JPS6482563A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS6482563A JPS6482563A JP62241827A JP24182787A JPS6482563A JP S6482563 A JPS6482563 A JP S6482563A JP 62241827 A JP62241827 A JP 62241827A JP 24182787 A JP24182787 A JP 24182787A JP S6482563 A JPS6482563 A JP S6482563A
- Authority
- JP
- Japan
- Prior art keywords
- region
- type
- type region
- electric field
- internal electric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title 1
- 230000005684 electric field Effects 0.000 abstract 4
- 239000012535 impurity Substances 0.000 abstract 4
- 238000009792 diffusion process Methods 0.000 abstract 3
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/411—Insulated-gate bipolar transistors [IGBT]
- H10D12/441—Vertical IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/149—Source or drain regions of field-effect devices
- H10D62/151—Source or drain regions of field-effect devices of IGFETs
Landscapes
- Bipolar Transistors (AREA)
Abstract
PURPOSE:To shorten turn-off time wherein an internal electric field generates in a second region, and the effective diffusion constant of carrier in the second region is controlled, by making the impurity distribution in the second region have a gradient in the direction vertical to the main surface. CONSTITUTION:The concentration distribution of N-type impurity in a first N-type region 2 is minimum on the boundary surface between a first P-type region 1 and the region 2, increases in accordance with the approach to a second N-type region 3, and becomes medium on the boundary between the second N-type region 3 and the region 2. Since the concentration distribution of N-type impurity is made to have a gradient, an internal electric field generates in the first N-type region 2, and the direction of the field is inverse to the gradient of the N-type impurity concentration distribution. That is, the internal electric field acts so as to block the diffusion of positive hole which is injected from the first P-type region 1 and diffuses into the second N-type region 3. Therefore, the diffusion constant of positive hole and the base transit time are controlled by the internal electric field, and the turn-off time of IGBT is shorten.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62241827A JPS6482563A (en) | 1987-09-24 | 1987-09-24 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62241827A JPS6482563A (en) | 1987-09-24 | 1987-09-24 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6482563A true JPS6482563A (en) | 1989-03-28 |
Family
ID=17080084
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62241827A Pending JPS6482563A (en) | 1987-09-24 | 1987-09-24 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6482563A (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02206174A (en) * | 1989-02-06 | 1990-08-15 | Fuji Electric Co Ltd | P-channel insulated-gate bipolar transistor |
JPH02304983A (en) * | 1989-05-19 | 1990-12-18 | Fuji Electric Co Ltd | P-channel insulated gate type bipolar transistor |
US5161809A (en) * | 1990-07-16 | 1992-11-10 | Nippon Leakless Industry Co., Ltd. | Metal gasket |
EP0725446A1 (en) * | 1995-02-02 | 1996-08-07 | Motorola, Inc. | Insulated gate bipolar semiconductor device and method therefor |
US6384431B1 (en) | 1999-10-08 | 2002-05-07 | Denso Corporation | Insulated gate bipolar transistor |
US6465839B2 (en) | 2000-04-07 | 2002-10-15 | Denso Corporation | Semiconductor device having lateral MOSFET (LDMOS) |
JP2005142511A (en) * | 2003-11-10 | 2005-06-02 | Toyota Motor Corp | Semiconductor device and manufacturing method thereof |
JP2005327770A (en) * | 2004-05-12 | 2005-11-24 | Shindengen Electric Mfg Co Ltd | Semiconductor device and manufacturing method therefor |
JP2006173297A (en) * | 2004-12-15 | 2006-06-29 | Denso Corp | IGBT |
US7358127B2 (en) | 2002-02-20 | 2008-04-15 | Fuji Electric Holdings Co., Ltd. | Power semiconductor rectifier having broad buffer structure and method of manufacturing thereof |
US9954053B2 (en) | 2014-09-17 | 2018-04-24 | Fuji Electric Co., Ltd. | Semiconductor device and method of manufacturing semiconductor device |
US11121222B2 (en) | 2004-09-03 | 2021-09-14 | Greenthread, Llc | Semiconductor devices with graded dopant regions |
-
1987
- 1987-09-24 JP JP62241827A patent/JPS6482563A/en active Pending
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02206174A (en) * | 1989-02-06 | 1990-08-15 | Fuji Electric Co Ltd | P-channel insulated-gate bipolar transistor |
JPH02304983A (en) * | 1989-05-19 | 1990-12-18 | Fuji Electric Co Ltd | P-channel insulated gate type bipolar transistor |
US5161809A (en) * | 1990-07-16 | 1992-11-10 | Nippon Leakless Industry Co., Ltd. | Metal gasket |
EP0725446A1 (en) * | 1995-02-02 | 1996-08-07 | Motorola, Inc. | Insulated gate bipolar semiconductor device and method therefor |
US6384431B1 (en) | 1999-10-08 | 2002-05-07 | Denso Corporation | Insulated gate bipolar transistor |
US6573144B2 (en) | 2000-04-07 | 2003-06-03 | Shigeki Takahashi | Method for manufacturing a semiconductor device having lateral MOSFET (LDMOS) |
US6465839B2 (en) | 2000-04-07 | 2002-10-15 | Denso Corporation | Semiconductor device having lateral MOSFET (LDMOS) |
US7358127B2 (en) | 2002-02-20 | 2008-04-15 | Fuji Electric Holdings Co., Ltd. | Power semiconductor rectifier having broad buffer structure and method of manufacturing thereof |
JP2005142511A (en) * | 2003-11-10 | 2005-06-02 | Toyota Motor Corp | Semiconductor device and manufacturing method thereof |
JP2005327770A (en) * | 2004-05-12 | 2005-11-24 | Shindengen Electric Mfg Co Ltd | Semiconductor device and manufacturing method therefor |
US11121222B2 (en) | 2004-09-03 | 2021-09-14 | Greenthread, Llc | Semiconductor devices with graded dopant regions |
US11316014B2 (en) | 2004-09-03 | 2022-04-26 | Greenthread, Llc | Semiconductor devices with graded dopant regions |
JP2006173297A (en) * | 2004-12-15 | 2006-06-29 | Denso Corp | IGBT |
US9954053B2 (en) | 2014-09-17 | 2018-04-24 | Fuji Electric Co., Ltd. | Semiconductor device and method of manufacturing semiconductor device |
US10431650B2 (en) | 2014-09-17 | 2019-10-01 | Fuji Electric Co., Ltd. | Method of manufacturing semiconductor device |
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