;

A wire bonded to the light emitting device and the exposed upper surface of the first and second lead ends;

A light emitting device package using a lead frame surrounding the light emitting device, the wire, and the first and second leads and including a filler filled in a groove of the molding part is provided.

A third preferred aspect for achieving the above objects of the present invention is

Preparing a second frame having a first frame connected to a heat sink having grooves formed at both sides of the upper surface, and a first frame connected to the first and second leads, and a structure having a through hole;

First and second leads that are not in contact with the heat sink are positioned above the grooves of the heat sink, and the second frame is disposed on the first frame so that the structure having the through hole is placed on the heat sink between the grooves. Placing the step;

A groove for exposing a lower surface of the heat sink and exposing an upper surface of the first and second lead ends, an upper surface of the structure, and an inside of a through hole of the structure is formed at an upper portion, and a part of the first and second leads. And forming a molding part surrounding the heat sink;

Bonding a light emitting device to an upper portion of the heat sink exposed in the through hole, and wire bonding the light emitting device to the first and second leads;

Wrapping the light emitting device, the wire, and the first and second leads, and filling a filler in a groove of the molding part;

Cutting the heat sink, the first and second leads and the structure region connected to the first and second frames;

Provided is a method of manufacturing a light emitting device package using a lead frame comprising bending the first and second leads that are not wrapped in the molding part.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

Figure 2 is a perspective view of a lead frame for a light emitting device according to the present invention, the lead frame for a light emitting device may be mounted a light emitting device, the heat sink 110 is formed with grooves 111 and 112 formed on both sides of the upper surface is connected. A first frame (100); First and second leads 211 and 212 mounted on the first frame 100 and not contacting the heat sink 110 by the grooves 111 and 112 of the heat sink 110 are connected to the grooves. The second frame 200 is mounted on the heat sink 110 between the 111 and 112 and is connected to the structure 230 having a through hole 231 in which the light emitting device is located.

The thickness of the heat sink 110 is preferably thicker than that of the first and second leads 211 and 212, and the thick heat sink 110 is exposed to the lower surface of the molding part to be described later to externally generate heat generated from the light emitting device. It can be easily released.

The first and second frames 100 and 200 may be formed of metal.

3 is a plan view schematically illustrating a state in which a lead frame for a light emitting device package according to the present invention is coupled, and the second frame 200 of FIG. 2 is mounted on the first frame 100 to package a light emitting device. Perform.

That is, the structure 230 having the through hole 231 of the second frame 200 is mounted on the heat sink 110 of the first frame 100, and the first and second of the second frame 200 are mounted. Leads 211 and 212 are positioned above grooves 111 and 112 of the first frame 100.

4 is a cross-sectional view taken along line AA ′ of FIG. 3, and is exposed to the inside of the structure 230 of the second frame 200 while the second frame 200 is mounted on the first frame 100. The light emitting device is bonded to the upper region 115 of the heat sink 110.

In this case, as shown in FIG. 4, the inner wall of the structure 230 of the second frame 200 is preferably inclined, and when inclined such that the inner wall of the structure 230 is emitted from the side of the light emitting device positioned inside the structure 230. Light is reflected from the inner wall of the inclined structure 230 and is emitted above the light emitting device.

Therefore, the light output of the light emitting device package can be improved.

5A through 5F are cross-sectional views illustrating a process of manufacturing a light emitting device package using a lead frame according to the present invention. First, heat sinks 110 having grooves 111 and 112 formed on both sides of an upper surface as shown in FIG. A first frame 100 to which is connected; A second frame 200 is prepared in which the first and second leads 211 and 212 are connected and the structure 230 having the through hole 231 is connected.

Thereafter, first and second leads 211 and 212 which are not in contact with the heat sink 110 are positioned above the grooves 111 and 112 of the heat sink 110, and the heat sink 110 between the grooves 111 and 112. The second frame 200 is placed on the first frame 100 so that the structure 230 having the through hole 231 is placed thereon (FIG. 5A).

Next, the lower surface of the heat sink 110 is exposed, and upper ends of the first and second leads 211 and 212, the upper surface of the structure 230 and the inside of the through hole 231 of the structure 230 are exposed. An exposed groove 310 is formed at an upper portion, and a molding part 300 is formed to surround a part of the first and second leads 211 and 212 and the heat sink 110. (FIG. 5B).

Here, the state in which the first and second frames 100 and 200 are integrated with the molding part 300 may be defined as a lead frame for implementing a light emitting device package.

Subsequently, the light emitting device 400 is bonded to the heat sink 110 exposed in the through hole 231, and the light emitting device 400 and the first and second leads 211 and 212 are connected to the wires 511 and 512. Bonding (FIG. 5C).

Subsequently, the light emitting device 400, the wires 511 and 512, and the first and second leads 211 and 212 are wrapped, and the filling material 600 is filled in the groove 310 of the molding part 300. 5d)

Subsequently, an area of the heat sink 110, the first and second leads 211 and 212, and the structure 230 connected to the first and second frames 100 and 200 are cut (FIG. 5E).

Here, the separation of the heat sink 110, the first and second leads 211, 212 and the structure 230 from the first and second frames 100 and 200 is a conventional trim of a package using a lead frame. Same as the process.

Finally, the first and second leads 211 and 212 that are not wrapped in the molding part 300 are bent (FIG. 5F).

Here, the bending of the first and second leads 211 and 212 is for forming leads to smoothly bond the light emitting device package to another substrate such as a submount substrate.

Therefore, the present invention integrates the first and second frames by a molding process, and does not perform the molding process after the light emitting device bonding and the wire bonding process, thereby preventing the wire from being swept away by the molding resin and thus breaking the wire. .

In addition, the bonding region of the light emitting device may be blocked by a structure that serves as a reflector to prevent the molding resin from flowing into the bonding area of the light emitting device, thereby improving reliability of the light emitting device package.

In addition, the present invention can form a groove on the heat sink to prevent contact with the leads, thereby increasing the size of the heat sink in the same package, it is possible to efficiently discharge heat generated in the light emitting device package .

According to the above-described process, the light emitting device package according to the present invention includes a heat sink 110 having grooves 111 and 112 formed on both sides of an upper surface thereof; First and second leads 211 and 212 which are respectively located above the grooves 111 and 112 of the heat sink 110 and are not in contact with the heat sink 110; A structure 230 mounted above the heat sink 110 between the grooves 111 and 112 and having a through hole 231; A groove exposing a lower surface of the heat sink 110 and exposing upper ends of the first and second leads 211 and 212, an upper surface of the structure 230, and an inside of the through hole 231 of the structure 230. A molding part 300 formed at an upper portion of the first and second leads 211 and 212 and surrounding the heat sink 110; A light emitting device 400 bonded to an upper portion of the heat sink 110 in the through hole 231 of the structure 230; Wires 511 and 512 bonded to the light emitting device 400 and upper surfaces of the exposed ends of the first and second leads 211 and 212; The light emitting device 400, the wires 511 and 512, and the first and second leads 211 and 212 may be enclosed, and the filler 600 may be filled in the groove 310 of the molding part 300.

Here, regions of the first and second leads 211 and 212 that are not wrapped in the molding part 300 are bent.

In addition, the structure 230 is preferably formed of a metal.

6A and 6B are cross-sectional views illustrating another process of manufacturing a light emitting device package according to the present invention. After the process of FIG. 5E, the lens 700 is attached to the upper part of the molding part 300 to surround the filler 600. 6a)

Here, the filler 600 is preferably a transparent silicone gel or a transparent epoxy.

After that, the first and second leads 211 and 212 are bent (FIG. 6B).

On the other hand, the bonding of the lens 700 is the heat sink 110 and the first and second leads 211 and 212 connected to the first and second frames 100 and 200 after attaching the lens 700 after the process of FIG. 5D. An area of the structure 230 may be cut and a process of bending the first and second leads 211 and 212 may be performed as shown in FIG. 6B.

FIG. 7 is another cross-sectional view of the light emitting device package according to the present invention. In the above-described process of FIG. 5B, the first and second leads 211 and 212 of the upper end surface, the upper surface of the structure 230 and the structure 230 of FIG. A ring 310 is formed in the upper part of the molding part 300 to expose the inside of the through hole 231 and protrudes from an upper surface of the molding part 300 on the molding part 300 outside the groove 310. The protrusion 320 is formed.

When the lens 700 is inserted into and adhered to the ring-shaped protrusion 320, the optical axes of the lens 700 and the light emitting device 400 may be matched, thereby improving reliability of the light emitting device package. do.

Here, the ring-shaped protrusion 320 protrudes from the upper surface of the molding part 300 to a height 'h1'.

8 is another cross-sectional view of the light emitting device package according to the present invention. Since the inner wall of the structure 230 mounted on the heat sink 110 is inclined at a predetermined angle θ, the side surface of the light emitting device 400 is shown. The light emitted from the light is reflected and emitted to the upper portion of the light emitting device 400.

9A and 9B are other cross-sectional views of a light emitting device package according to the present invention. As shown in FIG. 9A, a lens 700 is bonded to an upper portion of the molding part 300, and the light emitting device 400 includes a lens ( Located inside 700, light emitted from the light emitting device 400 is emitted through the lens 700.

And, as shown in Figure 9b, the lower surface of the heat sink 110 is exposed from the lower portion of the molding portion 300, the heat generated in the light emitting device 400 is discharged to the outside through the heat sink 110. .

10 is a perspective view illustrating a state in which a lead frame for manufacturing a plurality of light emitting device packages is coupled according to the present invention, and the heat sink 110, the leads 211, 212, and the structure 230 correspond to the first frame. Plural numbers are formed in each of the 100 and the second frame 200.

When the first frame 100 is placed on the second frame 200 and a package manufacturing process is performed, a plurality of light emitting device packages may be manufactured.

As described above, the present invention integrates the first and second frames by the molding process, and does not perform the molding process after the light emitting device bonding and the wire bonding process, thereby preventing the wire from being swept away by the molding resin and breaking the wire. There is an effect that can be prevented.

In addition, the present invention prevents the molding resin from flowing into the bonding region of the light emitting device by blocking the bonding region of the light emitting device with a structure serving as a reflecting plate, and emits light emitted from the side of the light emitting device upwards, There is an effect that can improve the reliability of the light emitting device package.

In addition, the present invention by forming a groove to prevent contact with the leads on the heat sink, it is possible to increase the size of the heat sink in the same package, it is possible to efficiently discharge heat generated in the light emitting device package There is.

Although the invention has been described in detail only with respect to specific examples, it will be apparent to those skilled in the art that various modifications and variations are possible within the spirit of the invention, and such modifications and variations belong to the appended claims.

Claims (15)

A first frame having a light emitting device mounted thereon and having a heat sink having grooves formed at both sides of an upper surface thereof; First and second leads mounted on the first frame and not in contact with the heat sink by grooves of the heat sink are connected, mounted on the heat sink between the grooves, and the light emitting device is positioned therein. A second frame to which a structure having a through hole to be connected is connected; Grooves exposing the lower surface of the heat sink and exposing the upper end surface of the first and second leads, the upper surface of the structure, and the inside of the through hole of the structure, are formed in the upper portion, Lead frame consisting of a molding formed to surround the heat sink. delete The method of claim 1, The through hole of the structure, A lead frame characterized by being a hole penetrated in a circular shape. The method of claim 3, wherein The inner wall of the structure, A lead frame characterized by being inclined. The method of claim 1, The thickness of the heat sink, A leadframe thicker than the thickness of the first and second leads. Heat sinks each having grooves on both sides of the upper surface thereof; First and second leads respectively positioned above the grooves of the heat sink and not in contact with the heat sink; A structure mounted on the heat sink between the grooves and having a through hole; Grooves exposing the lower surface of the heat sink and exposing the upper end surface of the first and second leads, the upper surface of the structure, and the inside of the through hole of the structure, are formed in the upper portion, A molding part surrounding the heat sink; A light emitting device bonded to an upper portion of the heat sink in the through hole of the structure; A wire bonded to the light emitting device and the exposed upper surface of the first and second lead ends; A filling material surrounding the light emitting element, the wire, and the first and second leads and filled in the groove of the molding part; A light emitting device package using a lead frame configured to include a lens adhered to the upper part of the molding to surround the filler. The method of claim 6, The first and second lead regions not wrapped in the molding portion are bent, the light emitting device package using a lead frame. delete The method of claim 6, On the upper part of the molding part which is outside the groove of the molding part, A ring-shaped protrusion protruding from the upper surface of the molding portion is further formed, The light emitting device package using a lead frame, characterized in that the lens is inserted into the ring-shaped protrusion inside the adhesive. The method of claim 6, The through hole of the structure, Light emitting device package using a lead frame, characterized in that inclined. The method according to any one of claims 6, 7, 9 and 10, The filler, Light emitting device package using a lead frame, characterized in that the transparent silicone gel or transparent epoxy. The method according to any one of claims 6, 7, 9 and 10, The material of the structure, Light emitting device package using a lead frame, characterized in that the metal. Preparing a first frame to which heat sinks having grooves are connected to both sides of the upper surface, and a second frame to which first and second leads are connected and a structure having a through hole are connected; First and second leads that are not in contact with the heat sink are positioned above the grooves of the heat sink, and the second frame is disposed on the first frame so that the structure having the through hole is placed on the heat sink between the grooves. Placing the step; A groove for exposing a lower surface of the heat sink and exposing an upper surface of the first and second lead ends, an upper surface of the structure, and an inside of a through hole of the structure is formed at an upper portion, and a part of the first and second leads. And forming a molding part surrounding the heat sink; Bonding a light emitting device to an upper portion of the heat sink exposed in the through hole, and wire bonding the light emitting device to the first and second leads; Wrapping the light emitting device, the wire, and the first and second leads, and filling a filler in a groove of the molding part; Separating the first and second frames from the heat sink, the first and second leads, and the structure; Method of manufacturing a light emitting device package using a lead frame comprising the step of bending the first and second leads that are not wrapped in the molding. The method of claim 13, Between filling and cutting the filler, The method of manufacturing a light emitting device package using a lead frame, characterized in that the step of adhering a lens on the upper part of the molding to surround the filler. The method of claim 14, On the upper part of the molding part outside the groove of the molding part, Further forming a ring-shaped protrusion projecting from the upper surface of the molding, The method of manufacturing a light emitting device package using a lead frame, characterized in that for attaching the lens into the ring-shaped protrusion inside the adhesive.

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