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JPS6464772A - Tacky sheet for polishing - Google Patents

Tacky sheet for polishing

Info

Publication number
JPS6464772A
JPS6464772A JP62218642A JP21864287A JPS6464772A JP S6464772 A JPS6464772 A JP S6464772A JP 62218642 A JP62218642 A JP 62218642A JP 21864287 A JP21864287 A JP 21864287A JP S6464772 A JPS6464772 A JP S6464772A
Authority
JP
Japan
Prior art keywords
polishing
tacky
tackifier
semiconductor wafer
jig
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62218642A
Other languages
Japanese (ja)
Inventor
Hiroaki Narita
Kazuyoshi Ebe
Toshio Minagawa
Takanori Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FSK Corp
Original Assignee
FSK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FSK Corp filed Critical FSK Corp
Priority to JP62218642A priority Critical patent/JPS6464772A/en
Publication of JPS6464772A publication Critical patent/JPS6464772A/en
Pending legal-status Critical Current

Links

Landscapes

  • Adhesive Tapes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE:To fix a polishing object such as a semiconductor wafer, etc., easily and surely to a polishing jig while simply separate a product from the jig after polishing without making a tackifier adhere on the product by forming specific tacky layers on both sides of a base material. CONSTITUTION:Tacky layers 3a, 3b consisting of a tackifier and a radiation polymerization compound are formed on the front and back sides of a base material 2 in a polishing tacky sheet 1. And, a polishing object 5 such as a semiconductor wafer, a lens, a contact lens, etc., is fixed to a polishing jig 6 via this tacky sheet 1. In this condition, the surface of the polishing object 5 is polished with abrasive grains, such as silica, etc. After the end of the polishing operation, the tacky layers 3a, 3b are irradiated with a radiation such as an ultraviolet ray to greatly lower the tackiness of the tacky layers 3a, 3b, and the polished semiconductor wafer can be separated from the tacky layer 3a without adherence of tackifier thereon.
JP62218642A 1987-09-01 1987-09-01 Tacky sheet for polishing Pending JPS6464772A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62218642A JPS6464772A (en) 1987-09-01 1987-09-01 Tacky sheet for polishing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62218642A JPS6464772A (en) 1987-09-01 1987-09-01 Tacky sheet for polishing

Publications (1)

Publication Number Publication Date
JPS6464772A true JPS6464772A (en) 1989-03-10

Family

ID=16723148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62218642A Pending JPS6464772A (en) 1987-09-01 1987-09-01 Tacky sheet for polishing

Country Status (1)

Country Link
JP (1) JPS6464772A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05186746A (en) * 1991-07-18 1993-07-27 Mitsui Toatsu Chem Inc Method for polishing surface of transparent substrate layer of color filter substrate, and self-adhesive tape used therein
EP0709165A1 (en) * 1994-10-28 1996-05-01 Minnesota Mining And Manufacturing Company Compliant lens block and tape
US7105226B2 (en) 1998-08-26 2006-09-12 Lintec Corporation Pressure sensitive adhesive double coated sheet and method of use thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59157162A (en) * 1983-02-26 1984-09-06 Dainippon Printing Co Ltd Pressure-sensitive adhesive composition peelable easily with water
JPS59219376A (en) * 1983-05-27 1984-12-10 Hitachi Hokkai Semiconductor Kk Adhesive tape for wafer
JPS60196956A (en) * 1984-03-12 1985-10-05 Nitto Electric Ind Co Ltd Adhesive metal sheet for fixing semiconductor wafer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59157162A (en) * 1983-02-26 1984-09-06 Dainippon Printing Co Ltd Pressure-sensitive adhesive composition peelable easily with water
JPS59219376A (en) * 1983-05-27 1984-12-10 Hitachi Hokkai Semiconductor Kk Adhesive tape for wafer
JPS60196956A (en) * 1984-03-12 1985-10-05 Nitto Electric Ind Co Ltd Adhesive metal sheet for fixing semiconductor wafer

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05186746A (en) * 1991-07-18 1993-07-27 Mitsui Toatsu Chem Inc Method for polishing surface of transparent substrate layer of color filter substrate, and self-adhesive tape used therein
EP0709165A1 (en) * 1994-10-28 1996-05-01 Minnesota Mining And Manufacturing Company Compliant lens block and tape
US7105226B2 (en) 1998-08-26 2006-09-12 Lintec Corporation Pressure sensitive adhesive double coated sheet and method of use thereof

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