CN101013735A

CN101013735A - Lead frame and light emitting device package using the same

Info

Publication number: CN101013735A
Application number: CNA2007100077963A
Authority: CN
Inventors: 朴光石
Original assignee: LG Electronics Inc; LG Innotek Co Ltd
Current assignee: LG Electronics Inc; LG Innotek Co Ltd
Priority date: 2006-02-02
Filing date: 2007-02-02
Publication date: 2007-08-08
Also published as: KR20070079386A; KR100809816B1

Abstract

A lead frame and a light emitting device package using the same are disclosed. More particularly, a lead frame and a light emitting device package using the lead frame which can be easily manufactured and employ a multi-chip structure. The light emitting device package includes a first frame including a heat sink, a second frame coupled to an upper side of the first frame, the second frame including at least one pair of leads and a mount formed with a hole, and a molded structure for coupling the first and second frames to each other.

Description

Lead frame and its luminescent device bag of use

The application requires the korean patent application No.10-2006-0010003 that submits on February 2nd, 2006 and the interests of the korean patent application No.10-2006-0083014 that submits on August 30th, 2006, these patent applications comprise thus by reference, just as what here illustrate fully.

Technical field

The present invention relates to a kind of lead frame and a kind of luminescent device bag that uses it, and more particularly, relate to a kind of lead frame and a kind of luminescent device bag that uses this lead frame, the application of multi-chip structure can easily be made and allow to this lead frame.

Background technology

Light-emitting diode (LED) is as being current conversion Cheng Guang known with radiative light emitting semiconductor device.Since the red LED of using the GaAsP compound semiconductor can buy beginning in 1962, it with based on the green LED of GaP:N as the light source in the electronic equipment, be used for image and show.

Depend on the semi-conducting material that is used for constructing LED from a kind of like this LED wavelength of light emitted.This is because radiative wavelength depends on the band gap of the semi-conducting material that is illustrated in the energy difference between valence band electronics and the conduction band electron.

Gallium nitride (GaN) compound semiconductor is much accounted of in high-power electronic device, because it presents the broad-band gap of very high thermal stability and 0.8 to 6.2eV.One of reason why the GaN compound semiconductor has been much accounted of is, can use GaN and other element for example indium (In), aluminium (Al) or the like combination and construct can transmitting green, blueness, and the semiconductor layer of white light.

Therefore, can use GaN to regulate armed light wavelength with other element combinedly.Thereby, in the occasion of using GaN, can suitably determine the material of expectation LED according to the characteristic of the equipment of using LED.For example, can construct, or White LED is to replace glow lamp for the useful blue led of optical recording.

On the other hand, the green LED of initial exploitation uses GaP to make.Because GaP is the indirect transition material that causes that efficient degenerates, so use the green LED of this made in fact can not produce pure green light.Yet, rely on nearest InGaN growth for Thin Film (growth) success, might construct high photism green LED.

Because based on above-mentioned advantage and other advantage of the LED of GaN, increase rapidly based on the LED market of GaN.And, since becoming in 1994, GaN base LED can buy beginning, and the technology that is associated with electric-optical appliance based on GaN is developed rapidly.

Developed into based on the LED of GaN and to have presented the luminous efficiency that is better than glow lamp.Current, fully equal the efficient of fluorescent lamp based on the efficient of the LED of GaN.Thereby prediction will increase significantly based on the LED market of GaN.

A kind of like this LED arrives for it uses with the component package of making before other.The example of LED bag 10 is described in Fig. 1.

The LED bag of describing 10 comprises: plastics package body 11 comprises radiator 12 therein; With led chip 20, it is installed on the packing body 11.

Led chip 20 is connected electrically on the lead-in wire 13 through lead 14.Encapsulant, for example resin 15 and silicones 17 are filled in led chip 20 tops, and next, lens 16 are provided at the encapsulant top again.

In having the LED bag of said structure, the heat that produces in the operating period of LED transmits through packing body 11.Yet, because packing body 11 made by the plastic material that presents low heat transfer speed, so there is the heat of decline to discharge effect and thereby the LED optical characteristics shortcoming of degenerating.

In addition, be used for the packaging process that radiator 12 is inserted in the hole of getting in plastics package body 11 is difficult to expect fast processing speed, if and the width of radiator 12 is not equal to the width at plastics package body 11 mesopores, then can not guarantee the level and smooth insertion of radiator 12.

Specifically since with size, optical uniformity, and the relevant problem of cost, be difficult to realize the lighting apparatus such as backlight by arranging LED.In this case, also be difficult to realize wherein red, green, and blue led be included in multicore sheet bag in the single bag.

Summary of the invention

Thereby, the objective of the invention is to, fully eliminate because the restriction of prior art and a kind of lead frame and a kind of luminescent device bag that uses it of one or more problems that shortcoming causes.

The objective of the invention is to, a kind of lead frame and a kind of luminescent device bag that is used for luminescent device is provided, they can easily be made, and allow the application of multi-chip structure, and emission comprises the light of the multiple color of white light.

Other advantage of the present invention, purpose, and feature part narration in description subsequently, and part will become obviously when checking hereinafter for those skilled in the art, perhaps can learn from practice of the present invention.Purpose of the present invention and other advantage realize by the structure of specifically noting in neutralize in written description its claims and the accompanying drawing and obtain.

In order to obtain these targets and other advantages, and according to as implement here and the purpose of the present invention of generalized description, a kind of luminescent device bag, it comprises: first frame comprises radiator; Second frame is coupled to the upside of first frame, and second frame comprises at least one pair of lead-in wire and forms porose fixture; And compression-molded structures, be used for first and second frames are coupled to each other.

In a second aspect of the present invention, provide a kind of lead frame, this lead frame comprises: first frame comprises radiator; With second frame, be coupled to first frame, second frame comprises at least one pair of lead-in wire and forms porose fixture.

In a third aspect of the present invention, provide a kind of luminescent device bag, it comprises: radiator; Frame is connected on the radiator, and comprises at least one pair of lead-in wire and form porose fixture; And compression-molded structures, be used for a radiator and frame to be coupled to each other.

Know that above big volume description of the present invention and following detailed description all are exemplary with indicative, and intention provides the of the present invention further explanation of institute's prescription.

Description of drawings

Be included to provide further understanding of the present invention and incorporate into and the accompanying drawing that constitutes the application's part shows embodiments of the invention, and be used for explaining principle of the present invention with describing.

In the accompanying drawings:

Fig. 1 is a cutaway view, and it shows a kind of example of traditional luminescent device bag;

Fig. 2 is a decomposition diagram, and it shows the lead frame according to first embodiment of the invention;

Fig. 3 is a perspective view, and it shows the assembled state of the lead frame of representing in Fig. 2;

Fig. 4 is the cutaway view that the line A-A along Fig. 3 obtains;

Fig. 5 is a cutaway view, and it shows that compression-molded structures wherein is provided at the state at the lead frame place that represents among Fig. 4;

Fig. 6 is the cutaway view according to the lead frame of first embodiment of the invention;

Fig. 7 is a decomposition diagram, and it shows lead frame according to a second embodiment of the present invention;

Fig. 8 is a perspective view, and it shows the assembled state of the lead frame of representing in Fig. 7;

Fig. 9 is a plane graph, and it shows the example that is used for forming second frame of multi-chip structure on lead frame according to the present invention;

Figure 10 is the cutaway view that the line B-B along Fig. 9 obtains;

Figure 11 is a plane graph, and it shows the example that is used for forming first frame of multi-chip structure on lead frame according to the present invention;

Figure 12 is a cutaway view, and it shows the example according to luminescent device bag of the present invention;

Figure 13 is the plane graph of the luminescent device bag represented in Figure 12; And

Figure 14 is a plane graph, and it shows another example according to luminescent device bag of the present invention.

Embodiment

Now will be in detail with reference to the preferred embodiments of the present invention, the example of these preferred embodiments is described in the accompanying drawings.

Yet the present invention can implement with the plurality of optional form of selecting, and should not be construed and be limited to the embodiment of narration here.Thereby although the present invention allows various modifications and optional form, its specific embodiment is expression in the accompanying drawings as an example, and will here describe in detail.However, it should be understood that to be not intended to limit the invention to disclosed concrete form that but opposite, the present invention covers and falls into by all modifications in the defined the spirit and scope of the present invention of claims, equivalence and replacement.

Identical Reference numeral runs through accompanying drawing and is used for representing identical or similar part.In the accompanying drawings, the size in floor and district is exaggerated for the purpose of clear in order to describe.

To know, when the element such as floor, district or substrate be represented as at another " on " time, it can be directly on other element or get involved element and also may exist.To know that also if the part of element, for example surperficial, when being represented as " interior ", it is far away from the outside of device than the other parts of element.

In addition, relative terms, as " ... under " and " ... on ", can be used for describing the relation with respect to another floor or district here as floor as indicated in the drawings or district.

To know that these term intentions comprise the different azimuth of the device except that the orientation of describing in the drawings.At last, term " directly " is meant and does not get involved element.As used herein, term " and/or " comprise one or more any or all combinations of the project of listing that is associated.

To know, although term first, second or the like can be used for describing multiple element, parts, district, floor and/or section here, these elements, parts, district, floor and/or section not limited by these terms.

Above term first, second or the like only be used for any element, parts, district, floor or zone are separated with other element, parts, district, floor or area region.Thereby, hereinafter term first district described, ground floor, first area or the like can be replaced by term second district, the second layer or second area or the like.

Hereinafter, describe the preferred embodiments of the present invention with reference to the accompanying drawings in detail.

As shown in Figure 2, provide first frame 100 and second frame 200, they can be coupled to each other, thereby finish lead frame, on this lead frame the luminescent device chip will be installed.

In particular, first frame 100 can comprise first edge 120 and be positioned at the radiator 110 at first edge 120 that radiator 110 is connected on first edge 120 through first connector 121.Second frame 200 can comprise: second edge 230; Be positioned at the fixture 210 at second edge 230, fixture 210 is connected on second edge 230 via second connector 231; And lead-in wire 220, it extends from second edge 230 to fixture 210.

In this case, the luminescent device chip is coupled on the radiator 110, thereby utilizes radiator 110 operations.Radiator 110 can be discharged the heat that produces in the operating period of luminescent device chip, and specifically, can be made by the metal with high-termal conductivity.

Fixture 210 inside can be formed with the hole 211 that is used for installing the luminescent device chip.Fixture 210 can have round-shaped, and centroclinal to second frame 200.

The sloping portion of fixture 210 as metal, can be formed with film by using the highly reflective material, with to fixture 210 cremasteric reflex surfaces.

As shown in Figure 2, fixture 210 can be connected on second edge 230 through two second connectors 231, and radiator 110 can be connected on first edge 120 via two first connectors 121.

These

connectors

121 and 231 and

edge

120 and 230 can in following luminescent device packet procedures, remove.

Simultaneously, for first frame 100 and second frame 200 are coupled to each other, radiator 110 has first recess 111, and it forms with lead-in wire 220 position overlapped places at radiator 110.This has the effect that prevents the electric short circuit between lead-in wire 220 and radiator 110.

Fig. 3 shows the couple state of first and

second frames

100 and 200.

And Fig. 4 shows first and second frames 100 of coupling and 200 cross section.

With reference to Fig. 5, compression-molded structures 240 forms by first and

second frames

100 and 200 of coupling, is used for first and

second frames

100 and 200 are fixed to each other.

In this case, compression-molded structures 240 forms by transfer molding process or process of injection molding.

After forming compression-molded structures 240, above-mentioned

connector

121 and 231 and

edge

120 and 230 be removed.Then, the appropriate position that each root of lead-in wire 220 surrounds in its structure 240 that is not molded is bent, to have the shape shown in Fig. 6.

Here, the reason of bending lead 220 is to help the luminescent device inclusion is incorporated into substrate, and this substrate is as for sub-mounted substrate.

As shown in Figure 6, space 300 is limited between radiator 110 and the lead-in wire 220.In particular, space 300 can be limited by first recess 111 that forms at radiator 110 places.

Can select among the embodiment, as shown in Figure 7, replace to be formed on restriceted envelope 300, the second recesses 221 the part place of the lower surface of every lead-in wire 220 at radiator 110 places formation recess 111.Other structure with in Fig. 2, represent those are identical.

By means of with the above identical process of describing with reference to Fig. 3 to 5, can utilize the structure of in Fig. 7, representing to finish at the lead frame shown in Fig. 8.

As expressed, in the present embodiment, space 300 utilizes second recess 221 that forms at the lower surface place of lead-in wire 220, is limited to wherein radiator 110 and lead-in wire 220 position overlapped places.

In case of necessity, come the restriceted envelope 300 may be by forming second recess 221 than restriceted envelope 300 is more convenient by forming first recess 111 at radiator 110 places at lead-in wire 220 places.

This be because, when a plurality of luminescent device chips are coupled on the lead frame, promptly when forming multicore sheet bag, the quantity of lead-in wire 220 must be increased to the quantity of chip as many, and therefore, be used for preventing that the space 300 of electric short circuit from must increase pro rata with accelerating of lead-in wire 220.

Yet, make owing to comprise bottom first frame, the 100 usefulness thick materials of radiator 110, so because the more complicated shape of first recess 111 may be difficult to form the pattern of first recess 111 in first frame 100.

On the other hand, top second frame 200 has than the little thickness of bottom first frame 100, and therefore, by forming second recess 221 via etching process or punching course at lead-in wire 220 places, easily restriceted envelope 300.

Fig. 9 to 14 shows that lead frame wherein is used for building the embodiment of multicore sheet bag.

As shown in Figure 9, in order to build the bag that comprises a plurality of luminescent device chips, can provide many to going between 220.

In Fig. 9, more particularly, for the application of three luminescent device chips, second frame 200 is provided with three pairs of lead-in wires 220.

As shown in Figure 10, every lead-in wire 220 can have second recess 221 that forms at its lower surface place as described above, with restriceted envelope 300 (seeing Figure 12).

Thereby institute leaded 220 does not all have and radiator 110 contacted danger, and thereby, can prevent the electric short circuit between lead-in wire 220 and radiator 110.

Consider the installing space that is used for a plurality of luminescent device chips, fixture 210 can vertically form porose 211.Hole 211 can have rectangle or elliptical shape.

Fixture 210 can be connected on second edge 230 through second connector 231.

In the present embodiment, as shown in Figure 11, first frame 100 comprises radiator 110, and similarly, radiator 110 can be connected on first edge 120 through first connector 121.

First and

second frames

100 and 200 as shown in Fig. 9 to 11 can be coupled to each other, to finish lead frame through said process.Then, if one or more luminescent device chip is installed to lead frame, then can finish the multicore sheet bag as shown in Figure 12 and 13.

In particular, fixture 210 and lead-in wire 220 utilize compression-molded structures 240 to be coupled on the radiator 110, finish lead frame thus.One or more luminescent device chips 400 are installed on the fixture 210.

Luminescent device chip 400 appends on the radiator 110 by using heat transfer material, and is connected electrically on the lead-in wire 220 through lead 410.

After this, encapsulant 500 can be filled in luminescent device chip 400 tops, and next, lens 600 can be installed in encapsulant 500 tops.

Encapsulant 500 can and comprise other resin of epoxy resin from the silicones encapsulant to be selected.

Simultaneously, where necessary, encapsulant 500 can comprise the phosphorus of the color that is used for changing the light that sends from luminescent device chip 400.

Figure 13 shows the luminescent device bag, and this luminescent device bag comprises three luminescent device chips 400 of the light that is used for launching three kinds of colors.Here, the light of three kinds of colors can comprise redness, green, reach blue light, and can create white light by the light that mixes three kinds of colors.

Certainly, will recognize, can use other luminescent device chip 400 of the light that is used for launching other color.

Simultaneously, as shown in Figure 14, the luminescent device bag can comprise four luminescent device chips 400.

For example, except that red, green, and the blue luminescent device chip, this bag can also comprise the luminescent device chip that is used for launching assisted color light.

Although Figure 14 shows wherein the state of four luminescent device chips 400 and lead-in wire 220 radial arrangement, will recognize that they also can be arranged to a row as shown in Figure 13.

Except that above-mentioned four luminescent device chips 400, if necessary, other luminescent device chip 400 can be arranged with lead-in wire 220.

Certainly, can realize to launch other luminescent device bag of the multiple color of light except that white light.

Moreover, will recognize, can provide to be used for launching white light or other monochromatic multiple optical device chip to realize the increase of brightness.Thereby, have the bag that increases brightness and can be used as illumination bag or other decoration bag.

Obvious for those skilled in the art, can carry out various modifications and changes in the present invention, and not break away from the spirit or scope of the present invention.Thereby, the invention is intended to cover the modifications and changes of this invention, as long as they fall in the scope of appended claims book and its equivalent.

Claims

1. luminescent device bag comprises:

First frame comprises radiator;

Second frame, it is coupled to the upside of first frame, and second frame comprises at least one pair of lead-in wire and forms porose fixture; And

Compression-molded structures, it is used for first and second frames coupled to each other.

2. luminescent device bag according to claim 1, wherein, space boundary is used for providing the gap between radiator and lead-in wire between radiator and lead-in wire.

3. luminescent device bag according to claim 2, wherein, described space is included in radiator and is in first recess that forms in the radiator with the lead-in wire position overlapped.

4. luminescent device bag according to claim 2, wherein, described space is included in lead-in wire and is in second recess that forms in the lead-in wire with the radiator position overlapped.

5. luminescent device bag according to claim 2, wherein, compression-molded structures is formed in the space.

6. luminescent device bag according to claim 1, wherein, described fixture has circle, rectangle or elliptical shape.

7. luminescent device bag according to claim 1, wherein, described fixture has inwardly inclined portion.

8. luminescent device bag according to claim 7, wherein, described sloping portion has reflecting surface.

9. luminescent device bag according to claim 1, wherein, described lead-in wire comprises three pairs or more to lead-in wire.

10. luminescent device bag according to claim 1 also comprises:

At least one luminescent device chip is positioned within the fixture.

11. luminescent device bag according to claim 10, wherein, described luminescent device chip attach and is connected electrically on the described lead-in wire to described radiator.

12. luminescent device bag according to claim 11, wherein, described luminescent device chip is connected on the lead-in wire via lead.

13. luminescent device bag according to claim 1, wherein, a plurality of luminescent device chips are installed within the fixture.

14. luminescent device bag according to claim 1 also comprises:

Encapsulant; With

Lens,

Wherein, encapsulant and lens are provided at described fixture top in order.

15. luminescent device bag according to claim 14, wherein, encapsulant comprises silicones or epoxy resin.

16. a lead frame comprises:

First frame comprises radiator; With

Second frame is coupled to first frame, and second frame comprises at least one pair of lead-in wire and forms porose fixture.

17. lead frame according to claim 16, wherein said radiator are connected on first edge of first frame, and described fixture is connected on second edge of second frame with lead-in wire.

18. lead frame according to claim 16, wherein said radiator have the thickness bigger than described lead-in wire.

19. lead frame according to claim 16, wherein, space boundary is used for providing the gap between radiator and lead-in wire between described radiator and lead-in wire.

20. a luminescent device bag comprises:

Radiator;

Frame is coupled to radiator, and comprises at least one pair of lead-in wire and form porose fixture; And

Compression-molded structures, it is coupled to each other to be used for a radiator and frame.