KR100383003B1 - 멀티-핑거구조의 esd 보호회로 - Google Patents
멀티-핑거구조의 esd 보호회로 Download PDFInfo
- Publication number
- KR100383003B1 KR100383003B1 KR10-2000-0087295A KR20000087295A KR100383003B1 KR 100383003 B1 KR100383003 B1 KR 100383003B1 KR 20000087295 A KR20000087295 A KR 20000087295A KR 100383003 B1 KR100383003 B1 KR 100383003B1
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- KR
- South Korea
- Prior art keywords
- protection circuit
- esd
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000758 substrate Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 2
- 230000003071 parasitic effect Effects 0.000 abstract description 9
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
- H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
- H10D89/811—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using FETs as protective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
- H01L23/4824—Pads with extended contours, e.g. grid structure, branch structure, finger structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
Description
Claims (14)
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- 반도체 기판과;상기 반도체 기판상에 분리 형성된 복수의 액티브 영역과'상기 각 액티브영역상에 형성된 2개의 게이트와;상기 각 액티브영역에서 양쪽 끝의 n+접합에 형성된 드레인영역과;상기 각 액티브영역에서 2개의 게이트사이에 형성된 소스영역과;상기 각 액티브영역사이에 형성된 소정 타입의 액티브영역으로 구성된 것을 특징으로 하는 멀티-핑거구조의 ESD 보호회로.
- 제12항에 있어서, 상기 소정 타입의 액티브영역은Vcc에 접속되는 n+접합인 것을 특징으로 하는 멀티-핑거구조의 ESD 보호회로.
- 제12항에 있어서, 상기 소정 타입의 액티브영역은Vss에 접속되는 P+접합인 것을 특징으로 하는 멀티-핑거구조의 ESD 보호회로.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2000-0087295A KR100383003B1 (ko) | 2000-12-30 | 2000-12-30 | 멀티-핑거구조의 esd 보호회로 |
JP2001336158A JP3590371B2 (ja) | 2000-12-30 | 2001-11-01 | マルチフィンガ構造の半導体装置のesd保護回路 |
US10/028,432 US6815776B2 (en) | 2000-12-30 | 2001-12-28 | Multi-finger type electrostatic discharge protection circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2000-0087295A KR100383003B1 (ko) | 2000-12-30 | 2000-12-30 | 멀티-핑거구조의 esd 보호회로 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020059039A KR20020059039A (ko) | 2002-07-12 |
KR100383003B1 true KR100383003B1 (ko) | 2003-05-09 |
Family
ID=19704126
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2000-0087295A Expired - Fee Related KR100383003B1 (ko) | 2000-12-30 | 2000-12-30 | 멀티-핑거구조의 esd 보호회로 |
Country Status (3)
Country | Link |
---|---|
US (1) | US6815776B2 (ko) |
JP (1) | JP3590371B2 (ko) |
KR (1) | KR100383003B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8546887B2 (en) | 2011-05-20 | 2013-10-01 | Samsung Electronics Co., Ltd. | Semiconductor devices |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW519748B (en) * | 2001-12-26 | 2003-02-01 | Faraday Tech Corp | Semiconductor device with substrate-triggered ESD protection |
KR20040008601A (ko) * | 2002-07-19 | 2004-01-31 | 주식회사 하이닉스반도체 | 게이트가 접지된 앤모스 트랜지스터로 구성된 반도체장치의 정전방전 보호소자 |
JP4854934B2 (ja) * | 2004-06-14 | 2012-01-18 | ルネサスエレクトロニクス株式会社 | 静電気放電保護素子 |
US20060157791A1 (en) * | 2005-01-18 | 2006-07-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | ESD protection device |
JP2007096211A (ja) * | 2005-09-30 | 2007-04-12 | Ricoh Co Ltd | 半導体装置 |
US7402846B2 (en) | 2005-10-20 | 2008-07-22 | Atmel Corporation | Electrostatic discharge (ESD) protection structure and a circuit using the same |
US7309897B2 (en) | 2006-04-13 | 2007-12-18 | Taiwan Semiconductor Manuafacturing Company, Ltd. | Electrostatic discharge protector for an integrated circuit |
TWI339886B (en) * | 2006-09-14 | 2011-04-01 | Novatek Microelectronics Corp | Layout structure of electrostatic discharge protection circuit and production method thereof |
KR100886707B1 (ko) * | 2007-04-30 | 2009-03-04 | 주식회사 하이닉스반도체 | 반도체 장치 및 그에 구비되는 논리 게이트 |
GB2460471B (en) * | 2008-05-31 | 2011-11-23 | Filtronic Compound Semiconductors Ltd | A field effect transistor and a method of manufacture thereof |
KR100996174B1 (ko) | 2008-12-15 | 2010-11-24 | 주식회사 하이닉스반도체 | 멀티 핑거 트랜지스터를 구비한 정전기 방전 회로 |
US8169760B2 (en) * | 2009-01-19 | 2012-05-01 | International Business Machines Corporation | Signal and power supply integrated ESD protection device |
DE102009029929A1 (de) * | 2009-06-19 | 2010-12-23 | Micronas Gmbh | ESD-Schutzschaltung für eine integrierte Schaltung |
JP5593160B2 (ja) * | 2010-08-13 | 2014-09-17 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP6013876B2 (ja) * | 2012-10-30 | 2016-10-25 | エスアイアイ・セミコンダクタ株式会社 | 半導体装置 |
JP6033054B2 (ja) * | 2012-11-22 | 2016-11-30 | エスアイアイ・セミコンダクタ株式会社 | 半導体装置 |
KR20170024703A (ko) * | 2015-08-26 | 2017-03-08 | 에스케이하이닉스 주식회사 | 드라이버를 포함하는 반도체 장치 |
US9653454B1 (en) * | 2016-07-20 | 2017-05-16 | Globalfoundries Inc. | Methods for an ESD protection circuit including trigger-voltage tunable cascode transistors |
CN106653747A (zh) * | 2016-12-29 | 2017-05-10 | 北京宇翔电子有限公司 | 一种防esd的二极管及包含其的cmos集成电路保护电路 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5780897A (en) * | 1995-11-13 | 1998-07-14 | Digital Equipment Corporation | ESD protection clamp for mixed voltage I/O stages using NMOS transistors |
KR19980037816A (ko) * | 1996-11-22 | 1998-08-05 | 김광호 | 정전기 보호소자 |
KR0151075B1 (ko) * | 1995-07-20 | 1998-12-01 | 김광호 | 반도체장치의 정전 방전 보호회로 |
JPH11251530A (ja) * | 1998-03-04 | 1999-09-17 | Fujitsu Ltd | 半導体装置 |
US5955763A (en) * | 1997-09-16 | 1999-09-21 | Winbond Electronics Corp. | Low noise, high current-drive MOSFET structure for uniform serpentine-shaped poly-gate turn-on during an ESD event |
US6002156A (en) * | 1997-09-16 | 1999-12-14 | Winbond Electronics Corp. | Distributed MOSFET structure with enclosed gate for improved transistor size/layout area ratio and uniform ESD triggering |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3128813B2 (ja) | 1990-08-24 | 2001-01-29 | 日本電気株式会社 | 半導体集積回路 |
JPH05267597A (ja) | 1992-03-23 | 1993-10-15 | Nec Corp | 入出力保護素子用mosトランジスタ |
JP3325396B2 (ja) * | 1994-08-19 | 2002-09-17 | 株式会社東芝 | 半導体集積回路 |
US5847429A (en) * | 1995-07-31 | 1998-12-08 | Integrated Device Technology, Inc. | Multiple node ESD devices |
KR100203054B1 (ko) | 1995-12-02 | 1999-06-15 | 윤종용 | 개선된 정전기 방전 능력을 갖는 집적 회로 |
KR100240872B1 (ko) * | 1997-02-17 | 2000-01-15 | 윤종용 | 정전기 방전 보호 회로 및 그것을 구비하는 집적 회로 |
US6097066A (en) * | 1997-10-06 | 2000-08-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Electro-static discharge protection structure for semiconductor devices |
JPH11204729A (ja) * | 1998-01-12 | 1999-07-30 | Mitsubishi Electric Corp | 半導体装置 |
KR100307554B1 (ko) | 1998-06-30 | 2001-11-15 | 박종섭 | Esd 소자를 구비하는 반도체장치 |
US6259139B1 (en) * | 1999-12-31 | 2001-07-10 | United Microelectronics Corp. | Embedded well diode MOS ESD protection circuit |
US6323523B1 (en) * | 2000-01-31 | 2001-11-27 | Taiwan Semiconductor Manufacturing Co., Ltd. | N-type structure for n-type pull-up and down I/O protection circuit |
-
2000
- 2000-12-30 KR KR10-2000-0087295A patent/KR100383003B1/ko not_active Expired - Fee Related
-
2001
- 2001-11-01 JP JP2001336158A patent/JP3590371B2/ja not_active Expired - Fee Related
- 2001-12-28 US US10/028,432 patent/US6815776B2/en not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR0151075B1 (ko) * | 1995-07-20 | 1998-12-01 | 김광호 | 반도체장치의 정전 방전 보호회로 |
US5780897A (en) * | 1995-11-13 | 1998-07-14 | Digital Equipment Corporation | ESD protection clamp for mixed voltage I/O stages using NMOS transistors |
KR19980037816A (ko) * | 1996-11-22 | 1998-08-05 | 김광호 | 정전기 보호소자 |
US5955763A (en) * | 1997-09-16 | 1999-09-21 | Winbond Electronics Corp. | Low noise, high current-drive MOSFET structure for uniform serpentine-shaped poly-gate turn-on during an ESD event |
US6002156A (en) * | 1997-09-16 | 1999-12-14 | Winbond Electronics Corp. | Distributed MOSFET structure with enclosed gate for improved transistor size/layout area ratio and uniform ESD triggering |
JPH11251530A (ja) * | 1998-03-04 | 1999-09-17 | Fujitsu Ltd | 半導体装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8546887B2 (en) | 2011-05-20 | 2013-10-01 | Samsung Electronics Co., Ltd. | Semiconductor devices |
Also Published As
Publication number | Publication date |
---|---|
US6815776B2 (en) | 2004-11-09 |
JP2002217305A (ja) | 2002-08-02 |
KR20020059039A (ko) | 2002-07-12 |
JP3590371B2 (ja) | 2004-11-17 |
US20020084491A1 (en) | 2002-07-04 |
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