JPS6473074A - Sputtering device - Google Patents
Sputtering deviceInfo
- Publication number
- JPS6473074A JPS6473074A JP23130287A JP23130287A JPS6473074A JP S6473074 A JPS6473074 A JP S6473074A JP 23130287 A JP23130287 A JP 23130287A JP 23130287 A JP23130287 A JP 23130287A JP S6473074 A JPS6473074 A JP S6473074A
- Authority
- JP
- Japan
- Prior art keywords
- targets
- vacuum chamber
- chamber
- backing plate
- gate valve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004544 sputter deposition Methods 0.000 title abstract 2
- 238000001755 magnetron sputter deposition Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
PURPOSE:To improve the effective utilization rate of targets and to improve the working rate of a magnetron sputtering device by constituting the targets of plural target pieces and passing the targets through a preliminary chamber which can be evacuated while moving the targets in the device, thereby carrying the targets into and out of the device. CONSTITUTION:A substrate 4 to be treated is imposed on a holder 5 in a vacuum chamber 1. The plural three-dimensional targets 17 are placed on a backing plate 16 having a permanent magnet 8 behind the same and are supplied into the vacuum chamber 1 through the preliminary chamber 22a provided with the evacuation system, a gate valve 23a and a supply part 18 from a stocker 20. While the targets are moved on the surface of the backing plate 16, the targets are passed through a recovering part 19 and a gate valve 23 then through the preliminary chamber 22b and is taken to the outside. Since the targets 17 move during sputtering, the targets are uniformly consumed over the entire surface and the utilization efficiency thereof is improved; in addition, the targets 17 are continuously supplied to and discharged from the vacuum chamber, the working rate of the device is improved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23130287A JPS6473074A (en) | 1987-09-16 | 1987-09-16 | Sputtering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23130287A JPS6473074A (en) | 1987-09-16 | 1987-09-16 | Sputtering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6473074A true JPS6473074A (en) | 1989-03-17 |
Family
ID=16921491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23130287A Pending JPS6473074A (en) | 1987-09-16 | 1987-09-16 | Sputtering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6473074A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5429729A (en) * | 1989-11-29 | 1995-07-04 | Hitachi, Ltd. | Sputtering apparatus, device for exchanging target and method for the same |
| JP2010515830A (en) * | 2007-01-16 | 2010-05-13 | アルセロールミタル・フランス | Method for coating a substrate, device for carrying out the method, and metal supply device for such a device |
-
1987
- 1987-09-16 JP JP23130287A patent/JPS6473074A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5429729A (en) * | 1989-11-29 | 1995-07-04 | Hitachi, Ltd. | Sputtering apparatus, device for exchanging target and method for the same |
| JP2010515830A (en) * | 2007-01-16 | 2010-05-13 | アルセロールミタル・フランス | Method for coating a substrate, device for carrying out the method, and metal supply device for such a device |
| KR101472605B1 (en) * | 2007-01-16 | 2014-12-15 | 아르셀러미탈 프랑스 | Method for coating a substrate, equipment for implementing said method and metal supply device for such equipment |
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