KR100421218B1 - 선택 성장된 탄소나노튜브 전자 방출원을 이용한 전자방출 리소그래피 장치 및 리소그래피 방법 - Google Patents
선택 성장된 탄소나노튜브 전자 방출원을 이용한 전자방출 리소그래피 장치 및 리소그래피 방법 Download PDFInfo
- Publication number
- KR100421218B1 KR100421218B1 KR10-2001-0031125A KR20010031125A KR100421218B1 KR 100421218 B1 KR100421218 B1 KR 100421218B1 KR 20010031125 A KR20010031125 A KR 20010031125A KR 100421218 B1 KR100421218 B1 KR 100421218B1
- Authority
- KR
- South Korea
- Prior art keywords
- electron emission
- carbon nanotubes
- lithography
- carbon nanotube
- emission source
- Prior art date
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 83
- 239000002041 carbon nanotube Substances 0.000 title claims abstract description 82
- 229910021393 carbon nanotube Inorganic materials 0.000 title claims abstract description 82
- 238000001459 lithography Methods 0.000 title claims abstract description 53
- 238000000034 method Methods 0.000 title claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 230000033001 locomotion Effects 0.000 claims abstract description 4
- 239000010409 thin film Substances 0.000 claims description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 3
- 238000010894 electron beam technology Methods 0.000 description 8
- 238000002048 anodisation reaction Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 238000003917 TEM image Methods 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002071 nanotube Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J3/00—Details of electron-optical or ion-optical arrangements or of ion traps common to two or more basic types of discharge tubes or lamps
- H01J3/02—Electron guns
- H01J3/021—Electron guns using a field emission, photo emission, or secondary emission electron source
- H01J3/022—Electron guns using a field emission, photo emission, or secondary emission electron source with microengineered cathode, e.g. Spindt-type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
- C01B32/158—Carbon nanotubes
- C01B32/16—Preparation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/06—Sources
- H01J2237/063—Electron sources
- H01J2237/06325—Cold-cathode sources
- H01J2237/06341—Field emission
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/3175—Lithography
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/84—Manufacture, treatment, or detection of nanostructure
- Y10S977/901—Manufacture, treatment, or detection of nanostructure having step or means utilizing electromagnetic property, e.g. optical, x-ray, electron beamm
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Composite Materials (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Cold Cathode And The Manufacture (AREA)
- Electron Beam Exposure (AREA)
- Electron Sources, Ion Sources (AREA)
Abstract
Description
Claims (14)
- 챔버 내에 장착된 전자 방출원;상기 전자 방출원으로 부터 소정거리 이격하며 시편을 장착시키는 스테이지;를 포함하는 전자 방출 리소그래피 장치에 있어서,상기 전자 방출원은 전자 방출능이 있는 탄소 나노튜브이고, 상기 방출된 전자가 상기 탄소나노튜브에 대해 1:1로 대응되는 위치의 시편 상에 도달하도록 자기장을 인가할 수 있는 자기장 발생부;를 포함하는 것을 특징으로 하는 탄소 나노튜브를 이용한 전자 방출 리소그래피 장치.
- 제 1항에 있어서,상기 전자 방출원은 다공성 기판에 탄소 나노튜브를 형성시킨 것을 특징으로 하는 탄소 나노튜브를 이용한 전자 방출 리소그래피 장치.
- 제 2항에 있어서,상기 기판은 Si 또는 Al2O3를 포함하는 것을 특징으로 하는 탄소 나노튜브를 이용한 전자 방출 리소그래피 장치.
- 삭제
- 제 2항에 있어서,상기 탄소 나노튜브 상에 패턴된 절연성 박막;을 더 포함하는 것을 특징으로 하는 탄소 나노튜브를 이용한 전자 방출 리소그래피 장치.
- 탄소 나노튜브를 이용한 전자 방출 리소그래피 방법에 있어서,(가) 탄소 나노튜브가 형성된 기판에 전압을 인가하여 상기 탄소 나노튜브에서 전자를 방출시키는 단계;(나) 상기 방출된 전자가 상기 탄소나노튜브에 대해 1:1로 대응되는 위치의 시편 상에 도달하도록 자기장 발생부에서 자기장을 인가하여 상기 전자의 운동 궤도를 조절하는 단계; 및(다) 상기 전자에 의해 상기 시편 상에 형성된 이빔레지스트를 리소그래피하는 단계;로 이루어진 것을 특징으로 하는 탄소 나노 튜브를 이용한 전자 방출 리소그래피 방법.
- 삭제
- 제 6항에 있어서,상기 (나) 단계;는 상기 탄소 나노튜브 및 상기 시편 상의 이빔레지스트와의 거리에 따라 인가하는 자기장의 세기를 조절함으로써 이루어지는 것을 특징으로 하는 탄소 나노튜브를 이용한 전자 방출 리소그래피 방법.
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2001-0031125A KR100421218B1 (ko) | 2001-06-04 | 2001-06-04 | 선택 성장된 탄소나노튜브 전자 방출원을 이용한 전자방출 리소그래피 장치 및 리소그래피 방법 |
US10/160,102 US6794666B2 (en) | 2001-06-04 | 2002-06-04 | Electron emission lithography apparatus and method using a selectively grown carbon nanotube |
JP2002162592A JP2003017405A (ja) | 2001-06-04 | 2002-06-04 | 選択成長させたカーボンナノチューブの電子放出源を用いた電子放出リソグラフィ装置及びその動作方法並びにリソグラフィ用電子放出エミッタの製造方法 |
CNB021443904A CN1193406C (zh) | 2001-06-04 | 2002-06-04 | 使用选择性生长的碳纳米管的电子发射光刻装置及方法 |
JP2008000207A JP2008160139A (ja) | 2001-06-04 | 2008-01-04 | 選択成長させたカーボンナノチューブの電子放出源を用いた電子放出リソグラフィ装置及びリソグラフィ用電子放出エミッタの製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2001-0031125A KR100421218B1 (ko) | 2001-06-04 | 2001-06-04 | 선택 성장된 탄소나노튜브 전자 방출원을 이용한 전자방출 리소그래피 장치 및 리소그래피 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020092488A KR20020092488A (ko) | 2002-12-12 |
KR100421218B1 true KR100421218B1 (ko) | 2004-03-02 |
Family
ID=19710359
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR10-2001-0031125A KR100421218B1 (ko) | 2001-06-04 | 2001-06-04 | 선택 성장된 탄소나노튜브 전자 방출원을 이용한 전자방출 리소그래피 장치 및 리소그래피 방법 |
Country Status (4)
Country | Link |
---|---|
US (1) | US6794666B2 (ko) |
JP (2) | JP2003017405A (ko) |
KR (1) | KR100421218B1 (ko) |
CN (1) | CN1193406C (ko) |
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US6849856B1 (en) * | 2001-04-17 | 2005-02-01 | Si Diamond Technology, Inc. | Electron beam duplication lithography method and apparatus |
JP3969228B2 (ja) * | 2002-07-19 | 2007-09-05 | 松下電工株式会社 | 機械的変形量検出センサ及びそれを用いた加速度センサ、圧力センサ |
JP3907626B2 (ja) * | 2003-01-28 | 2007-04-18 | キヤノン株式会社 | 電子源の製造方法、画像表示装置の製造方法、電子放出素子の製造方法、画像表示装置、特性調整方法、及び画像表示装置の特性調整方法 |
US20060184843A1 (en) * | 2003-02-14 | 2006-08-17 | Oakley William S | Data recording using carbon nanotube electron sources |
WO2005067585A2 (en) * | 2003-07-03 | 2005-07-28 | William Oakley | Adaptive read and read-after-write for carbon nanotube recorders |
FR2863102B1 (fr) * | 2003-12-02 | 2006-04-28 | Commissariat Energie Atomique | Dispositifs a emission de champ. |
KR100562701B1 (ko) * | 2004-01-07 | 2006-03-23 | 삼성전자주식회사 | 전자 소스 및 이를 이용한 구멍의 오픈 불량 검사 장치와방법 |
EP1730591B1 (en) | 2004-01-12 | 2011-08-03 | Regents of the University of California | Nanoscale electric lithography |
US20090001289A1 (en) * | 2004-03-15 | 2009-01-01 | Oakley William S | Recording Medium |
US7470353B2 (en) * | 2004-08-30 | 2008-12-30 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing field emitter electrode using self-assembling carbon nanotubes and field emitter electrode manufactured thereby |
US7485024B2 (en) * | 2005-10-12 | 2009-02-03 | Chunghwa Picture Tubes, Ltd. | Fabricating method of field emission triodes |
US20070226705A1 (en) * | 2006-02-15 | 2007-09-27 | Microsoft Corporation | Wrap-up reads for logless persistent components |
US7550747B2 (en) * | 2006-04-03 | 2009-06-23 | Blaise Laurent Mouttet | Parallel electron beam lithography stamp (PEBLS) |
US7425715B2 (en) * | 2006-05-05 | 2008-09-16 | Blaise Laurent Mouttet | Digital parallel electron beam lithography stamp |
US20070278180A1 (en) * | 2006-06-01 | 2007-12-06 | Williamson Mark J | Electron induced chemical etching for materials characterization |
US7791055B2 (en) | 2006-07-10 | 2010-09-07 | Micron Technology, Inc. | Electron induced chemical etching/deposition for enhanced detection of surface defects |
US7892978B2 (en) | 2006-07-10 | 2011-02-22 | Micron Technology, Inc. | Electron induced chemical etching for device level diagnosis |
US7807062B2 (en) | 2006-07-10 | 2010-10-05 | Micron Technology, Inc. | Electron induced chemical etching and deposition for local circuit repair |
CN100487858C (zh) * | 2006-07-21 | 2009-05-13 | 东元电机股份有限公司 | 阵列式电子束蚀刻装置及蚀刻方法 |
US7791071B2 (en) | 2006-08-14 | 2010-09-07 | Micron Technology, Inc. | Profiling solid state samples |
US7833427B2 (en) | 2006-08-14 | 2010-11-16 | Micron Technology, Inc. | Electron beam etching device and method |
US7718080B2 (en) * | 2006-08-14 | 2010-05-18 | Micron Technology, Inc. | Electronic beam processing device and method using carbon nanotube emitter |
CN101939395B (zh) * | 2008-02-08 | 2014-12-31 | 3M创新有限公司 | 半互穿聚合物网络聚氨酯/聚脲保护膜 |
KR101161060B1 (ko) * | 2009-11-30 | 2012-06-29 | 서강대학교산학협력단 | 나노입자를 기둥형태로 조직화시키기 위한 배열장치 및 그 배열방법 |
TW201119935A (en) * | 2009-12-04 | 2011-06-16 | Univ Nat Chiao Tung | Catalytic seeding control method |
CN110832399B (zh) * | 2017-06-29 | 2021-09-28 | Asml荷兰有限公司 | 系统、光刻设备和减少衬底支撑件上的氧化或去除衬底支撑件上的氧化物的方法 |
CN112882351A (zh) * | 2021-01-20 | 2021-06-01 | 桂林理工大学 | 用于电子束投影光刻系统的图案化发射器及其制造方法 |
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-
2001
- 2001-06-04 KR KR10-2001-0031125A patent/KR100421218B1/ko not_active IP Right Cessation
-
2002
- 2002-06-04 JP JP2002162592A patent/JP2003017405A/ja active Pending
- 2002-06-04 CN CNB021443904A patent/CN1193406C/zh not_active Expired - Fee Related
- 2002-06-04 US US10/160,102 patent/US6794666B2/en not_active Expired - Fee Related
-
2008
- 2008-01-04 JP JP2008000207A patent/JP2008160139A/ja not_active Withdrawn
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JPS5640832A (en) * | 1979-09-12 | 1981-04-17 | Matsushita Electric Ind Co Ltd | Exposure method |
KR19990043770A (ko) * | 1997-11-29 | 1999-06-15 | 정선종 | 탄소 나노튜브를 이용한 전계 방출 소자의 제조 방법 |
KR19990073591A (ko) * | 1999-07-27 | 1999-10-05 | 이철진 | 미세구멍을 이용한 탄소나노튜브 3전극 에프이디의 제작. |
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KR20020088987A (ko) * | 2001-05-22 | 2002-11-29 | 엘지전자 주식회사 | 전자빔 노광 장치 및 대면적 전자 빔 소스 기판 형성 방법 |
Also Published As
Publication number | Publication date |
---|---|
JP2003017405A (ja) | 2003-01-17 |
US6794666B2 (en) | 2004-09-21 |
US20020182542A1 (en) | 2002-12-05 |
CN1193406C (zh) | 2005-03-16 |
CN1407602A (zh) | 2003-04-02 |
KR20020092488A (ko) | 2002-12-12 |
JP2008160139A (ja) | 2008-07-10 |
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