KR100431044B1 - 자기 센서 및 그 제조 방법 - Google Patents
자기 센서 및 그 제조 방법 Download PDFInfo
- Publication number
- KR100431044B1 KR100431044B1 KR10-2001-7001588A KR20017001588A KR100431044B1 KR 100431044 B1 KR100431044 B1 KR 100431044B1 KR 20017001588 A KR20017001588 A KR 20017001588A KR 100431044 B1 KR100431044 B1 KR 100431044B1
- Authority
- KR
- South Korea
- Prior art keywords
- magnetic sensor
- thin film
- layer
- resistance
- microns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 49
- 239000010409 thin film Substances 0.000 claims abstract description 304
- 239000000758 substrate Substances 0.000 claims abstract description 97
- 239000000203 mixture Substances 0.000 claims abstract description 9
- 239000010410 layer Substances 0.000 claims description 285
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical group [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 claims description 80
- 239000004065 semiconductor Substances 0.000 claims description 74
- 235000002595 Solanum tuberosum Nutrition 0.000 claims description 45
- 244000061456 Solanum tuberosum Species 0.000 claims description 45
- 239000013078 crystal Substances 0.000 claims description 40
- 238000004519 manufacturing process Methods 0.000 claims description 37
- 239000002184 metal Substances 0.000 claims description 28
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 230000000694 effects Effects 0.000 claims description 25
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 21
- 229910052718 tin Inorganic materials 0.000 claims description 21
- 229910052732 germanium Inorganic materials 0.000 claims description 18
- 229910052717 sulfur Inorganic materials 0.000 claims description 18
- 150000001875 compounds Chemical class 0.000 claims description 17
- 229910052711 selenium Inorganic materials 0.000 claims description 17
- 230000003321 amplification Effects 0.000 claims description 15
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 15
- 238000002161 passivation Methods 0.000 claims description 15
- 230000004888 barrier function Effects 0.000 claims description 14
- 239000011241 protective layer Substances 0.000 claims description 13
- 238000001514 detection method Methods 0.000 claims description 12
- 239000002356 single layer Substances 0.000 claims description 5
- 238000004806 packaging method and process Methods 0.000 claims description 2
- 125000002091 cationic group Chemical group 0.000 claims 2
- 230000002829 reductive effect Effects 0.000 abstract description 20
- 230000008859 change Effects 0.000 description 70
- 230000035945 sensitivity Effects 0.000 description 30
- 239000010408 film Substances 0.000 description 24
- 230000008569 process Effects 0.000 description 21
- 238000001451 molecular beam epitaxy Methods 0.000 description 20
- 230000004907 flux Effects 0.000 description 17
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 15
- 238000000206 photolithography Methods 0.000 description 15
- 239000000463 material Substances 0.000 description 14
- 239000010931 gold Substances 0.000 description 13
- 229910052737 gold Inorganic materials 0.000 description 12
- 239000012535 impurity Substances 0.000 description 10
- 229910000859 α-Fe Inorganic materials 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 8
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 230000006866 deterioration Effects 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229910052787 antimony Inorganic materials 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 230000005389 magnetism Effects 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 230000005355 Hall effect Effects 0.000 description 1
- 229910000673 Indium arsenide Inorganic materials 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 229910018605 Ni—Zn Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical group [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000036962 time dependent Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N52/00—Hall-effect devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/09—Magnetoresistive devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/80—Constructional details
- H10N50/85—Materials of the active region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N52/00—Hall-effect devices
- H10N52/80—Constructional details
- H10N52/85—Materials of the active region
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/11—Magnetic recording head
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Hall/Mr Elements (AREA)
- Measuring Magnetic Variables (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22500898 | 1998-08-07 | ||
JP1998-225008 | 1998-08-07 | ||
JP1998-239225 | 1998-08-25 | ||
JP23922598 | 1998-08-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010072297A KR20010072297A (ko) | 2001-07-31 |
KR100431044B1 true KR100431044B1 (ko) | 2004-05-12 |
Family
ID=26526378
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2001-7001588A Expired - Fee Related KR100431044B1 (ko) | 1998-08-07 | 1999-08-06 | 자기 센서 및 그 제조 방법 |
Country Status (9)
Country | Link |
---|---|
US (1) | US6590389B1 (de) |
EP (2) | EP1124271B8 (de) |
JP (1) | JP3916870B2 (de) |
KR (1) | KR100431044B1 (de) |
CN (1) | CN1185723C (de) |
AU (1) | AU5066599A (de) |
DE (1) | DE69936461T2 (de) |
TW (1) | TW393567B (de) |
WO (1) | WO2000008695A1 (de) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10007868B4 (de) * | 2000-02-21 | 2010-02-18 | Robert Bosch Gmbh | Elektronische Steuerschaltung |
CN100367526C (zh) | 2001-10-01 | 2008-02-06 | 旭化成电子材料元件株式会社 | 霍尔器件和磁传感器 |
EP1469531A4 (de) * | 2002-01-15 | 2007-07-18 | Asahi Kasei Denshi Kk | Zusammengesetzte mehrschichtige halbleiterstruktur, hall-einrichtung und herstellungsverfahren für eine hall-einrichtung |
JP2004070543A (ja) * | 2002-08-05 | 2004-03-04 | Rohm Co Ltd | ポインティング制御回路付き磁気センサ |
US20060246692A1 (en) * | 2003-02-26 | 2006-11-02 | Yoshihiko Shibata | Semiconductor sensor and method for manufacturing same |
US6903429B2 (en) * | 2003-04-15 | 2005-06-07 | Honeywell International, Inc. | Magnetic sensor integrated with CMOS |
US7265543B2 (en) * | 2003-04-15 | 2007-09-04 | Honeywell International Inc. | Integrated set/reset driver and magneto-resistive sensor |
CN100438011C (zh) * | 2004-03-24 | 2008-11-26 | 雅马哈株式会社 | 半导体装置、磁传感器和磁传感器单元 |
TW200736813A (en) | 2005-12-16 | 2007-10-01 | Asahi Kasei Denshi Kk | Position detector |
US7723814B2 (en) * | 2005-12-27 | 2010-05-25 | Asahi Kasei Kabushiki Kaisha | InSb thin film magnetic sensor and fabrication method thereof |
US7420365B2 (en) | 2006-03-15 | 2008-09-02 | Honeywell International Inc. | Single chip MR sensor integrated with an RF transceiver |
US7847536B2 (en) * | 2006-08-31 | 2010-12-07 | Itron, Inc. | Hall sensor with temperature drift control |
US8154280B2 (en) | 2006-11-30 | 2012-04-10 | Asahi Kasei Kabushiki Kaisha | Thin film lamination, thin film magnetic sensor using the thin film lamination and method for manufacturing the thin film lamination |
US8035932B2 (en) * | 2007-09-20 | 2011-10-11 | Hitachi Global Storage Technologies Netherlands B.V. | Lorentz magnetoresistive sensor with integrated signal amplification |
US7800381B2 (en) * | 2007-09-26 | 2010-09-21 | Infineon Technologies Ag | Test structures, systems, and methods for semiconductor devices |
US8559139B2 (en) * | 2007-12-14 | 2013-10-15 | Intel Mobile Communications GmbH | Sensor module and method for manufacturing a sensor module |
US8963545B2 (en) * | 2009-06-30 | 2015-02-24 | Asahi Kasei Microdevices Corporation | Magnetic sensor |
CN102298126B (zh) * | 2011-01-17 | 2013-03-13 | 江苏多维科技有限公司 | 独立封装的桥式磁场传感器 |
US8988072B2 (en) | 2011-07-21 | 2015-03-24 | Infineon Technologies Ag | Vertical hall sensor with high electrical symmetry |
US9007060B2 (en) | 2011-07-21 | 2015-04-14 | Infineon Technologies Ag | Electronic device with ring-connected hall effect regions |
US9312472B2 (en) | 2012-02-20 | 2016-04-12 | Infineon Technologies Ag | Vertical hall device with electrical 180 degree symmetry |
KR20140077590A (ko) * | 2012-12-14 | 2014-06-24 | 삼성전기주식회사 | 홀 센서 및 그 제조 방법 |
TWI619280B (zh) * | 2014-04-01 | 2018-03-21 | 友達光電股份有限公司 | 感測元件 |
US9279864B2 (en) * | 2014-05-16 | 2016-03-08 | Infineon Technologies Ag | Sensor device and sensor arrangement |
JP2016166782A (ja) * | 2015-03-09 | 2016-09-15 | エスアイアイ・セミコンダクタ株式会社 | 磁気センサ装置 |
CN105470383A (zh) * | 2015-12-31 | 2016-04-06 | 江苏森尼克电子科技有限公司 | 一种具有预埋电极的磁敏器件及制造工艺 |
CN105470382A (zh) * | 2015-12-31 | 2016-04-06 | 江苏森尼克电子科技有限公司 | 一种具有延伸电极的磁敏器件及制造工艺 |
JP6583208B2 (ja) * | 2016-10-14 | 2019-10-02 | 株式会社デンソー | 磁気検出素子 |
US10760981B2 (en) * | 2016-11-18 | 2020-09-01 | Asahi Kasei Microdevices Corporation | Hall sensor |
CN107452873B (zh) * | 2017-07-28 | 2020-09-04 | 苏州矩阵光电有限公司 | 一种霍尔元件及其制备方法 |
CN113597542A (zh) * | 2019-03-20 | 2021-11-02 | 纬湃技术有限公司 | 角度检测装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5948970A (ja) * | 1982-09-13 | 1984-03-21 | Pioneer Electronic Corp | 磁電変換素子 |
JPH0677556A (ja) * | 1991-07-16 | 1994-03-18 | Asahi Chem Ind Co Ltd | 半導体センサおよびその製造方法 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59159565A (ja) * | 1983-03-02 | 1984-09-10 | Sankyo Seiki Mfg Co Ltd | 磁気検出装置 |
JPS6428576A (en) * | 1987-07-24 | 1989-01-31 | Ube Industries | Magnetic body detector |
JPH0258880A (ja) * | 1988-08-24 | 1990-02-28 | Matsushita Electric Ind Co Ltd | 半導体磁気抵抗素子 |
JPH06103761B2 (ja) * | 1989-04-14 | 1994-12-14 | 株式会社村田製作所 | 4相差動回転センサー |
JPH0348650A (ja) * | 1989-07-14 | 1991-03-01 | Mitsubishi Kasei Corp | 単環性テルペン誘導体 |
JP2557998B2 (ja) | 1990-04-04 | 1996-11-27 | 旭化成工業株式会社 | InAsホール効果素子 |
DE69232236T2 (de) * | 1991-07-16 | 2002-08-08 | Asahi Kasei Kogyo K.K., Osaka | Halbleiter-sensor und seine herstellungsmethode |
JP3133102B2 (ja) * | 1991-08-02 | 2001-02-05 | 新日本無線株式会社 | 半導体磁気抵抗素子 |
JPH0566133A (ja) * | 1991-09-09 | 1993-03-19 | Matsushita Electric Ind Co Ltd | 磁気式回転センサ |
JP3180378B2 (ja) * | 1991-09-11 | 2001-06-25 | 松下電器産業株式会社 | 半導体薄膜の製造方法および半導体磁気抵抗素子の製造方法 |
JPH06125122A (ja) * | 1992-10-09 | 1994-05-06 | Nippon Autom Kk | 磁気抵抗素子及びその取付基板並びに該磁気抵抗素子と取付基板を用いた磁気センサ |
JP2888074B2 (ja) | 1993-01-25 | 1999-05-10 | 三菱電機株式会社 | 磁気抵抗素子 |
JP3288483B2 (ja) | 1993-06-22 | 2002-06-04 | 川崎製鉄株式会社 | 耐衝撃性に優れる薄鋼板およびその製造方法 |
JPH07147438A (ja) * | 1993-11-24 | 1995-06-06 | Murata Mfg Co Ltd | 磁電変換素子 |
JPH0888423A (ja) * | 1994-09-19 | 1996-04-02 | Asahi Chem Ind Co Ltd | 磁気センサ |
JP3681425B2 (ja) * | 1995-01-24 | 2005-08-10 | 旭化成エレクトロニクス株式会社 | GaAsホール素子 |
JPH08242027A (ja) * | 1995-03-03 | 1996-09-17 | Mitsubishi Electric Corp | 磁気抵抗素子回路 |
JP3453967B2 (ja) * | 1995-11-28 | 2003-10-06 | 松下電器産業株式会社 | 半導体薄膜磁気抵抗素子 |
JPH09203748A (ja) * | 1996-01-29 | 1997-08-05 | Tokin Corp | 半導体加速度センサ |
JPH09219547A (ja) | 1996-02-09 | 1997-08-19 | Sony Corp | 磁気抵抗素子 |
JP3548761B2 (ja) * | 1996-07-12 | 2004-07-28 | 株式会社東海ヒット | 顕微鏡観察用透明恒温培養容器 |
JPH1074308A (ja) * | 1996-08-30 | 1998-03-17 | Hitachi Ltd | 磁気スイッチング素子及びそれを用いた磁気センサと磁気記録再生装置 |
-
1999
- 1999-08-06 JP JP2000564243A patent/JP3916870B2/ja not_active Expired - Lifetime
- 1999-08-06 US US09/762,327 patent/US6590389B1/en not_active Expired - Lifetime
- 1999-08-06 WO PCT/JP1999/004280 patent/WO2000008695A1/ja active IP Right Grant
- 1999-08-06 DE DE69936461T patent/DE69936461T2/de not_active Expired - Lifetime
- 1999-08-06 EP EP99935099A patent/EP1124271B8/de not_active Expired - Lifetime
- 1999-08-06 EP EP07008331A patent/EP1813954A1/de not_active Withdrawn
- 1999-08-06 KR KR10-2001-7001588A patent/KR100431044B1/ko not_active Expired - Fee Related
- 1999-08-06 CN CNB998104191A patent/CN1185723C/zh not_active Expired - Lifetime
- 1999-08-06 AU AU50665/99A patent/AU5066599A/en not_active Abandoned
- 1999-08-06 TW TW088113543A patent/TW393567B/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5948970A (ja) * | 1982-09-13 | 1984-03-21 | Pioneer Electronic Corp | 磁電変換素子 |
JPH0677556A (ja) * | 1991-07-16 | 1994-03-18 | Asahi Chem Ind Co Ltd | 半導体センサおよびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP3916870B2 (ja) | 2007-05-23 |
EP1124271A4 (de) | 2005-01-26 |
AU5066599A (en) | 2000-02-28 |
WO2000008695A1 (fr) | 2000-02-17 |
KR20010072297A (ko) | 2001-07-31 |
EP1124271A1 (de) | 2001-08-16 |
EP1124271B8 (de) | 2007-09-19 |
EP1124271B1 (de) | 2007-07-04 |
US6590389B1 (en) | 2003-07-08 |
CN1185723C (zh) | 2005-01-19 |
CN1316104A (zh) | 2001-10-03 |
TW393567B (en) | 2000-06-11 |
DE69936461D1 (de) | 2007-08-16 |
DE69936461T2 (de) | 2008-03-13 |
EP1813954A1 (de) | 2007-08-01 |
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