KR100674319B1 - 얇은 코어층을 갖는 인쇄회로기판 제조방법 - Google Patents
얇은 코어층을 갖는 인쇄회로기판 제조방법 Download PDFInfo
- Publication number
- KR100674319B1 KR100674319B1 KR1020040100585A KR20040100585A KR100674319B1 KR 100674319 B1 KR100674319 B1 KR 100674319B1 KR 1020040100585 A KR1020040100585 A KR 1020040100585A KR 20040100585 A KR20040100585 A KR 20040100585A KR 100674319 B1 KR100674319 B1 KR 100674319B1
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- release film
- printed circuit
- circuit board
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 239000012792 core layer Substances 0.000 title 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 50
- 239000000758 substrate Substances 0.000 claims abstract description 45
- 239000011889 copper foil Substances 0.000 claims abstract description 23
- 238000009413 insulation Methods 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 88
- 238000000034 method Methods 0.000 claims description 22
- 239000011810 insulating material Substances 0.000 claims description 19
- 229910000679 solder Inorganic materials 0.000 claims description 13
- 238000005520 cutting process Methods 0.000 claims description 7
- 239000011229 interlayer Substances 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims 1
- 239000012467 final product Substances 0.000 abstract description 6
- 239000010949 copper Substances 0.000 description 29
- 229910052802 copper Inorganic materials 0.000 description 28
- 238000007747 plating Methods 0.000 description 26
- 239000010408 film Substances 0.000 description 22
- 238000007772 electroless plating Methods 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 238000005530 etching Methods 0.000 description 7
- 238000007689 inspection Methods 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 238000005553 drilling Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 238000004381 surface treatment Methods 0.000 description 4
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- DZCLVBQEPZQZNN-UHFFFAOYSA-N copper;phenol Chemical compound [Cu].OC1=CC=CC=C1 DZCLVBQEPZQZNN-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012789 electroconductive film Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 230000005283 ground state Effects 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000003909 pattern recognition Methods 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/054—Continuous temporary metal layer over resist, e.g. for selective electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1536—Temporarily stacked PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49163—Manufacturing circuit on or in base with sintering of base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (4)
- 코어 절연층, 상기 코어 절연층 상에 접착된 이형 필름, 상기 이형 필름을 둘러싸도록 적층된 절연재, 및 상하면에 적층된 동박으로 구성된 베이스 기판을 준비하는 단계;상기 베이스 기판의 상하면에 솔더 레지스트를 형성하는 단계;상하면에 회로층 및 절연층을 순차적으로 적층하는 단계;상기 이형 필름을 둘러싸는 절연재를 포함하는 부분이 제거되도록 기판의 외부를 절단하는 단계;상기 이형 필름을 떼어내어, 상기 기판을 상기 코어 절연층을 중심으로 2개의 기판으로 분리하는 단계; 및상기 분리된 각 기판의 일면에 노출된 동박을 제거하는 단계;를 포함하는 것을 특징으로 하는 인쇄회로기판 제조 방법.
- 제1항에 있어서,상기 상하면에 회로층 및 절연층을 순차적으로 적층하는 단계는,상하면에 층간 절연을 위한 절연층을 적층하는 단계;상기 절연층 상에 비아홀 및 회로 패턴을 형성하는 단계;상기 회로 패턴을 덮으면서 또 다른 솔더 레지스트를 도포하는 단계; 및전극 패드를 형성하는 단계;를 포함하는 것을 특징으로 하는 인쇄회로기판 제조 방법.
- 제1항에 있어서,상기 베이스 기판을 준비하는 단계는,코어 절연층의 상하면에 이형 필름을 접착하는 단계;상기 이형 필름을 둘러싸도록 절연재를 적층하는 단계;상기 이형 필름 및 절연재 상하면에 동박을 적층하는 단계; 및상기 베이스 기판을 압착하는 단계;를 포함하는 것을 특징으로 하는 인쇄회로기판 제조 방법.
- 삭제
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040100585A KR100674319B1 (ko) | 2004-12-02 | 2004-12-02 | 얇은 코어층을 갖는 인쇄회로기판 제조방법 |
CNB2005100553354A CN100508692C (zh) | 2004-12-02 | 2005-03-15 | 制造具有薄核心层的印刷电路板的方法 |
US11/086,642 US7346982B2 (en) | 2004-12-02 | 2005-03-22 | Method of fabricating printed circuit board having thin core layer |
JP2005117108A JP4126052B2 (ja) | 2004-12-02 | 2005-04-14 | プリント基板の製造方法および薄型プリント基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040100585A KR100674319B1 (ko) | 2004-12-02 | 2004-12-02 | 얇은 코어층을 갖는 인쇄회로기판 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060061953A KR20060061953A (ko) | 2006-06-09 |
KR100674319B1 true KR100674319B1 (ko) | 2007-01-24 |
Family
ID=36574622
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020040100585A Expired - Fee Related KR100674319B1 (ko) | 2004-12-02 | 2004-12-02 | 얇은 코어층을 갖는 인쇄회로기판 제조방법 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7346982B2 (ko) |
JP (1) | JP4126052B2 (ko) |
KR (1) | KR100674319B1 (ko) |
CN (1) | CN100508692C (ko) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100957787B1 (ko) | 2008-03-24 | 2010-05-12 | 삼성전기주식회사 | 다층 기판 제조 방법 및 다층 기판 |
KR101043540B1 (ko) | 2009-10-01 | 2011-06-21 | 삼성전기주식회사 | 인쇄회로기판의 제조방법 |
KR101044123B1 (ko) * | 2009-11-06 | 2011-06-28 | 삼성전기주식회사 | 기판 제조용 캐리어 부재 및 이를 이용한 기판의 제조방법 |
KR101044117B1 (ko) | 2009-11-02 | 2011-06-28 | 삼성전기주식회사 | 인쇄회로기판의 제조방법 |
KR101067134B1 (ko) | 2009-10-26 | 2011-09-22 | 삼성전기주식회사 | 인쇄회로기판 제조용 캐리어 및 이를 이용한 인쇄회로기판의 제조방법 |
KR101067080B1 (ko) | 2011-05-12 | 2011-09-22 | 삼성전기주식회사 | 캐리어를 이용한 인쇄회로기판의 제조방법 |
KR101077358B1 (ko) | 2009-11-09 | 2011-10-26 | 삼성전기주식회사 | 기판 제조용 캐리어 부재 및 이를 이용한 기판의 제조방법 |
KR101119380B1 (ko) | 2009-11-09 | 2012-03-06 | 삼성전기주식회사 | 기판 제조용 캐리어 부재 및 이를 이용한 기판의 제조방법 |
KR101195185B1 (ko) * | 2009-09-08 | 2012-10-29 | 주식회사 엘지화학 | 금속박 적층판, 이를 이용한 편면 인쇄회로기판 및 이의 제조방법 |
KR101300413B1 (ko) | 2011-11-24 | 2013-08-26 | 삼성전기주식회사 | 반도체 패키지용 인쇄회로기판 및 그 제조방법 |
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US6465084B1 (en) * | 2001-04-12 | 2002-10-15 | International Business Machines Corporation | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements |
KR100782935B1 (ko) * | 2006-08-21 | 2007-12-07 | 삼성전기주식회사 | 칩 내장형 인쇄회로기판 및 그 제작방법 |
US20080053688A1 (en) * | 2006-09-01 | 2008-03-06 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method of manufacturing the same |
JP4866268B2 (ja) * | 2007-02-28 | 2012-02-01 | 新光電気工業株式会社 | 配線基板の製造方法及び電子部品装置の製造方法 |
US7809812B2 (en) * | 2007-06-15 | 2010-10-05 | Sony Corporation | System and method for network setup of wireless device at point of sale |
US9692888B2 (en) * | 2007-08-06 | 2017-06-27 | Sony Electronics Inc. | System and method for network setup of wireless device for home network |
KR100916697B1 (ko) * | 2007-08-30 | 2009-09-11 | 트리포드 테크놀로지 코포레이션 | 수동소자가 직접 내장된 인쇄회로기판의 제작방법 |
KR100917124B1 (ko) * | 2007-12-18 | 2009-09-11 | 대덕전자 주식회사 | 초박판형 패키지 기판 제조 방법 |
KR100992181B1 (ko) * | 2007-12-26 | 2010-11-04 | 삼성전기주식회사 | 패키지용 기판 및 그 제조방법 |
TWI519222B (zh) * | 2008-02-29 | 2016-01-21 | Lg伊諾特股份有限公司 | 印刷電路板及其製造方法 |
CN101640976A (zh) * | 2008-07-28 | 2010-02-03 | 富葵精密组件(深圳)有限公司 | 柔性电路板的制作方法 |
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- 2005-03-22 US US11/086,642 patent/US7346982B2/en not_active Expired - Fee Related
- 2005-04-14 JP JP2005117108A patent/JP4126052B2/ja not_active Expired - Fee Related
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KR100957787B1 (ko) | 2008-03-24 | 2010-05-12 | 삼성전기주식회사 | 다층 기판 제조 방법 및 다층 기판 |
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KR101043540B1 (ko) | 2009-10-01 | 2011-06-21 | 삼성전기주식회사 | 인쇄회로기판의 제조방법 |
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KR101044117B1 (ko) | 2009-11-02 | 2011-06-28 | 삼성전기주식회사 | 인쇄회로기판의 제조방법 |
KR101044123B1 (ko) * | 2009-11-06 | 2011-06-28 | 삼성전기주식회사 | 기판 제조용 캐리어 부재 및 이를 이용한 기판의 제조방법 |
KR101077358B1 (ko) | 2009-11-09 | 2011-10-26 | 삼성전기주식회사 | 기판 제조용 캐리어 부재 및 이를 이용한 기판의 제조방법 |
KR101119380B1 (ko) | 2009-11-09 | 2012-03-06 | 삼성전기주식회사 | 기판 제조용 캐리어 부재 및 이를 이용한 기판의 제조방법 |
KR101067080B1 (ko) | 2011-05-12 | 2011-09-22 | 삼성전기주식회사 | 캐리어를 이용한 인쇄회로기판의 제조방법 |
KR101300413B1 (ko) | 2011-11-24 | 2013-08-26 | 삼성전기주식회사 | 반도체 패키지용 인쇄회로기판 및 그 제조방법 |
Also Published As
Publication number | Publication date |
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JP2006165494A (ja) | 2006-06-22 |
US7346982B2 (en) | 2008-03-25 |
CN100508692C (zh) | 2009-07-01 |
US20060121256A1 (en) | 2006-06-08 |
KR20060061953A (ko) | 2006-06-09 |
CN1784121A (zh) | 2006-06-07 |
JP4126052B2 (ja) | 2008-07-30 |
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