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JPS6487781A - Partial plating method - Google Patents

Partial plating method

Info

Publication number
JPS6487781A
JPS6487781A JP24367087A JP24367087A JPS6487781A JP S6487781 A JPS6487781 A JP S6487781A JP 24367087 A JP24367087 A JP 24367087A JP 24367087 A JP24367087 A JP 24367087A JP S6487781 A JPS6487781 A JP S6487781A
Authority
JP
Japan
Prior art keywords
insulating material
electroless plating
org
catalyst
resist pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24367087A
Other languages
Japanese (ja)
Inventor
Toru Otaki
Ippei Sawayama
Fumitaka Kan
Hiroshi Tanioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP24367087A priority Critical patent/JPS6487781A/en
Publication of JPS6487781A publication Critical patent/JPS6487781A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

PURPOSE:To enable efficient plating by a simple method when an insulating material is subjected to electroless plating with a Pt family metal, by providing water repellency to the surface of a patterned org. resist film and selectively sticking a catalyst to the insulating material. CONSTITUTION:A resist pattern is formed on an insulating material with an org. resist contg. fine powder of a water repellent material such as polytetrafluoroethylene resin. The resist pattern forming surface of the insulating material is treated with a catalyst for electroless plating and the treated surface is subjected to electroless plating with a Pt family metal. By this method, the reduction of the activity of the catalyst for electroless plating is prevented and water repellency is provided to the org. resist pattern, so a high quality plating film can be smoothly and efficiently formed.
JP24367087A 1987-09-30 1987-09-30 Partial plating method Pending JPS6487781A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24367087A JPS6487781A (en) 1987-09-30 1987-09-30 Partial plating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24367087A JPS6487781A (en) 1987-09-30 1987-09-30 Partial plating method

Publications (1)

Publication Number Publication Date
JPS6487781A true JPS6487781A (en) 1989-03-31

Family

ID=17107244

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24367087A Pending JPS6487781A (en) 1987-09-30 1987-09-30 Partial plating method

Country Status (1)

Country Link
JP (1) JPS6487781A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19606636A1 (en) * 1995-02-22 1996-08-29 Nec Corp Resist compsn. for electroless plating of printed circuit board
JP2015170713A (en) * 2014-03-06 2015-09-28 富士通株式会社 Method for manufacturing wiring structure, wiring structure, and electronic equipment using the same
JP2017208372A (en) * 2016-05-16 2017-11-24 Dic株式会社 Formation method of conductive pattern and manufacturing method of electronic device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19606636A1 (en) * 1995-02-22 1996-08-29 Nec Corp Resist compsn. for electroless plating of printed circuit board
JP2015170713A (en) * 2014-03-06 2015-09-28 富士通株式会社 Method for manufacturing wiring structure, wiring structure, and electronic equipment using the same
JP2017208372A (en) * 2016-05-16 2017-11-24 Dic株式会社 Formation method of conductive pattern and manufacturing method of electronic device

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