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JPS56269A - Plural layer non-electrolytic plating - Google Patents

Plural layer non-electrolytic plating

Info

Publication number
JPS56269A
JPS56269A JP7416679A JP7416679A JPS56269A JP S56269 A JPS56269 A JP S56269A JP 7416679 A JP7416679 A JP 7416679A JP 7416679 A JP7416679 A JP 7416679A JP S56269 A JPS56269 A JP S56269A
Authority
JP
Japan
Prior art keywords
electrolytic
layers
electrolytic plating
plural
layer non
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7416679A
Other languages
Japanese (ja)
Other versions
JPS5727175B2 (en
Inventor
Yoshinori Takakura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP7416679A priority Critical patent/JPS56269A/en
Publication of JPS56269A publication Critical patent/JPS56269A/en
Publication of JPS5727175B2 publication Critical patent/JPS5727175B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)

Abstract

PURPOSE:To easily provide economical electric conductivity to a complex shape waveguide by forming sequentially plural non-electrolytic Ni, Cu, Ag, and Au plating layers in specific thickness on substrate such as metal. CONSTITUTION:A complex shape waveguide substrate 1 which is too difficult for electrolytic plating to be applied is plated with plural, sequential layers of non-electrolytic Ni 2, Cu 3, Ag 4, and Au 5 in specified thickness, so that electric conductivity is given by the Ag 4 and Au 5 layers. This easily improves the electric property of plated layer in a waveguide used, for example, in millimeter wavelength range which, used to be allegedly difficult.
JP7416679A 1979-06-13 1979-06-13 Plural layer non-electrolytic plating Granted JPS56269A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7416679A JPS56269A (en) 1979-06-13 1979-06-13 Plural layer non-electrolytic plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7416679A JPS56269A (en) 1979-06-13 1979-06-13 Plural layer non-electrolytic plating

Publications (2)

Publication Number Publication Date
JPS56269A true JPS56269A (en) 1981-01-06
JPS5727175B2 JPS5727175B2 (en) 1982-06-09

Family

ID=13539290

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7416679A Granted JPS56269A (en) 1979-06-13 1979-06-13 Plural layer non-electrolytic plating

Country Status (1)

Country Link
JP (1) JPS56269A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0569017A2 (en) * 1992-05-07 1993-11-10 Hughes Aircraft Company Molded metallized plastic microwave components and processes for manufacture
US6224983B1 (en) 1989-05-04 2001-05-01 Ad Tech Holdings Limited Deposition of silver layer on nonconducting substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6224983B1 (en) 1989-05-04 2001-05-01 Ad Tech Holdings Limited Deposition of silver layer on nonconducting substrate
EP0569017A2 (en) * 1992-05-07 1993-11-10 Hughes Aircraft Company Molded metallized plastic microwave components and processes for manufacture
EP0569017A3 (en) * 1992-05-07 1995-12-06 Hughes Aircraft Co Molded metallized plastic microwave components and processes for manufacture

Also Published As

Publication number Publication date
JPS5727175B2 (en) 1982-06-09

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