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KR100358785B1 - 무접촉스마트카드용스마트카드모듈을제조하기위한방법 - Google Patents

무접촉스마트카드용스마트카드모듈을제조하기위한방법 Download PDF

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KR100358785B1
KR100358785B1 KR1019970701445A KR19970701445A KR100358785B1 KR 100358785 B1 KR100358785 B1 KR 100358785B1 KR 1019970701445 A KR1019970701445 A KR 1019970701445A KR 19970701445 A KR19970701445 A KR 19970701445A KR 100358785 B1 KR100358785 B1 KR 100358785B1
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smart card
wire
semiconductor chip
carrier
manufacturing
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KR970705803A (ko
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요제프 문디글
데틀레프 호우도
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지멘스 악티엔게젤샤프트
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Abstract

스마트 카드 모듈은 운반체(1)위에 배치된 안테나 코일(5)과, 결합 접촉에 의해서 운반체(1)위에 배치된 반도체 칩(3)에 연결되는 연결부(6)를 갖는다.

Description

무 접촉 스마트 카드용 스마트 카드 모듈을 제조하기 위한 방법
무 접촉 스마트 카드의 경우에, 상기 카드에 포함된 반도체 칩을 동작시키는데 필요한 전력은 일반적으로 선택되는 변압기내의 적어도 하나의 안테나 코일에 의해 공급된다. 또한 데이타 이동은 상기 코일에 의해 일어난다.
이 경우에, 인쇄되거나 에칭된 코일 또는 스트립-라인 형태로 전착에 의해 성장된 코일 및 에나멜-절연된 권선 코일이 일반적인데, 에나멜 절연된 권선 코일용 기본 재료로 구리가 이용된다.
상기 코일을 반도체 칩에 연결하기 위하여, 절연체가 초기에 예를들어 가열, 브러싱, 화학처리 또는 주석 코팅에 의해 코일의 연결부로부터 해체되고난후, 접촉부가 예를들어, 레이저 납땜, 갭 용접, 초음파 용접, 와이어 랩 또는 은 에나멜 접착에 의해 결합된 접착제에 의해 형성된다. 따라서, 이러한 연결부의 형성은 개개의 경우에 다수의 서로 다른 동작과 어셈블리 단계를 필요로하며, 또한 이들의 수행을 위해서는 다수의 장치가 필요하다.
독일 특허 제3,721,822 C1호에는 결합제(bond)를 통해 반도체 칩에 안테나코일을 연결하는것이 개시되어 있다. 그러므로 이러한 개시된 바의 경우에 코일은 초기에 권선되어야만 하며, 이때 코일의 단부는 부가의 동작 단계에서 결합제에 의해서 반도체 칩에 연결된다.
본 발명은 무 접촉 스마트 카드용 스마트 카드 모듈을 제조하기 위한 방법에 관한것이다.
도1은 본 발명에 따른 스마트 카드 모듈의 가능한 실시예를 나타내는 도면.
본 발명의 목적은 무 접촉 스마트 카드용 스마트 카드 모듈을 제조하기위한 방법을 제공함과 동시에, 이 방법이 간단하고 비용이 저렴하며 또한 쉽게 자동화 될 수 있도록 하는데 있다.
이러한 목적은 청구항 1에 따른 방법에 의해 달성된다. 본 발명의 바람직한 개선은 종속항에서 구체적으로 기술된다.
코일 연결부는 본 발명의 방법에 의해 반도체 칩의 접촉 영역에 바로 결합되어 있다. 이 경우에, 결합 장치는 자동코일-권선장치의 와이어 안내 헤드에 바로 결합되며, 그 결과 모든 어셈블리 단계는 하나의 장치를 이용하여 수행될수 있다. 알루미늄 와이어는 코일용으로 특히 바람직하게 사용된다. 이 와이어는 구리의 절반 이상으로 가볍고, 또한 약 반 정도 크기의 탄성 모듈을 가지며, 그 결과 완성된 카드는 더 작은 강도를 갖는다. 이런 형태의 두꺼운 와이어 결합은 예를 들어 전력 전자 공학에서 공지되어 있고, 또한 바람직하게 조절되며, 그 결과 높은 생산량이 달성된다.
본 발명의 바람직한 개선점으로서, 반도체 칩은 결합 접촉부에 의해 운반체의 리세스에 자유롭게 정지 고정되는 식으로 배치된다. 그 결과 반도체 칩은 스마트 카드가 휘어지는 압력을 받을 경우에는 파손에 대해 바람직하게 보호된다.
본 발명을 도 1을 참고로 예시적인 실시예를 이용하여 더 상세히 후술하겠다. 이 경우에, 도면은 본 발명에 따른 스마트 카드 모듈의 가능한 실시예를 나타낸다.
가요성인 비 전도성 재료로 이루어진 평판 운반체(1)는 리세스(2)를 갖는다. 반도체 칩(3)은 상기 리세스에 삽입된다. 반도체 칩(3)은 통상의 칩 접촉 영역과 비교해서 골드 평판등에 의하여 확대된 2개 접촉 영역(4)을 갖는다. 안테나 코일(5)의 연결부(6)는 결합 접촉에 의해 접촉 영역(4)에 고정된다. 이 경우에 알루미늄으로 유리하게 이루어진 와이어는 처음에 접촉 영역(4) 중 한 영역에 결합되고나서, 자동 와이어-권선 장치의 안내 헤드에 의해 권선되며, 결합 장치에는 코일을 형성하기 위해 다수의 권수(도면에는 2개의 권수만이 도시되지만, 더 있을 수 있다)가 결합되고 최종적으로 다른 접촉 영역에 다시 결합된다. 본 발명의 방법으로 이곳에 고정된 코일(5)을 갖는 반도체 칩(3)은 운반체(1)의 리세스에 삽입되며, 그 결과 코일(5)은 운반체(1) 위에 배치된다. 이 경우에, 운반체(7)는 완성된 스마트 카드의 길이와 폭을 가지며, 그 결과 스마트 카드는 운반체 위에 해당하는 덮게로서 완성될 수 있다. 그러나, 운반체(1)는 스마트 카드보다 작은 크기를 가질수 있으며, 그 결과 운반체(1)는 입구와 같이 프레임 형태인 스마트 카드의 중심부에 삽입될 수 있다.

Claims (2)

  1. 얇은 와이어의 한 단부는 반도체 칩(3)의 제1 접촉 영역(4)에 결합되는 단계;
    상기 와이어는 다수의 권수(5)로서 결합 헤드에 의해 안내되는 단계;
    상기 와이어는 상기 반도체 칩(3)의 제2 접촉 영역(4)에 결합되는 단계;
    안테나 코일(5)을 형성하는 상기 와이어 권수와 상기 반도체 칩(3)은 운반체(1)위에 배치되는 단계를 포함하는 것을 특징으로하는 스마트 카드 모듈 제조 방법.
  2. 제 1 항에 있어서, 상기 안테나 코일(5)을 형성하는 와이어 권수는 상기 반도체 칩(3)이 상기 와이어 단부(6)의 결합으로부터 정지되는 방식으로 상기 운반체(1)의 리세스(2)에 수용되도록 상기 운반체(1) 위에 배치되는 것을 특징으로 하는 스마트 카드 모듈 제조 방법.
KR1019970701445A 1994-09-05 1995-09-05 무접촉스마트카드용스마트카드모듈을제조하기위한방법 Expired - Fee Related KR100358785B1 (ko)

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FI970924L (fi) 1997-03-04
RU2155379C2 (ru) 2000-08-27
EP0780006A1 (de) 1997-06-25
UA54374C2 (uk) 2003-03-17
EP0780006B1 (de) 1998-11-18
DE4431605A1 (de) 1996-03-07
JPH10505023A (ja) 1998-05-19
FI970924A0 (fi) 1997-03-04
KR970705803A (ko) 1997-10-09
FI970924A7 (fi) 1997-03-04
DE4431605C2 (de) 1998-06-04
ATE173553T1 (de) 1998-12-15
DE59504285D1 (de) 1998-12-24
US5809633A (en) 1998-09-22
CN1160447A (zh) 1997-09-24

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