JPWO2023079871A1 - - Google Patents

Info

Publication number: JPWO2023079871A1
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP2023557894A

Other languages

Other versions

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2021-11-04

Filing date

2022-09-30

Publication date

2023-05-11

2022-09-30 Application filed filed Critical

2023-05-11 Publication of JPWO2023079871A1 publication Critical patent/JPWO2023079871A1/ja

2025-06-16 Application granted granted Critical

2025-06-16 Publication of JP7693013B2 publication Critical patent/JP7693013B2/en

Status Active legal-status Critical Current

2042-09-30 Anticipated expiration legal-status Critical

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Cleaning Or Drying Semiconductors (AREA)

JP2023557894A 2021-11-04 2022-09-30 Substrate Processing Equipment Active JP7693013B2 (en)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP2021179936		2021-11-04
JP2021179936		2021-11-04
PCT/JP2022/036637 WO2023079871A1 (en)	2021-11-04	2022-09-30	Substrate processing apparatus

Publications (2)

Publication Number	Publication Date
JPWO2023079871A1 true JPWO2023079871A1 (en)	2023-05-11
JP7693013B2 JP7693013B2 (en)	2025-06-16

Family

ID=85400209

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2023557894A Active JP7693013B2 (en)	2021-11-04	2022-09-30	Substrate Processing Equipment

Country Status (5)

Country	Link
JP (1)	JP7693013B2 (en)
KR (1)	KR20240095258A (en)
CN (2)	CN118160073A (en)
TW (1)	TW202331884A (en)
WO (1)	WO2023079871A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH11283899A (en) *	1998-03-27	1999-10-15	Dainippon Screen Mfg Co Ltd	Substrate treatment device
JP2018056151A (en) *	2016-09-26	2018-04-05	株式会社Ｓｃｒｅｅｎホールディングス	Substrate processing apparatus
JP2018129470A (en) *	2017-02-10	2018-08-16	株式会社Ｓｃｒｅｅｎホールディングス	Substrate processing apparatus and substrate processing method
JP2021111703A (en) *	2020-01-10	2021-08-02	株式会社Sumco	Semiconductor wafer cleaning equipment and semiconductor wafer cleaning method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2014207320A (en)	2013-04-12	2014-10-30	東京エレクトロン株式会社	Liquid processing apparatus

2022
- 2022-09-30 CN CN202280071551.XA patent/CN118160073A/en active Pending
- 2022-09-30 KR KR1020247016797A patent/KR20240095258A/en active Pending
- 2022-09-30 TW TW111137167A patent/TW202331884A/en unknown
- 2022-09-30 WO PCT/JP2022/036637 patent/WO2023079871A1/en active Application Filing
- 2022-09-30 CN CN202222602256.2U patent/CN218602389U/en active Active
- 2022-09-30 JP JP2023557894A patent/JP7693013B2/en active Active

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH11283899A (en) *	1998-03-27	1999-10-15	Dainippon Screen Mfg Co Ltd	Substrate treatment device
JP2018056151A (en) *	2016-09-26	2018-04-05	株式会社Ｓｃｒｅｅｎホールディングス	Substrate processing apparatus
JP2018129470A (en) *	2017-02-10	2018-08-16	株式会社Ｓｃｒｅｅｎホールディングス	Substrate processing apparatus and substrate processing method
JP2021111703A (en) *	2020-01-10	2021-08-02	株式会社Sumco	Semiconductor wafer cleaning equipment and semiconductor wafer cleaning method

Also Published As

Publication number	Publication date
CN218602389U (en)	2023-03-10
KR20240095258A (en)	2024-06-25
CN118160073A (en)	2024-06-07
WO2023079871A1 (en)	2023-05-11
JP7693013B2 (en)	2025-06-16
TW202331884A (en)	2023-08-01

Publication	Publication Date	Title
BR112023005462A2 (en)	2023-05-30
BR112023012656A2 (en)	2023-10-03
BR112021014123A2 (en)	2021-12-07
BR112022009896A2 (en)	2023-06-27
BR112023009656A2 (en)	2023-07-11
BR112023008622A2 (en)	2023-10-03
BR112022024743A2 (en)	2023-06-27
BR112022026905A2 (en)	2023-06-27
JPWO2023079872A1 (en)	2023-05-11
BR112023011738A2 (en)	2023-07-04
BR112023004146A2 (en)	2023-06-27
BR112023006729A2 (en)	2023-05-16
BR102021018859A2 (en)	2021-11-30
BR102021015500A2 (en)	2021-11-09
BR112021017747A2 (en)	2023-06-06
JPWO2023079871A1 (en)	2023-05-11
BR112023016292A2 (en)	2023-09-05
BR112023011539A2 (en)	2023-07-04
BR112023011610A2 (en)	2023-07-04
BR112023008976A2 (en)	2023-06-27
BR102021020147A2 (en)	2021-12-28
BR102021018926A2 (en)	2021-11-30
BR102021018167A2 (en)	2021-09-13
BR102021017576A2 (en)	2021-11-30
BR102021016837A2 (en)	2021-11-09

Legal Events

Date	Code	Title	Description
2024-04-22	A621	Written request for application examination	Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240422
2025-01-14	A131	Notification of reasons for refusal	Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20250114
2025-03-11	A521	Request for written amendment filed	Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250311
2025-04-22	TRDD	Decision of grant or rejection written
2025-05-07	A01	Written decision to grant a patent or to grant a registration (utility model)	Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20250507
2025-06-06	A61	First payment of annual fees (during grant procedure)	Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20250604
2025-06-11	R150	Certificate of patent or registration of utility model	Ref document number: 7693013 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150