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JPS6471140A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6471140A
JPS6471140A JP62227908A JP22790887A JPS6471140A JP S6471140 A JPS6471140 A JP S6471140A JP 62227908 A JP62227908 A JP 62227908A JP 22790887 A JP22790887 A JP 22790887A JP S6471140 A JPS6471140 A JP S6471140A
Authority
JP
Japan
Prior art keywords
electrodes
electrode group
input
electrode
probing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62227908A
Other languages
Japanese (ja)
Inventor
Kimiya Ichikawa
Masabumi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP62227908A priority Critical patent/JPS6471140A/en
Publication of JPS6471140A publication Critical patent/JPS6471140A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To prevent damage such as flaws, cracks, etc., in input electrodes, and to conduct probing with high yield by respectively connecting auxiliary electrodes to each discrete input electrode in an input electrode group having the number of component electrodes fewer than an output electrode group so as to have the same function as the input electrodes. CONSTITUTION:A first electrode group 21a1-21a3 and a second electrode group 21c11-21c1t composed of the number of electrodes fewer than the electrode group 21a1-21a3 are formed to a semiconductor device. One or two or more of auxiliary electrodes 21c21-21c2t, 21c31-21c3t connected to discrete electrode are shaped respectively at every discrete electrode in the electrode group 21c11-21c1t at that time. Consequently, control signals at every time a plurality of probing are conducted are input by using the electrodes 21c11-21c1t and the electrodes 21c21-21c2t, 21c31-21c3t in order. Accordingly, damage such as flaws, cracks, etc., in the electrodes 21c11-21c31 is prevented, thus performing probing with high yield.
JP62227908A 1987-09-11 1987-09-11 Semiconductor device Pending JPS6471140A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62227908A JPS6471140A (en) 1987-09-11 1987-09-11 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62227908A JPS6471140A (en) 1987-09-11 1987-09-11 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6471140A true JPS6471140A (en) 1989-03-16

Family

ID=16868184

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62227908A Pending JPS6471140A (en) 1987-09-11 1987-09-11 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6471140A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5573847A (en) * 1990-09-14 1996-11-12 Komag, Inc. Magneto-optic disk exhibiting a phase shift between plus and minus twelve degrees and a reflectivity between fifteen and twenty-five percent
WO2008069044A1 (en) * 2006-12-04 2008-06-12 Sharp Kabushiki Kaisha Semiconductor device
WO2010146884A1 (en) * 2009-06-16 2010-12-23 シャープ株式会社 Semiconductor chip and structure for mounting same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5573847A (en) * 1990-09-14 1996-11-12 Komag, Inc. Magneto-optic disk exhibiting a phase shift between plus and minus twelve degrees and a reflectivity between fifteen and twenty-five percent
WO2008069044A1 (en) * 2006-12-04 2008-06-12 Sharp Kabushiki Kaisha Semiconductor device
WO2010146884A1 (en) * 2009-06-16 2010-12-23 シャープ株式会社 Semiconductor chip and structure for mounting same
RU2487435C1 (en) * 2009-06-16 2013-07-10 Шарп Кабусики Кайся Semiconductor chip and its structure for installation
JP5539346B2 (en) * 2009-06-16 2014-07-02 シャープ株式会社 Semiconductor chip and its mounting structure

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