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KR100272998B1 - Method of connecting resistors in automatic gain adjuster - Google Patents

Method of connecting resistors in automatic gain adjuster Download PDF

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Publication number
KR100272998B1
KR100272998B1 KR1019970060110A KR19970060110A KR100272998B1 KR 100272998 B1 KR100272998 B1 KR 100272998B1 KR 1019970060110 A KR1019970060110 A KR 1019970060110A KR 19970060110 A KR19970060110 A KR 19970060110A KR 100272998 B1 KR100272998 B1 KR 100272998B1
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South Korea
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jumper
circuit pattern
component mounting
mounting surface
pattern surface
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KR19990039867A (en
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김현덕
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권호택
대우전자부품주식회사
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE: A method of connecting resistors in an automatic gain adjuster is provided to enable a smooth gain adjustment even in a high electric field by inserting a jumper instead of a resistor onto a component mounting surface, mounting a chip resistor on a circuit pattern surface, and then fixedly connecting the jumper and the resistor to each other by a soldering process, thereby preventing resistors from coming into contact with a chassis. CONSTITUTION: A circuit pattern surface and a component mounting surface are respectively formed on upper and lower surfaces of a board so as to produce a PCB(S10). A jumper is inserted onto the component mounting surface of the PCB(S20). Wires of the jumper protruding from the component mounting surface toward the circuit pattern surface are temporarily fixed to a chip resistor mounted on the circuit pattern surface(S30). The chip resistor is fixedly connected to the wires of the jumper by a soldering process in the circuit pattern surface(S40).

Description

자동 이득 조정기의 저항 접속방법Resistance connection method of automatic gain regulator

본 발명은 자동 이득 조정기의 저항 접속방법에 관한 것으로, 더욱 상세하게는 부품 탑재면에 저항을 삽입하는 대신 점퍼를 끼운 후 회로 패턴면에 칩저항을 탑재하여 솔더링 공정에 의하여 상호 긴밀히 고정시킬 수 있는 자동 이득 조정기의 저항 접속방법에 관한 것이다.The present invention relates to a resistance connection method of an automatic gain regulator, and more particularly, by inserting a jumper instead of inserting a resistor on a component mounting surface and mounting a chip resistor on a circuit pattern surface to be closely fixed to each other by a soldering process. It relates to a resistance connection method of an automatic gain regulator.

일반적으로 자동 이득 조정기는 텔레비전 수상기 등에서 입력신호가 변동해도 출력레벨을 변동시키지 않도록 튜너나 중간주파 증폭회로의 이득을 자동적으로 제어하는 기능을 수행한다.In general, the automatic gain adjuster performs a function of automatically controlling the gain of the tuner or the intermediate frequency amplifying circuit so that the output level does not change even if the input signal changes in a television receiver or the like.

상기 기능을 수행하기 위한 자동 이득 조정기는 각종 부품, 즉, 커패시터, 저항 및 칩저항 등이 PCB기판의 회로패턴 상에 접속되어 소정의 기능을 수행할 수 있는 구조로 이루어지는 데, 여기서는 저항의 접속방법을 제1도를 참조하여 설명하기로 한다.The automatic gain adjuster for performing the above functions is made of a structure in which various components, that is, capacitors, resistors, and chip resistors are connected on the circuit pattern of the PCB to perform a predetermined function. This will be described with reference to FIG.

제1도는 종래 기술에 따른 자동 이득 조정기의 저항 접속방법을 설명하기 위한 흐름도이다.1 is a flowchart illustrating a resistance connection method of an automatic gain regulator according to the prior art.

제1도에 도시된 바와 같이 종래 기술에 따른 자동 이득 조정기의 저항 접속방법은, 회로 패턴면(120) 및 부품 탑재면(110)을 상하면으로 나누어 성형하는 PCB기판 생성공정(S1)과, 상기 PCB기판(100)의 부품 탑재면(110)에 저항(10)을 삽입하는 저항 삽입공정(S2)과, 상기 회로 패턴면(120)으로부터 상기 부품 탑재면(110)을 향하여 끼워져 돌출된 상기 저항(10)의 리드(11)를 임시 고정하는 본딩공정(S3)과 상기 회로 패턴면(120)을 납땜(20) 처리하여 상기 저항(10)을 고정 접속하는 솔더링 공정(S4)으로 이루어진다.As shown in FIG. 1, the resistance connection method of the automatic gain regulator according to the prior art includes a PCB substrate generation process (S1) in which the circuit pattern surface 120 and the component mounting surface 110 are divided into upper and lower surfaces, and molded. Resistor insertion step (S2) for inserting the resistor 10 to the component mounting surface 110 of the PCB substrate 100, and the resistor is inserted from the circuit pattern surface 120 toward the component mounting surface 110 and protruded A bonding step S3 for temporarily fixing the lead 11 of 10 and a soldering step S4 for soldering 20 the circuit pattern surface 120 to fix and connect the resistor 10.

여기서, 상기 저항 삽입공정(S2)은 제2도의 개략 사시도에 도시된 바와 같이 PCB기판(100)의 부품 탑재면(110)에 저항(10)을 삽입하여 그 리드(11)가 회로 패턴면(120)을 향하여 돌출될 수 있도록 하는 공정을 말하고, 상기 솔더링 공정(S4)은 제3도의 개략 저면 사시도에 도시된 바와 같이 회로 패턴면(120)과 저항(10)의 리드(11)가 본딩공정(S3)에 의하여 임시적으로 고정되어 있는 상태를 납땜(20) 처리하여 상호 견고한 고정을 이룰 수 있도록 하는 공정을 말한다.Here, the resistor insertion step (S2) is a resistor 10 is inserted into the component mounting surface 110 of the PCB substrate 100 as shown in the schematic perspective view of FIG. The soldering process S4 is a process of bonding the circuit pattern surface 120 and the lead 11 of the resistor 10 as shown in the schematic bottom perspective view of FIG. 3. By (S3) refers to a process that can be achieved by the soldering (20) the state that is temporarily fixed to each other to achieve a solid fixing.

그런데, 상술한 바와 같은 공정으로 이루어진 종래 기술에 따른 자동 이득 조정기의 저항 접속방법은, 저항(10)의 리드(11)가 부품 탑재면(110)에 긴밀히 삽입되지 못할 경우, 자동 이득 조정기를 보호하는 섀시(미 도시됨)에 불필요하게 접촉되어 쇼트 등이 발생되고 이로 인하여 정상적인 저항(10)의 기능을 수행할 수 없을 뿐만 아니라 강전계시의 이득 조정을 할 수 없게 되어 신호의 변질이 우려되는 커다란 단점이 있었다.By the way, the resistance connection method of the automatic gain adjuster according to the prior art made of the above-described process, when the lead 11 of the resistor 10 is not closely inserted into the component mounting surface 110, protects the automatic gain adjuster Contacting the chassis (not shown) to cause a short, etc., which can not only perform the function of the normal resistor 10, but also the gain adjustment during the strong electric field can not be adjusted so that the signal is deteriorated There was a downside.

이에, 본 발명은 상기와 같은 제반 문제점을 해결하기 위하여 창출된 것으로, 그 목적으로 하는 바는 부품 탑재면에 점퍼를 끼운 후 회로 패턴면에 칩저항을 탑재하여 솔더링 공정에 의하여 상호 긴밀히 고정시켜 강전계 입력시의 이득 조정을 원활히 수행할 수 있는 자동 이득 조정기의 저항 접속방법을 제공함에 있다.Accordingly, the present invention was created in order to solve the above-mentioned problems, and its purpose is to insert a jumper on the component mounting surface and then mount the chip resistance on the circuit pattern surface to closely fix each other by the soldering process. The present invention provides a resistance connection method of an automatic gain regulator capable of smoothly performing gain adjustment at the time of system input.

제1도는 종래 기술에 따른 자동 이득 조정기의 저항 접속방법을 설명하기 위한 흐름도.1 is a flowchart illustrating a resistance connection method of an automatic gain regulator according to the prior art.

제2도는 종래 기술에 따른 자동 이득 조정기의 저항 접속방법에 적용된 저항 삽입공정을 설명하기 위한 PCB기판의 부품 탑재면을 나타내는 개략 사시도.2 is a schematic perspective view showing a component mounting surface of a PCB substrate for explaining the resistance insertion process applied to the resistance connection method of the automatic gain regulator according to the prior art.

제3도는 종래 기술에 따른 자동 이득 조정기의 저항 접속방법에 적용된 솔더링 공정을 설명하기 위한 PCB기판의 회로 패턴면을 나타내는 개략 저면 사시도.3 is a schematic bottom perspective view showing a circuit pattern surface of a PCB substrate for explaining the soldering process applied to the resistance connection method of the automatic gain regulator according to the prior art.

제4도는 본 발명에 따른 자동 이득 조정기의 저항 접속방법을 설명하기 위한 흐름도.4 is a flowchart illustrating a resistance connection method of an automatic gain regulator according to the present invention.

제5도는 본 발명에 따른 자동 이득 조정기의 저항 접속방법에 적용된 점퍼 삽입공정을 설명하기 위한 PCB기판의 부품 탑재면을 나타내는 개략 사시도.5 is a schematic perspective view showing a component mounting surface of a PCB substrate for explaining a jumper insertion process applied to the resistance connection method of the automatic gain adjuster according to the present invention.

제6도는 본 발명에 따른 자동 이득 조정기의 저항 접속방법에 적용된 솔더링 공정을 설명하기 위한 PCB기판의 회로 패턴면을 나타내는 개략 저면 사시도.Figure 6 is a schematic bottom perspective view showing a circuit pattern surface of a PCB substrate for explaining the soldering process applied to the resistance connection method of the automatic gain adjuster according to the present invention.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

100 : PCB기판 110 : 부품 탑재면100: PCB substrate 110: mounting surface

120 : 회로 패턴면 200 : 점퍼120: circuit pattern surface 200: jumper

210 : 동선 300 : 칩저항210: copper wire 300: chip resistance

400 : 납땜 S10 : PCB기판 생성공정400: soldering S10: PCB substrate generation process

S20 : 점퍼 삽입공정 S30 : 칩저항 본딩공정S20: Jumper Insertion Process S30: Chip Resistance Bonding Process

S40 : 솔더링 공정S40: Soldering Process

상기 목적을 달성하기 위한 본 발명에 따른 자동 이득 조정기의 저항 접속방법은, 회로 패턴면 및 부품 탑재면을 상면 및 하면으로 각각 나누어 성형하는 PCB기판 생성공정과, 상기 PCB기판의 부품 탑재면에 점퍼를 삽입하는 점퍼 삽입공정과, 상기 회로 패턴면으로부터 상기 부품 탑재면을 향하여 끼워져 돌출된 상기 점퍼의 동선에 칩저항을 임시 고정하는 칩저항 본딩공정과, 상기 회로 패턴면을 납땜 처리하여 상기 점퍼의 동선에 임시 고정된 칩저항을 긴밀히 고정 접속하는 솔더링 공정을 포함하여 이루어지는 것을 그 기술적 방법상의 기본 특징으로 한다.The resistance connection method of the automatic gain adjuster according to the present invention for achieving the above object is a PCB substrate generation step of forming the circuit pattern surface and component mounting surface divided into upper and lower surfaces, respectively, and jumper on the component mounting surface of the PCB substrate A jumper insertion step of inserting a chip; a chip resistance bonding step of temporarily fixing chip resistance to a copper wire of the jumper inserted and protruding from the circuit pattern surface toward the component mounting surface; and soldering the circuit pattern surface to solder the jumper. A basic feature of the technical method is to include a soldering process of tightly connecting the chip resistor temporarily fixed to the copper wire.

이하, 본 발명에 따른 자동 이득 조정기의 저항 접속방법의 바람직한 실시예를 제4도를 참조하여 설명하면 다음과 같다.Hereinafter, a preferred embodiment of the resistance connection method of the automatic gain regulator according to the present invention will be described with reference to FIG.

제4도는 본 발명에 따른 자동 이득 조정기의 저항 접속방법을 설명하기 위한 흐름도이다.4 is a flowchart illustrating a resistance connection method of the automatic gain regulator according to the present invention.

본 발명에 따른 자동 이득 조정기의 저항 접속방법은 제4도에 도시된 바와 같이, 회로 패턴면(120) 및 부품 탑재면(110)을 상하면으로 나누어 성형하는 PCB기판 생성공정(S10)과, 상기 PCB기판(100)의 부품 탑재면(110)에 점퍼(200)를 삽입하는 점퍼 삽입공정(S20)과, 상기 회로 패턴면(120)으로부터 상기 탑재면(110)을 향하여 끼워져 돌출된 상기 점퍼(200)의 동선(210)에 칩저항(300)을 임시 고정하는 칩저항 본딩공정(S30)과, 상기 회로 패턴면(120)을 납땜(400) 처리하여 상기 점퍼(200)의 동선(210)에 상기 칩저항(300)을 긴밀히 고정 접속하는 솔더링 공정(S40)으로 이루어진다.In the resistance connection method of the automatic gain regulator according to the present invention, as shown in FIG. 4, the PCB substrate generation step (S10) of molding the circuit pattern surface 120 and the component mounting surface 110 by the upper and lower surfaces thereof, and Jumper insertion step (S20) for inserting the jumper 200 in the component mounting surface 110 of the PCB substrate 100, and the jumper (inserted and protruded toward the mounting surface 110 from the circuit pattern surface 120 ( The chip resistance bonding process (S30) for temporarily fixing the chip resistor 300 to the copper wire 210 of the 200 and the circuit pattern surface 120 by soldering 400 to the copper wire 210 of the jumper 200 It consists of a soldering process (S40) for tightly connecting the chip resistor 300 to the.

더욱 구체적으로, PCB기판 생성공정(S10)은 회로 패턴면(120) 및 부품 탑재면(110)을 상하면으로 나누어 성형하는 단계이고, 점퍼 삽입공정(S20)은 PCB기판(100)의 부품 탑재면(110)에 점퍼(200)를 삽입하는 단계이고, 칩저항 본딩공정(S30)은 회로 패턴면(120)으로부터 상기 탑재면(110)을 향하여 끼워져 돌출된 상기 점퍼(200)의 동선(210)에 칩저항(300)을 임시 고정하는 단계이다.More specifically, the PCB substrate generating process (S10) is a step of forming the circuit pattern surface 120 and the component mounting surface 110 by dividing the upper and lower surfaces, and the jumper insertion process (S20) is a component mounting surface of the PCB substrate 100 The jumper 200 is inserted into the 110, and the chip resistance bonding process S30 is inserted into the mounting surface 110 from the circuit pattern surface 120, and the copper wire 210 of the jumper 200 protrudes. In this step, the chip resistor 300 is temporarily fixed.

즉, 상기 점퍼 삽입공정(S20)은 제5도의 개략 사시도에 도시된 바와 같이 PCB기판(100)의 부품 탑재면(110)에 점퍼(200)를 삽입하여 그 동선(210)이 회로 패턴면(120)을 향하여 돌출될 수 있도록 하고, 상기 솔더링 공정(S40)은 제6도의 개략 저면 사시도에 도시된 바와 같이 회로 패턴면(120)과 점퍼(200)의 동선(210)이 칩저항 본딩공정(S30)에 의하여 임시적으로 고정되어 있는 칩저항(300)을 납땜(400) 처리하여 상호 견고한 고정을 이룰 수 있도록 한다.That is, the jumper insertion step (S20) is a jumper 200 is inserted into the component mounting surface 110 of the PCB substrate 100, as shown in the schematic perspective view of FIG. The soldering process (S40) is a copper wire 210 of the circuit pattern surface 120 and the jumper 200 as shown in the schematic bottom perspective view of FIG. By soldering (400) the chip resistor 300, which is temporarily fixed by S30) to achieve a mutually rigid fixing.

이상에서와 같이 본 발명에 따른 자동 이득 조정기의 저항 접속방법에 의하면, 부품 탑재면에 저항을 삽입하는 대신 점퍼를 끼운 후 회로 패턴면에 칩저항을 탑재하여 솔더링 공정에 의하여 상호 긴밀히 고정시키는 공정으로 이루어져 섀시와의 접촉현상을 방지할 수 있게 되어 정상적인 저항의 기능을 수행할 수 있도록 하므로써 강전계 입력시의 이득 조정을 원할히 할 수 있는 탁월한 효과가 있다.As described above, according to the resistance connection method of the automatic gain adjuster according to the present invention, instead of inserting a resistor into the component mounting surface, a chip resistor is mounted on the circuit pattern surface after inserting a jumper, thereby closely fixing each other by a soldering process. It is possible to prevent the contact with the chassis to perform the function of the normal resistance has an excellent effect to smooth the gain adjustment at the input of the strong field.

Claims (1)

회로 패턴면 및 부품 탑재면을 상면 및 하면으로 각각 나누어 성형하는 PCB기판 생성공정과, 상기 PCB기판의 부품 탑재면에 점퍼를 삽입하는 점퍼 삽입공정과, 상기 회로 패턴면으로부터 상기 부품 탑재면을 향하여 끼워져 돌출된 상기 점퍼의 동선에 칩저항을 임시 고정하는 칩저항 본딩공정과, 상기 회로 패턴면을 납땜 처리하여 상기 점퍼의 동선에 임시 고정된 칩저항을 긴밀히 고정 접속하는 솔더링 공정을 포함하여 이루어지는 것을 특징으로 하는 자동 이득 조정기의 저항 접속방법.PCB substrate generating step of forming and dividing circuit pattern surface and component mounting surface into upper and lower surfaces respectively, jumper insertion step of inserting jumpers into component mounting surface of the PCB board, and from the circuit pattern surface toward the component mounting surface. And a chip resistance bonding step of temporarily fixing the chip resistance to the copper wire of the jumper inserted and protruding, and a soldering step of closely soldering the chip resistance temporarily fixed to the copper wire of the jumper by soldering the circuit pattern surface. Resistive connection method of automatic gain regulator characterized by the above-mentioned.
KR1019970060110A 1997-11-14 1997-11-14 Method of connecting resistors in automatic gain adjuster Expired - Fee Related KR100272998B1 (en)

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KR1019970060110A KR100272998B1 (en) 1997-11-14 1997-11-14 Method of connecting resistors in automatic gain adjuster

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KR19990039867A KR19990039867A (en) 1999-06-05
KR100272998B1 true KR100272998B1 (en) 2001-01-15

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