KR100228534B1 - 음극스퍼터링을 이용한 플라즈마 발생장치 - Google Patents
음극스퍼터링을 이용한 플라즈마 발생장치 Download PDFInfo
- Publication number
- KR100228534B1 KR100228534B1 KR1019930021324A KR930021324A KR100228534B1 KR 100228534 B1 KR100228534 B1 KR 100228534B1 KR 1019930021324 A KR1019930021324 A KR 1019930021324A KR 930021324 A KR930021324 A KR 930021324A KR 100228534 B1 KR100228534 B1 KR 100228534B1
- Authority
- KR
- South Korea
- Prior art keywords
- coil
- plasma
- plasma generating
- target
- generating apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
- H01J37/3211—Antennas, e.g. particular shapes of coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Electrodes Of Semiconductors (AREA)
- Plasma Technology (AREA)
Abstract
Description
Claims (12)
- 플라즈마 챔버(1)와, 전원장치(15, 16)에 접속된 음극전조(10)에 연결된 플라즈마 챔버(1)내의 타겟(17)과, 자장(18, 19)이 상기 타겟(17)으로부터 방출되고 다시 타겟으로 들어가는 마그네트론(5)과, 상기 타겟(17) 표면과 수직으로 확장되고 적어도 타켓(17)의 양측에 형성되는 쉴딩 금속판들(22, 23)로 구성되는 음극스퍼링을 이용한 플라즈마 발생 장치에 있어서, 상기 쉴딩 금속판들(22, 23) 주위를 감고 dc 전압원(25)에 접속된 제1코일(24), 및 상기 제1코일(24)과 소정간격을 두고 설치되고 소정의 ㎒범위내에서 동작되는 고주파 소스(29)에 접속된 제2코일(28)이 제공되어짐을 특징으로 하는 음극 스퍼터링을 이용한 플라즈마 발생 장치.
- 제1항에 있어서, 상기 제1 및 제2 코일(24, 28)간의 거리가 상기 쉴딩 금속판(22, 23)과 절연체(26, 27)에 의해 설정되어 지는 것을 특징으로 하는 플라즈마 발생 장치.
- 제1항에 있어서, 상기 쉴딩 금속판(22, 23)들을 L형으로 구성되며 짧은 축이 플라즈마 볼륨(1)안쪽으로 구부러지고, 전기적으로 절연되며 소정의 전위와 접속됨을 특징으로 하는 플라즈마 발생 장치.
- 제1항에 있어서, 상기 제2 코일(28)은 공동(hollw) 튜브로서 형성되고 냉각 수단이 이 튜브를 통하여 흐르도록 형성함을 특징으로 하는 플라즈마 발생 장치.
- 제2항에 있어서, 상기 절연체들(26, 27)은 제2 코일이 뀌워지도록 그들의 내부 안쪽 측면으로 홈(groove)들이 형성됨을 특징으로 하는 플라즈마 발생 장치.
- 제1항에 있어서, 상기 제2 코일(28)은 타겟(17)과 기판(3)사이의 볼륨쪽으로 전기적 절연체(32, 33)에 의해 차폐됨을 특징으로 하는 플라지마 발생 장치.
- 제1항에 있어서, 상기 제2 코일(28)은 타겟(17)과 기판(3)사이의 볼륨쪽으로 전연을 위해 매달린 비자성 금속 플레이트에 의해 차폐되고, 소정의 전위에 접속됨을 특징으로 하는 플라즈마 발생 장치.
- 제1항에 있어서, 상기 제2 코일(28)의 일측단(36)은 고주파 소스(29)에 접속되고, 그 타측단은 세시 또는 접지에 접속됨을 특징으로 하는 플라즈마 발생 장치.
- 제1항에 있어서, 상기 제2 코일(28)의 양 끝단(35, 36)이 세시 또는 접지에 접속되거나, 코일의 중앙부에 고주파 소스(29)가 접속됨을 특징으로 하는 플라지마 발생 장치.
- 제1항에 있어서, 상기 제2 코일(28)은 반씩 두 개로 나뉘어 그 하나는 시계 방향으로 감기고 다른 하나는 기계 반대 방향으로 감기는 것을 특징으로 하는 플라즈마 발생 장치.
- 제1항에 있어서, 상기 제1 코일에 의해 발생되는 dc 자계가 약 500가우스 정도의 세기를 가짐을 특징으로 하는 플라즈마 발생 장치.
- 제1항에 있어서, 상기 고주파 소스(29)는 13.56㎒의 주파수에 동작됨을 특징으로 하는 플라즈마 발생 장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEP4235064.6 | 1992-10-17 | ||
DE4235064A DE4235064A1 (de) | 1992-10-17 | 1992-10-17 | Vorrichtung zum Erzeugen eines Plasmas mittels Kathodenzerstäubung |
Publications (2)
Publication Number | Publication Date |
---|---|
KR940010868A KR940010868A (ko) | 1994-05-26 |
KR100228534B1 true KR100228534B1 (ko) | 1999-11-01 |
Family
ID=6470713
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019930021324A Expired - Fee Related KR100228534B1 (ko) | 1992-10-17 | 1993-10-14 | 음극스퍼터링을 이용한 플라즈마 발생장치 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5417834A (ko) |
EP (1) | EP0593924B1 (ko) |
JP (1) | JP3516054B2 (ko) |
KR (1) | KR100228534B1 (ko) |
DE (2) | DE4235064A1 (ko) |
Families Citing this family (54)
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US5430355A (en) * | 1993-07-30 | 1995-07-04 | Texas Instruments Incorporated | RF induction plasma source for plasma processing |
JP3146112B2 (ja) * | 1993-12-24 | 2001-03-12 | シャープ株式会社 | プラズマcvd装置 |
JP3419899B2 (ja) * | 1994-07-26 | 2003-06-23 | 東京エレクトロン株式会社 | スパッタリング方法及びスパッタリング装置 |
US5589737A (en) * | 1994-12-06 | 1996-12-31 | Lam Research Corporation | Plasma processor for large workpieces |
US5688357A (en) * | 1995-02-15 | 1997-11-18 | Applied Materials, Inc. | Automatic frequency tuning of an RF power source of an inductively coupled plasma reactor |
DE19510736A1 (de) * | 1995-03-24 | 1996-09-26 | Leybold Ag | Vorrichtung zum Verhindern von Überschlägen in Hochfrequenz-Sputteranlagen |
DE19518374A1 (de) * | 1995-05-23 | 1996-11-28 | Forschungszentrum Juelich Gmbh | Verfahren zur hochfrequenzbetriebenen Magnetron-Glimmentladungsionisation, sowie Ionenquelle |
US6264812B1 (en) | 1995-11-15 | 2001-07-24 | Applied Materials, Inc. | Method and apparatus for generating a plasma |
DE19606375A1 (de) * | 1996-02-21 | 1997-08-28 | Balzers Prozes Systeme Gmbh | Plasmaquelle mit eingekoppelten Whistler- oder Helikonwellen |
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KR100489918B1 (ko) * | 1996-05-09 | 2005-08-04 | 어플라이드 머티어리얼스, 인코포레이티드 | 플라즈마발생및스퍼터링용코일 |
WO1997042648A1 (en) * | 1996-05-09 | 1997-11-13 | Applied Materials, Inc. | Recessed coil for generating a plasma |
US6368469B1 (en) * | 1996-05-09 | 2002-04-09 | Applied Materials, Inc. | Coils for generating a plasma and for sputtering |
US6254746B1 (en) | 1996-05-09 | 2001-07-03 | Applied Materials, Inc. | Recessed coil for generating a plasma |
US6190513B1 (en) | 1997-05-14 | 2001-02-20 | Applied Materials, Inc. | Darkspace shield for improved RF transmission in inductively coupled plasma sources for sputter deposition |
SG54576A1 (en) * | 1996-10-08 | 1998-11-16 | Applied Materials Inc | Improved inductively coupled plasma source |
US6254737B1 (en) * | 1996-10-08 | 2001-07-03 | Applied Materials, Inc. | Active shield for generating a plasma for sputtering |
SG60123A1 (en) * | 1996-10-08 | 1999-02-22 | Applied Materials Inc | Improved darkspace shield for improved rf transmission in inductively coupled plasma sources for sputter deposition |
US6514390B1 (en) * | 1996-10-17 | 2003-02-04 | Applied Materials, Inc. | Method to eliminate coil sputtering in an ICP source |
US6254747B1 (en) * | 1996-12-25 | 2001-07-03 | Nihon Shinku Gijutsu Kabushiki Kaisha | Magnetron sputtering source enclosed by a mirror-finished metallic cover |
EP0978138A1 (en) * | 1997-04-21 | 2000-02-09 | Tokyo Electron Arizona, Inc. | Method and apparatus for ionized sputtering of materials |
US5948215A (en) * | 1997-04-21 | 1999-09-07 | Tokyo Electron Limited | Method and apparatus for ionized sputtering |
US6103070A (en) * | 1997-05-14 | 2000-08-15 | Applied Materials, Inc. | Powered shield source for high density plasma |
US6361661B2 (en) * | 1997-05-16 | 2002-03-26 | Applies Materials, Inc. | Hybrid coil design for ionized deposition |
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US6565717B1 (en) | 1997-09-15 | 2003-05-20 | Applied Materials, Inc. | Apparatus for sputtering ionized material in a medium to high density plasma |
JPH11135438A (ja) * | 1997-10-28 | 1999-05-21 | Nippon Asm Kk | 半導体プラズマ処理装置 |
US6287435B1 (en) | 1998-05-06 | 2001-09-11 | Tokyo Electron Limited | Method and apparatus for ionized physical vapor deposition |
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CN100437886C (zh) * | 2000-07-27 | 2008-11-26 | 特利康控股有限公司 | 磁控管溅射 |
US6494998B1 (en) | 2000-08-30 | 2002-12-17 | Tokyo Electron Limited | Process apparatus and method for improving plasma distribution and performance in an inductively coupled plasma using an internal inductive element |
JP4871442B2 (ja) * | 2000-09-12 | 2012-02-08 | 株式会社アルバック | 緻密な硬質薄膜の形成装置及び硬質薄膜の形成方法 |
US6846396B2 (en) * | 2002-08-08 | 2005-01-25 | Applied Materials, Inc. | Active magnetic shielding |
DE102008022181B4 (de) * | 2008-05-05 | 2019-05-02 | Arianegroup Gmbh | Ionentriebwerk |
DE102008023027B4 (de) * | 2008-05-09 | 2012-06-28 | Von Ardenne Anlagentechnik Gmbh | Elektrodenanordnung für magnetfeldgeführte plasmagestützte Prozesse im Vakuum |
WO2010023878A1 (ja) * | 2008-08-28 | 2010-03-04 | 株式会社イー・エム・ディー | スパッタリング薄膜形成装置 |
JP5344609B2 (ja) * | 2009-09-04 | 2013-11-20 | サンユー電子株式会社 | イオン化スパッタ真空ポンプ |
JP5475506B2 (ja) * | 2010-02-26 | 2014-04-16 | 株式会社イー・エム・ディー | スパッタリング薄膜形成装置 |
KR101151223B1 (ko) * | 2010-06-25 | 2012-06-14 | 한국과학기술원 | 헬리콘 플라즈마 장치 |
KR20180027635A (ko) * | 2011-08-30 | 2018-03-14 | 가부시키가이샤 이엠디 | 스퍼터링 박막 형성 장치 |
TWI553138B (zh) * | 2011-08-30 | 2016-10-11 | Emd Corp | Sputtering film forming device |
DE102015121518A1 (de) * | 2015-12-10 | 2017-06-14 | Technische Universität Clausthal | Verfahren und Anlage zur Herstellung von Beschichtungen auf Substraten sowie ein beschichtetes drahtförmiges Substrat |
TWI713414B (zh) * | 2017-10-23 | 2020-12-11 | 日商國際電氣股份有限公司 | 基板處理裝置、半導體裝置之製造方法及記錄媒體 |
US10867776B2 (en) * | 2018-05-09 | 2020-12-15 | Applied Materials, Inc. | Physical vapor deposition in-chamber electro-magnet |
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WO1986006923A1 (en) * | 1985-05-03 | 1986-11-20 | The Australian National University | Method and apparatus for producing large volume magnetoplasmas |
DE3624480A1 (de) * | 1986-07-19 | 1988-01-28 | Leybold Heraeus Gmbh & Co Kg | Zerstaeubungskatode fuer vakuum-beschichtungsanlagen |
GB8629634D0 (en) * | 1986-12-11 | 1987-01-21 | Dobson C D | Reactive ion & sputter etching |
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WO1992007969A1 (en) * | 1990-10-31 | 1992-05-14 | International Business Machines Corporation | Apparatus for depositing material into high aspect ratio holes |
DE4042298A1 (de) * | 1990-12-31 | 1992-07-02 | Schreiber Hans | Verfahren und vorrichtung zum mischen niedrig- bis hochviskoser medien |
DE4042289A1 (de) * | 1990-12-31 | 1992-07-02 | Leybold Ag | Verfahren und vorrichtung zum reaktiven beschichten eines substrats |
DE4123274C2 (de) * | 1991-07-13 | 1996-12-19 | Leybold Ag | Vorrichtung zum Beschichten von Bauteilen bzw. Formteilen durch Kathodenzerstäubung |
US5279669A (en) * | 1991-12-13 | 1994-01-18 | International Business Machines Corporation | Plasma reactor for processing substrates comprising means for inducing electron cyclotron resonance (ECR) and ion cyclotron resonance (ICR) conditions |
-
1992
- 1992-10-17 DE DE4235064A patent/DE4235064A1/de not_active Withdrawn
-
1993
- 1993-09-23 EP EP93115314A patent/EP0593924B1/de not_active Expired - Lifetime
- 1993-09-23 DE DE59301719T patent/DE59301719D1/de not_active Expired - Lifetime
- 1993-09-24 US US08/126,972 patent/US5417834A/en not_active Expired - Lifetime
- 1993-10-14 KR KR1019930021324A patent/KR100228534B1/ko not_active Expired - Fee Related
- 1993-10-18 JP JP26019793A patent/JP3516054B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE59301719D1 (de) | 1996-04-04 |
JPH06240452A (ja) | 1994-08-30 |
JP3516054B2 (ja) | 2004-04-05 |
KR940010868A (ko) | 1994-05-26 |
EP0593924B1 (de) | 1996-02-28 |
US5417834A (en) | 1995-05-23 |
DE4235064A1 (de) | 1994-04-21 |
EP0593924A1 (de) | 1994-04-27 |
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