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JPS55128837A - Base for mounting semiconductor chip - Google Patents

Base for mounting semiconductor chip

Info

Publication number
JPS55128837A
JPS55128837A JP3648179A JP3648179A JPS55128837A JP S55128837 A JPS55128837 A JP S55128837A JP 3648179 A JP3648179 A JP 3648179A JP 3648179 A JP3648179 A JP 3648179A JP S55128837 A JPS55128837 A JP S55128837A
Authority
JP
Japan
Prior art keywords
chip
plate
base
semiconductor chip
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3648179A
Other languages
Japanese (ja)
Inventor
Fumiyoshi Matsumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP3648179A priority Critical patent/JPS55128837A/en
Publication of JPS55128837A publication Critical patent/JPS55128837A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To reduce the thermal resistance of a semiconductor chip and form the chip adapted to be connected to other circuit by forming a heat dissipating metal plate having a size adapted to carry the chip and bonding the plate at least to one surface of an insulating substrate having substantially the same size as metallized layers formed on both side surfaces thereof.
CONSTITUTION: A base 6 for mounting a semiconductor chip 1 is formed as below. That is, metallized layers are formed on both front and back surfaces of an insulating substrate 3' makde of alumina or the like, and a metal plate 2 made of copper or the like for the purpose of dissipating heat is integrally secured through a conductive film 5 such as solder on one side surface of the substrate 3'. The chip 1 is then secured onto the plate 2 of the base 6, and a heat dissipating plate 4 is mounted similarly on the other side surface of the plate 2 using solder 5. Thus, heat produced on the chip 1 is dissipated to the plate 2 directly under the chip 1 to remarkably reduce the thermal resistance of the chip 1, so that the chip 1 may not be destroyed with transient voltage applied thereto. Since the substrate 3' is further independent of the chip 3, the chip 3 may be readily connected to other circuit.
COPYRIGHT: (C)1980,JPO&Japio
JP3648179A 1979-03-28 1979-03-28 Base for mounting semiconductor chip Pending JPS55128837A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3648179A JPS55128837A (en) 1979-03-28 1979-03-28 Base for mounting semiconductor chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3648179A JPS55128837A (en) 1979-03-28 1979-03-28 Base for mounting semiconductor chip

Publications (1)

Publication Number Publication Date
JPS55128837A true JPS55128837A (en) 1980-10-06

Family

ID=12471002

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3648179A Pending JPS55128837A (en) 1979-03-28 1979-03-28 Base for mounting semiconductor chip

Country Status (1)

Country Link
JP (1) JPS55128837A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57133692A (en) * 1981-02-12 1982-08-18 Hitachi Ltd Integrated circuit device
JPS58102532A (en) * 1981-12-15 1983-06-18 Toshiba Corp Semiconductor device
JPS5946036A (en) * 1982-09-09 1984-03-15 Hitachi Ltd Insulating type semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57133692A (en) * 1981-02-12 1982-08-18 Hitachi Ltd Integrated circuit device
JPS58102532A (en) * 1981-12-15 1983-06-18 Toshiba Corp Semiconductor device
JPS5946036A (en) * 1982-09-09 1984-03-15 Hitachi Ltd Insulating type semiconductor device

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