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JPS6489547A - Board for mounting semiconductor element - Google Patents

Board for mounting semiconductor element

Info

Publication number
JPS6489547A
JPS6489547A JP62246742A JP24674287A JPS6489547A JP S6489547 A JPS6489547 A JP S6489547A JP 62246742 A JP62246742 A JP 62246742A JP 24674287 A JP24674287 A JP 24674287A JP S6489547 A JPS6489547 A JP S6489547A
Authority
JP
Japan
Prior art keywords
semiconductor element
board
element mounting
metallic layer
mounting part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62246742A
Other languages
Japanese (ja)
Other versions
JP2612455B2 (en
Inventor
Naoto Ishida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP62246742A priority Critical patent/JP2612455B2/en
Publication of JPS6489547A publication Critical patent/JPS6489547A/en
Application granted granted Critical
Publication of JP2612455B2 publication Critical patent/JP2612455B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain a semiconductor element mounting board with high heat dissipation at low costs by forming a metallic layer on the surface of a semiconductor element mounting part in a semiconductor element board having a metallic layer on the back side of the resin formed board, arranging a throughhole on the semiconductor element mounting part, and filling a solder in the throughhole. CONSTITUTION:A semiconductor element mounting board 10 is so constructed that a semiconductor element mounting part 12 and a conductive circuit 11 are formed atop the board consisting of an organic resin material 14. In such semiconductor element mounting board 10, a metallic layer 13a as well as a throughhole 15 are formed on the semiconductor element mounting part 12, the metallic layer 13a being in conduction with a metallic layer 13b on the back side of the board, or on the opposite surface of the semiconductor element mounting part 12, while the throughhole 15 being filled with a solder 16.
JP62246742A 1987-09-30 1987-09-30 Substrate for mounting semiconductor elements Expired - Lifetime JP2612455B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62246742A JP2612455B2 (en) 1987-09-30 1987-09-30 Substrate for mounting semiconductor elements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62246742A JP2612455B2 (en) 1987-09-30 1987-09-30 Substrate for mounting semiconductor elements

Publications (2)

Publication Number Publication Date
JPS6489547A true JPS6489547A (en) 1989-04-04
JP2612455B2 JP2612455B2 (en) 1997-05-21

Family

ID=17152975

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62246742A Expired - Lifetime JP2612455B2 (en) 1987-09-30 1987-09-30 Substrate for mounting semiconductor elements

Country Status (1)

Country Link
JP (1) JP2612455B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0497554A (en) * 1990-08-14 1992-03-30 Matsushita Electric Works Ltd High heat dissipation type semiconductor package
US5371029A (en) * 1991-01-22 1994-12-06 National Semiconductor Corporation Process for making a leadless chip resistor capacitor carrier using thick and thin film printing
JPH09186273A (en) * 1995-12-29 1997-07-15 Lg Semicon Co Ltd Semiconductor package and manufacture of the same
JP2002368277A (en) * 2001-06-05 2002-12-20 Rohm Co Ltd Chip semiconductor light-emitting device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60111489A (en) * 1983-11-21 1985-06-17 イビデン株式会社 Board for placing electronic parts and method of producing same
JPS6287478U (en) * 1985-11-20 1987-06-04

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60111489A (en) * 1983-11-21 1985-06-17 イビデン株式会社 Board for placing electronic parts and method of producing same
JPS6287478U (en) * 1985-11-20 1987-06-04

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0497554A (en) * 1990-08-14 1992-03-30 Matsushita Electric Works Ltd High heat dissipation type semiconductor package
US5371029A (en) * 1991-01-22 1994-12-06 National Semiconductor Corporation Process for making a leadless chip resistor capacitor carrier using thick and thin film printing
JPH09186273A (en) * 1995-12-29 1997-07-15 Lg Semicon Co Ltd Semiconductor package and manufacture of the same
JP2002368277A (en) * 2001-06-05 2002-12-20 Rohm Co Ltd Chip semiconductor light-emitting device

Also Published As

Publication number Publication date
JP2612455B2 (en) 1997-05-21

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