KR100722058B1 - 미소볼의 탑재장치 - Google Patents
미소볼의 탑재장치 Download PDFInfo
- Publication number
- KR100722058B1 KR100722058B1 KR1019980032124A KR19980032124A KR100722058B1 KR 100722058 B1 KR100722058 B1 KR 100722058B1 KR 1019980032124 A KR1019980032124 A KR 1019980032124A KR 19980032124 A KR19980032124 A KR 19980032124A KR 100722058 B1 KR100722058 B1 KR 100722058B1
- Authority
- KR
- South Korea
- Prior art keywords
- flux
- block
- contact
- stopper
- adsorption
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (1)
- 하면에 전도성의 미소 볼을 진공 흡착하는 흡착 헤드와,워크를 지지하는 워크 지지부와,평탄한 저면을 갖는 플럭스 저장부와,상기 저면상에 미소 볼의 반경 이하의 두께로 플럭스의 막을 형성하는 플럭스 막 형성수단과,상기 흡착 헤드를 상기 워크 지지부와 상기 플럭스 저장부의 사이를 상대적으로 이동시키는 이동 수단과,상기 흡착 헤드를 상기 플럭스 저장부에 대하여 상하 동작을 행하게 하는 상하 이동수단을 구비하고,상기 흡착 헤드는,수직 레일을 갖고, 상부에 천정을 가지며 하부에 스토퍼를 갖는 상기 상하 이동수단에 부착된 승강 부재와,상기 수직 레일과 미끄럼 운동 가능하게 끼워맞춤하는 슬라이더를 가지고, 하면의 양측부가 상기 스토퍼와 접촉하도록 상기 승강 부재에 수납된 블록과,상기 천정과 상기 블록의 상면을 결합하는 스프링 부재(40)와,미소 볼을 진공 흡착하는 복수의 흡착 구멍을 구비하고, 상기 스토퍼보다도 하방으로 돌출 가능하도록 상기 블록의 하면에 부착된 흡착 공구와,상기 스토퍼로부터 상기 블록의 하면이 이격된 것을 검출하는 접촉 검출 수단을 구비하고,상기 블록의 하면의 양측부를 상기 스토퍼에 가압하여 접촉하는 것에 의해, 상기 흡착 공구의 하강 한도를 규정하는 동시에 상기 흡착 공구의 하면을 수평면으로 유지하고, 상기 블록의 하면과 상기 스토퍼의 접촉이 끊어진 것을 상기 접촉 검출 수단이 검출하는 것에 의해, 미소 볼이 상기 저면에 접촉한 것을 검출하고,상기 스프링 부재의 힘에 의해, 상기 블록 및 상기 흡착 공구의 자중을 경감하는 것을 특징으로 하는미소 볼 탑재 장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP97-214282 | 1997-08-08 | ||
JP21428297A JP3803465B2 (ja) | 1997-08-08 | 1997-08-08 | 導電性ボールの移載装置および移載方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR19990023441A KR19990023441A (ko) | 1999-03-25 |
KR100722058B1 true KR100722058B1 (ko) | 2007-08-16 |
Family
ID=16653162
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019980032124A Expired - Fee Related KR100722058B1 (ko) | 1997-08-08 | 1998-08-07 | 미소볼의 탑재장치 |
Country Status (4)
Country | Link |
---|---|
US (1) | US6099681A (ko) |
JP (1) | JP3803465B2 (ko) |
KR (1) | KR100722058B1 (ko) |
SG (1) | SG74646A1 (ko) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3024113B1 (ja) * | 1999-01-27 | 2000-03-21 | 株式会社日鉄マイクロメタル | 金属球配列方法及び配列装置 |
JP4598240B2 (ja) | 1999-06-24 | 2010-12-15 | アスリートFa株式会社 | ボール搭載装置及びボール搭載方法 |
JP3552610B2 (ja) * | 1999-10-22 | 2004-08-11 | 松下電器産業株式会社 | 導電性ボールの移載装置および移載方法並びに導電性ボールの供給装置および供給方法 |
JP2002164644A (ja) * | 2000-11-24 | 2002-06-07 | Nec Kyushu Ltd | 半田ボール実装剤、半田ボール実装装置、半田ボール実装方法 |
JP4744689B2 (ja) * | 2000-12-11 | 2011-08-10 | パナソニック株式会社 | 粘性流体転写装置及び電子部品実装装置 |
JP4546663B2 (ja) * | 2001-04-23 | 2010-09-15 | 富士機械製造株式会社 | プリント板保持装置および電気部品装着システム |
US6607118B2 (en) | 2001-04-30 | 2003-08-19 | Asm Assembly Automation Limited | Apparatus and method for ball release |
DE10147922A1 (de) * | 2001-09-28 | 2003-04-30 | Siemens Dematic Ag | Bestückkopf zum Halten von Bauteilen |
US20040003891A1 (en) * | 2002-07-02 | 2004-01-08 | Asm Assembly Automation Ltd. | Apparatus and method for application of adhesive substances to objects |
JPWO2004107432A1 (ja) * | 2003-05-29 | 2006-07-20 | 富士通株式会社 | 電子部品の実装方法、取外し方法及びその装置 |
CN102059482A (zh) * | 2010-11-23 | 2011-05-18 | 陈宏平 | 硬脂酸微波反应制备焊条抗吸潮保护膜的方法 |
CN103311137B (zh) * | 2012-03-06 | 2015-10-28 | 上海微松工业自动化有限公司 | 一种高密度芯片封装焊球定位自动供给设备 |
US11605610B2 (en) * | 2021-09-28 | 2023-03-14 | Google Llc | Depth-adaptive mechanism for ball grid array dipping |
KR102488502B1 (ko) * | 2022-07-08 | 2023-01-18 | (주)에스에스피 | 픽업 장치 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0778847A (ja) * | 1993-09-09 | 1995-03-20 | Sharp Corp | 半導体チップの実装方法 |
JPH07193097A (ja) * | 1993-12-25 | 1995-07-28 | Sony Corp | フラツクス塗布方法及びその装置 |
JPH07307344A (ja) * | 1994-05-13 | 1995-11-21 | Matsushita Electric Ind Co Ltd | 半田ボールのボンディング装置 |
JPH08115946A (ja) * | 1994-10-13 | 1996-05-07 | Matsushita Electric Ind Co Ltd | フリップチップ実装方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2714764B1 (fr) * | 1993-12-30 | 1996-03-29 | Pixel Int Sa | Procédé de positionnement et pose de billes entretoises pour écrans plats tels que écrans fluorescents à micropointes, et équipement associé à ce procédé. |
-
1997
- 1997-08-08 JP JP21428297A patent/JP3803465B2/ja not_active Expired - Fee Related
-
1998
- 1998-07-30 SG SG1998002813A patent/SG74646A1/en unknown
- 1998-08-07 KR KR1019980032124A patent/KR100722058B1/ko not_active Expired - Fee Related
- 1998-08-10 US US09/131,819 patent/US6099681A/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0778847A (ja) * | 1993-09-09 | 1995-03-20 | Sharp Corp | 半導体チップの実装方法 |
JPH07193097A (ja) * | 1993-12-25 | 1995-07-28 | Sony Corp | フラツクス塗布方法及びその装置 |
JPH07307344A (ja) * | 1994-05-13 | 1995-11-21 | Matsushita Electric Ind Co Ltd | 半田ボールのボンディング装置 |
JPH08115946A (ja) * | 1994-10-13 | 1996-05-07 | Matsushita Electric Ind Co Ltd | フリップチップ実装方法 |
Also Published As
Publication number | Publication date |
---|---|
US6099681A (en) | 2000-08-08 |
JP3803465B2 (ja) | 2006-08-02 |
KR19990023441A (ko) | 1999-03-25 |
SG74646A1 (en) | 2000-08-22 |
JPH1154897A (ja) | 1999-02-26 |
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