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JPS6464218A - Applicator for resist - Google Patents

Applicator for resist

Info

Publication number
JPS6464218A
JPS6464218A JP62220857A JP22085787A JPS6464218A JP S6464218 A JPS6464218 A JP S6464218A JP 62220857 A JP62220857 A JP 62220857A JP 22085787 A JP22085787 A JP 22085787A JP S6464218 A JPS6464218 A JP S6464218A
Authority
JP
Japan
Prior art keywords
bellows
resist
discharge
operating time
air cylinder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62220857A
Other languages
Japanese (ja)
Other versions
JPH07114183B2 (en
Inventor
Katsushige Ninomiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP62220857A priority Critical patent/JPH07114183B2/en
Publication of JPS6464218A publication Critical patent/JPS6464218A/en
Publication of JPH07114183B2 publication Critical patent/JPH07114183B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)

Abstract

PURPOSE:To adjust the discharge of a resist easily, and to prevent the waste of the resist while improving productive efficiency by providing a means selecting the period of the expansion and contraction of a bellows. CONSTITUTION:A bellows 11 is brought to the state in which the bellows 11 is expanded and contracted several times previously and a resist is introduced into the bellows, and desired discharge is set by a resist discharge setting mechanism 21 in response to a semiconductor wafer to be treated 24. Discharge setting information is converted into the operating time of the bellows 11, the operating time of an air cylinder 18, by a conversion parameter stored in a discharge- operating time arithmetic mechanism 22, and input to an operation control mechanism 23 and the air cylinder 18 is driven, and the resist in the bellows 11 is forcedly fed. Accordingly, the discharge of the resist can be adjusted arbitrarily by the operating time of the air cylinder 18, i.e., the operating time of the bellows.
JP62220857A 1987-09-03 1987-09-03 Resist coating apparatus and resist coating method Expired - Lifetime JPH07114183B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62220857A JPH07114183B2 (en) 1987-09-03 1987-09-03 Resist coating apparatus and resist coating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62220857A JPH07114183B2 (en) 1987-09-03 1987-09-03 Resist coating apparatus and resist coating method

Publications (2)

Publication Number Publication Date
JPS6464218A true JPS6464218A (en) 1989-03-10
JPH07114183B2 JPH07114183B2 (en) 1995-12-06

Family

ID=16757631

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62220857A Expired - Lifetime JPH07114183B2 (en) 1987-09-03 1987-09-03 Resist coating apparatus and resist coating method

Country Status (1)

Country Link
JP (1) JPH07114183B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6183147B1 (en) 1998-06-15 2001-02-06 Tokyo Electron Limited Process solution supply system, substrate processing apparatus employing the system, and intermediate storage mechanism employed in the system
US6281145B1 (en) 1998-06-05 2001-08-28 Tokyo Electron Limited Apparatus and method for applying process solution
US6299938B1 (en) 1998-11-20 2001-10-09 Tokyo Electron Limited Apparatus and method of applying resist

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5461476A (en) * 1977-10-26 1979-05-17 Hitachi Ltd Discharger for viscous fluid
JPS56106451U (en) * 1980-01-16 1981-08-19
JPS6083327A (en) * 1983-10-14 1985-05-11 Hitachi Tokyo Electronics Co Ltd Spinner device
JPS60117726A (en) * 1983-11-30 1985-06-25 Canon Hanbai Kk Pump for supply line of photo-resist
JPH07114183A (en) * 1993-10-15 1995-05-02 Sony Corp Photopolymerizable composition and formation of cured coating film pattern using the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5461476A (en) * 1977-10-26 1979-05-17 Hitachi Ltd Discharger for viscous fluid
JPS56106451U (en) * 1980-01-16 1981-08-19
JPS6083327A (en) * 1983-10-14 1985-05-11 Hitachi Tokyo Electronics Co Ltd Spinner device
JPS60117726A (en) * 1983-11-30 1985-06-25 Canon Hanbai Kk Pump for supply line of photo-resist
JPH07114183A (en) * 1993-10-15 1995-05-02 Sony Corp Photopolymerizable composition and formation of cured coating film pattern using the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6281145B1 (en) 1998-06-05 2001-08-28 Tokyo Electron Limited Apparatus and method for applying process solution
US6821550B2 (en) 1998-06-05 2004-11-23 Tokyo Electron Limited Apparatus and method for applying process solution
US6183147B1 (en) 1998-06-15 2001-02-06 Tokyo Electron Limited Process solution supply system, substrate processing apparatus employing the system, and intermediate storage mechanism employed in the system
US6299938B1 (en) 1998-11-20 2001-10-09 Tokyo Electron Limited Apparatus and method of applying resist

Also Published As

Publication number Publication date
JPH07114183B2 (en) 1995-12-06

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