JPS6452034A - Copper alloy for terminal and connector - Google Patents
Copper alloy for terminal and connectorInfo
- Publication number
- JPS6452034A JPS6452034A JP20591187A JP20591187A JPS6452034A JP S6452034 A JPS6452034 A JP S6452034A JP 20591187 A JP20591187 A JP 20591187A JP 20591187 A JP20591187 A JP 20591187A JP S6452034 A JPS6452034 A JP S6452034A
- Authority
- JP
- Japan
- Prior art keywords
- copper alloy
- connector
- terminal
- terminals
- connectors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title abstract 4
- 239000010949 copper Substances 0.000 abstract 2
- 229910052804 chromium Inorganic materials 0.000 abstract 1
- 238000005260 corrosion Methods 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 abstract 1
- 229910052742 iron Inorganic materials 0.000 abstract 1
- 229910052748 manganese Inorganic materials 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000013508 migration Methods 0.000 abstract 1
- 230000005012 migration Effects 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 229910052725 zinc Inorganic materials 0.000 abstract 1
- 229910052726 zirconium Inorganic materials 0.000 abstract 1
Landscapes
- Conductive Materials (AREA)
Abstract
PURPOSE:To manufacture a copper alloy for terminals and connectors excellent in strength, heat resistance, electric conductivity, etc., by incorporating specific amounts of Mg to Cu. CONSTITUTION:A copper alloy which has a composition consisting of, by weight, 0.5-1.0% Mg and the balance Cu, containing, if necessary, 0.01-0.5% P, and further containing, if necessary, <=1%, in total, of one or >=2 elements selected from Cr, Zr, Si, Co, Ni, Mn, Zn, and Fe is prepared. By this method, the copper alloy excellent in stress corrosion resistance, minimal in migration phenomenon, and useful as material for terminals and connectors can be obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20591187A JPS6452034A (en) | 1987-08-19 | 1987-08-19 | Copper alloy for terminal and connector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20591187A JPS6452034A (en) | 1987-08-19 | 1987-08-19 | Copper alloy for terminal and connector |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6452034A true JPS6452034A (en) | 1989-02-28 |
Family
ID=16514793
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20591187A Pending JPS6452034A (en) | 1987-08-19 | 1987-08-19 | Copper alloy for terminal and connector |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6452034A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02111834A (en) * | 1988-10-20 | 1990-04-24 | Kobe Steel Ltd | High conductive copper alloy for wiring of electrical and electronic parts having excellent migration resistance |
EP2772560A1 (en) * | 2011-10-28 | 2014-09-03 | Mitsubishi Materials Corporation | Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, rolled copper alloy material for electronic equipment, and part for electronic equipment |
US10032536B2 (en) | 2010-05-14 | 2018-07-24 | Mitsubishi Materials Corporation | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device |
US10153063B2 (en) | 2011-11-07 | 2018-12-11 | Mitsubishi Materials Corporation | Copper alloy for electronic devices, method of manufacturing copper alloy for electronic devices, copper alloy plastic working material for electronic devices, and component for electronic devices |
US10458003B2 (en) | 2011-11-14 | 2019-10-29 | Mitsubishi Materials Corporation | Copper alloy and copper alloy forming material |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62130247A (en) * | 1985-11-29 | 1987-06-12 | Furukawa Electric Co Ltd:The | Copper alloy for electronic appliance |
JPS62196344A (en) * | 1986-02-21 | 1987-08-29 | Mitsubishi Shindo Kk | High strength Cu alloy terminal material |
JPS62227051A (en) * | 1986-03-28 | 1987-10-06 | Mitsubishi Shindo Kk | Cu alloy connector for electrical equipment |
JPS62250136A (en) * | 1986-04-23 | 1987-10-31 | Mitsubishi Shindo Kk | Cu alloy terminal |
JPS63203738A (en) * | 1987-02-18 | 1988-08-23 | Mitsubishi Shindo Kk | Cu alloy relay material for electrical equipment |
JPS63307232A (en) * | 1987-06-04 | 1988-12-14 | Sumitomo Metal Mining Co Ltd | Copper alloy |
-
1987
- 1987-08-19 JP JP20591187A patent/JPS6452034A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62130247A (en) * | 1985-11-29 | 1987-06-12 | Furukawa Electric Co Ltd:The | Copper alloy for electronic appliance |
JPS62196344A (en) * | 1986-02-21 | 1987-08-29 | Mitsubishi Shindo Kk | High strength Cu alloy terminal material |
JPS62227051A (en) * | 1986-03-28 | 1987-10-06 | Mitsubishi Shindo Kk | Cu alloy connector for electrical equipment |
JPS62250136A (en) * | 1986-04-23 | 1987-10-31 | Mitsubishi Shindo Kk | Cu alloy terminal |
JPS63203738A (en) * | 1987-02-18 | 1988-08-23 | Mitsubishi Shindo Kk | Cu alloy relay material for electrical equipment |
JPS63307232A (en) * | 1987-06-04 | 1988-12-14 | Sumitomo Metal Mining Co Ltd | Copper alloy |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02111834A (en) * | 1988-10-20 | 1990-04-24 | Kobe Steel Ltd | High conductive copper alloy for wiring of electrical and electronic parts having excellent migration resistance |
US10032536B2 (en) | 2010-05-14 | 2018-07-24 | Mitsubishi Materials Corporation | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device |
US10056165B2 (en) | 2010-05-14 | 2018-08-21 | Mitsubishi Materials Corporation | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device |
EP2772560A1 (en) * | 2011-10-28 | 2014-09-03 | Mitsubishi Materials Corporation | Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, rolled copper alloy material for electronic equipment, and part for electronic equipment |
EP2772560A4 (en) * | 2011-10-28 | 2015-05-20 | Mitsubishi Materials Corp | COPPER ALLOY FOR ELECTRONIC EQUIPMENT, PROCESS FOR PRODUCING COPPER ALLOY FOR ELECTRONIC EQUIPMENT, LAMINATED COPPER ALLOY MATERIAL FOR ELECTRONIC EQUIPMENT, AND PART FOR ELECTRONIC EQUIPMENT |
US9587299B2 (en) | 2011-10-28 | 2017-03-07 | Mitsubishi Materials Corporation | Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, rolled copper alloy material for electronic equipment, and part for electronic equipment |
US10153063B2 (en) | 2011-11-07 | 2018-12-11 | Mitsubishi Materials Corporation | Copper alloy for electronic devices, method of manufacturing copper alloy for electronic devices, copper alloy plastic working material for electronic devices, and component for electronic devices |
US10458003B2 (en) | 2011-11-14 | 2019-10-29 | Mitsubishi Materials Corporation | Copper alloy and copper alloy forming material |
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