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JPS62250136A - Cu alloy terminal - Google Patents

Cu alloy terminal

Info

Publication number
JPS62250136A
JPS62250136A JP9420386A JP9420386A JPS62250136A JP S62250136 A JPS62250136 A JP S62250136A JP 9420386 A JP9420386 A JP 9420386A JP 9420386 A JP9420386 A JP 9420386A JP S62250136 A JPS62250136 A JP S62250136A
Authority
JP
Japan
Prior art keywords
alloy
conductivity
terminal
content
thermal creep
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9420386A
Other languages
Japanese (ja)
Other versions
JPH0379417B2 (en
Inventor
Takeshi Suzuki
竹四 鈴木
Rensei Futatsuka
二塚 錬成
Seiji Kumagai
誠司 熊谷
Toshikazu Ehana
江花 俊和
Manpei Kuwabara
桑原 萬平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Shindoh Co Ltd
Original Assignee
Mitsubishi Shindoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Shindoh Co Ltd filed Critical Mitsubishi Shindoh Co Ltd
Priority to JP9420386A priority Critical patent/JPS62250136A/en
Publication of JPS62250136A publication Critical patent/JPS62250136A/en
Publication of JPH0379417B2 publication Critical patent/JPH0379417B2/ja
Granted legal-status Critical Current

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  • Conductive Materials (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、高強度を有し、かつ導電性および熱クリー
プ特性のすぐれたCu合金で構成された端子およびコネ
クタに関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to terminals and connectors made of a Cu alloy that has high strength and excellent conductivity and thermal creep properties.

〔従来の技術〕[Conventional technology]

一般に、端子やコネクタの製造に、重量%で(以下%は
重M%を示す)、 3n :  1.5〜9%。
Generally, in the manufacture of terminals and connectors, 3n: 1.5 to 9% by weight (hereinafter % indicates weight M%).

P:0.03〜0.35%。P: 0.03-0.35%.

を含有し、残りがCuと不可避不純物からなる組成を有
するCu合金が用いられている。
A Cu alloy is used which has a composition containing Cu and the remainder consisting of Cu and unavoidable impurities.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

しかし、上記の従来Cu合金1J端子およびコネクタは
、高強度をもつものの、導電性および熱クリープ特性が
十分でないために、これを小型化あるいは形状複雑化し
た場合、十分その機能を梵揮しないのが現状である。
However, although the above-mentioned conventional Cu alloy 1J terminals and connectors have high strength, they do not have sufficient conductivity and thermal creep properties, so if they are made smaller or have a more complex shape, they may not fully utilize their functions. is the current situation.

(問題点を解決するための手段) そこで、本発明者等は、上述のような観点から、高強度
のほかに、すぐれた導電性と熱クリープ特性を具備した
端子およびコネクタを開発すべく研究を行なった結果、 M!]  :  0.3〜2%。
(Means for solving the problem) Therefore, from the above-mentioned viewpoint, the present inventors conducted research to develop terminals and connectors that have not only high strength but also excellent conductivity and thermal creep characteristics. As a result, M! ]: 0.3-2%.

p   :  0.001〜0,1%。p: 0.001-0.1%.

Cr  :  9.05〜0.5%。Cr: 9.05-0.5%.

を含1し、残りがQuと不可避不純物からなる組成を有
するCu合金で構成された端子およびコネクタは、高強
度を有し、かつすぐれた導電性と熱。
Terminals and connectors made of a Cu alloy with a composition of 1 and 1 and the rest consisting of Qu and unavoidable impurities have high strength, excellent conductivity and heat resistance.

クリープ特性を具備することり−ら・1−.11を小型
化および形状複m−化しても、すぐれた性能を長期に亘
って発揮するという知見を得たのである。
Kotori et al. 1-. They obtained the knowledge that even if 11 is made smaller and more complex in shape, it still exhibits excellent performance over a long period of time.

この発明は、上記知見にもとづいてなされたものであっ
て、以下に成分組成を上記の通りに限定した゛i耶〕炉
を魂)用する。
This invention has been made based on the above findings, and uses a furnace whose component composition is limited as described above.

(a)MO M’0成分には、Cuの木地に固溶することによって、
主要成分であるCu自体の具備する高導電性を種層うこ
となり、′強゛度と−クリニブ特性を向上させる。作用
があるが、そり含有量が0.3%未満では前記作用に所
望の効果が得られず、一方その含有mが2%を越えると
、導電性が損なわ、れるばかりでなく、合金溶製におけ
る鋳造性も低下するようになることから、その含有はを
0.3〜2%と定め、た。
(a) MO M'0 component contains Cu by solid solution in wood base.
The high conductivity possessed by Cu itself, which is the main component, is used to improve the strength and -clinib properties. However, if the warpage content is less than 0.3%, the desired effect cannot be obtained, while if the content exceeds 2%, not only the conductivity will be impaired, but also the alloy melting process will be affected. Since the castability of the alloy also deteriorates, its content is set at 0.3 to 2%.

(b) P P成分には、脱酸作用があるほか、Mill成分と共存
した状態で、強度およびばね限界値を向上させる作用が
あるが、その含有量が0.001%未満では前記作用に
所望の効果が得られず、一方その含有量が0.1%を越
えると、脆化゛傾向が現われるようになることから、そ
の含fN吊を0.001〜0.1%と定めた。
(b) P In addition to having a deoxidizing effect, the P component also has the effect of improving strength and spring limit values when coexisting with the Mill component, but if its content is less than 0.001%, the above effects will not be achieved. The desired effect cannot be obtained, and if the content exceeds 0.1%, a tendency towards embrittlement appears, so the fN content was set at 0.001 to 0.1%.

(C)Cr Cr成分には、Ml)成分と共存した状態で、強度と熱
クリープ特性を一段と向、Fさせるほか、P成分含有に
よる脆化を抑制する作用があるが、その含有量が0.0
5%未満では前記作用に所望の効果が得られず、一方そ
の含有量が0.5%を越えると、導電性が低下するよう
になると共に、製品表面に線状の析出物が出やすくなる
ことから、その含有量を0.05〜0.5と定めた。
(C) Cr The Cr component has the effect of further improving the strength and thermal creep properties and increasing F when coexisting with the Ml) component, and also has the effect of suppressing embrittlement due to the inclusion of the P component. .0
If the content is less than 5%, the desired effect cannot be obtained, while if the content exceeds 0.5%, the conductivity will decrease and linear precipitates will easily appear on the product surface. Therefore, the content was determined to be 0.05 to 0.5.

〔実施例〕〔Example〕

つぎに、この発明の端子およびコネクタを実施例により
具体的に説明する。
Next, the terminal and connector of the present invention will be specifically explained using examples.

通常の低周波溝型誘導炉を用い、それぞれ第1表に示さ
れるCu合金WISを調製し、半連続鋳造法にて、厚ざ
:150a*X幅:400aw*X艮ざ:1500ae
wの寸法をもった鋳塊に鋳造した後、この鋳塊に、71
0〜760℃の範囲内の所定の圧延開始温度にて熱闘圧
延を施して、厚さ:111の熱延板とし、ついで水冷後
、前記熱延板の上下両面を0.5amづつ面削して、厚
さ:10麿とした状態で、通常の条件で冷間圧延と焼鈍
とを交互に繰り返し行ない、最終仕上圧延率ニア5%に
て厚さ:  0.25麿の冷延板とし、最終的に250
〜400℃の範囲内の所定の8!度に30分間保持の条
件で歪取り焼鈍を施1゛ことによって本発明端子・コネ
クタ素材1〜5、比較端子・コネクタ素材1〜5、およ
び従来端子・コネクタ素材1.2をそれぞれ製造した。
Using a normal low frequency groove induction furnace, Cu alloy WIS shown in Table 1 was prepared, and by semi-continuous casting method, thickness: 150a*X width: 400aw*X width: 1500ae
After casting into an ingot with dimensions of w, 71
Hot-strength rolling was performed at a predetermined rolling start temperature within the range of 0 to 760°C to obtain a hot-rolled plate with a thickness of 111, and then, after cooling with water, both upper and lower sides of the hot-rolled plate were faceted by 0.5 am. Then, with a thickness of 10 mm, cold rolling and annealing were alternately repeated under normal conditions, and a cold rolled plate with a thickness of 0.25 mm was obtained at a final finishing rolling rate of near 5%. finally 250
Predetermined 8 within the range of ~400°C! Terminal/connector materials 1 to 5 of the present invention, comparison terminal/connector materials 1 to 5, and conventional terminal/connector materials 1.2 were each manufactured by subjecting them to strain relief annealing under the condition of holding for 30 minutes at a time.

ついで、この結!$!得られた各種の端子・コネクタ素
材について、張度を評価する目的で、引張強ざとばね限
界値を測定し、また導電性を評価する目的で、導’、t
i率(1△C8%)を測定し、さらに熱クリープ特性を
評価する目的で応用付加加熱後の応力緩和率を測定した
Next, this conclusion! $! For the various terminal/connector materials obtained, the tensile strength and spring limit values were measured for the purpose of evaluating the tension, and the conductivity, t, and
The i ratio (1ΔC8%) was measured, and the stress relaxation rate after applied additional heating was also measured for the purpose of evaluating thermal creep characteristics.

なお、比較端子・コネクタ素材1〜5は、いずれらCI
J合金の構成成分のうちのいずれかの成分含有量(第1
表に※印を付したもの)がこの発明の範囲から外れた組
成をもつCu合金で製造されたしのである。
In addition, comparison terminal/connector materials 1 to 5 are all CI
Content of any of the constituents of J alloy (first
Items marked with * in the table) were manufactured using a Cu alloy with a composition outside the scope of this invention.

また、ばね限界値は、JIS−H3130のモーメント
式試験により測定し、さらに、応力緩和率は、幅:12
.71111+1X長さ:120#lIl+(以下1−
 oとする)の寸法をもった試験片を使用し、この試験
片を長さ:110#IIIX深さ:3mの水平11艮溝
を右りる冶具に前記試験片の中央部が上方に膨出するに
うに彎曲セラ1〜しくこの時の試験片の両端部間の距1
fl[:llOsをし1とする)、この状態で温度=1
50℃に1000時間保持し、加熱後、前記γ、/)貝
から取りはずした状態における前記試験片の両端部間の
距離(以下L2とする)を測定し、81算式: %式%() によって算出することにより求めた。これらの結果を第
1表に示した。
In addition, the spring limit value is measured by the JIS-H3130 moment test, and the stress relaxation rate is width: 12
.. 71111+1X length: 120#lIl+ (hereinafter 1-
Use a test piece with the dimensions of 110 mm (length: 110 #IIIX depth: 3 m) and place it in a jig with the center part of the test piece expanding upward. The distance between both ends of the test piece at this time is 1.
fl[:llOs and set to 1), in this state temperature = 1
It was held at 50 ° C. for 1000 hours, and after heating, the distance between both ends of the test piece (hereinafter referred to as L2) in the state where it was removed from the shellfish was measured, and according to the 81 formula: % formula % () It was obtained by calculation. These results are shown in Table 1.

〔発明の効果〕〔Effect of the invention〕

第1表に示される結果から、本発明端子・コネクタ素材
1〜5は、いずれも従来端子・1ネクタ素材1.2と同
等の高強度を保持した状態で、これより一段とすぐれた
導電性と熱クリープ特性をもつことが明らかである。
From the results shown in Table 1, the terminal/connector materials 1 to 5 of the present invention all maintain the same high strength as the conventional terminal/1 connector material 1.2, but have even better conductivity. It is clear that it has thermal creep properties.

一方、比較端子・コネクタ素441−5に見られるよう
に、これを構成するCu合金のうちのいずれかの成分含
有量でもこの発明の範囲から外れると、強度、導電性、
および熱クリープ特性のうちの少なくともいずれかの性
質が劣ったものになり、これらの性質をすべて具備した
ものはVJられないものであり、さらに比較端子・コネ
クタ素材5では大きな線状の析出物が見られた。
On the other hand, as seen in comparative terminal/connector element 441-5, if the content of any of the components of the Cu alloy constituting this element falls outside the scope of the present invention, the strength, conductivity,
At least one of the thermal creep properties and thermal creep properties is inferior, and a product having all of these properties cannot be subjected to VJ. Furthermore, comparative terminal/connector material 5 has large linear precipitates. It was seen.

また、P含有量がこの発明の範囲から高い外に外れた場
合には、強度、S電性、および熱クリープ特性にすぐれ
ているが、脆化が著しく、曲げ加曲げ加工性の悪いもの
であった。
In addition, if the P content is outside the range of this invention, the product will have excellent strength, S conductivity, and thermal creep properties, but will become extremely brittle and have poor bending workability. there were.

上述のように、この発明の端子およびコネクタは、高強
度を右し、かつすぐれた導電性と熱クリープ特性を具備
したCu合金で構成されているので、これらの小型化お
よび形状複雑化に十分対応することができ、十分満足す
る性能を発揮するばかりでなく、′rS(iiな3n成
分を含有しないCu合金で構成されているので、比較的
コストの安いものとなるなど工業上有用な特性を有する
のである。
As mentioned above, the terminals and connectors of the present invention are made of a Cu alloy that has high strength, excellent conductivity, and thermal creep properties, so they are suitable for miniaturization and complicated shapes. Not only does it exhibit satisfactory performance, but it also has industrially useful properties such as being relatively inexpensive as it is made of a Cu alloy that does not contain the 3n component. It has.

Claims (1)

【特許請求の範囲】 Mg: 0.3〜2%、 P:0.001〜0.1%、 Cr:0.05〜0.5%、 を含有し、残りがCuと不可避不純物からなる組成(以
上重量%)を有するCu合金で構成したことを特徴とす
る高強度を有し、かつ導電性および熱クリープ特性のす
ぐれたCu合金製端子およびコネクタ。
[Claims] A composition containing Mg: 0.3 to 2%, P: 0.001 to 0.1%, Cr: 0.05 to 0.5%, with the remainder consisting of Cu and inevitable impurities. Terminals and connectors made of a Cu alloy having high strength and excellent conductivity and thermal creep properties, characterized in that the terminals and connectors are made of a Cu alloy having a weight percentage of (by weight).
JP9420386A 1986-04-23 1986-04-23 Cu alloy terminal Granted JPS62250136A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9420386A JPS62250136A (en) 1986-04-23 1986-04-23 Cu alloy terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9420386A JPS62250136A (en) 1986-04-23 1986-04-23 Cu alloy terminal

Publications (2)

Publication Number Publication Date
JPS62250136A true JPS62250136A (en) 1987-10-31
JPH0379417B2 JPH0379417B2 (en) 1991-12-18

Family

ID=14103743

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9420386A Granted JPS62250136A (en) 1986-04-23 1986-04-23 Cu alloy terminal

Country Status (1)

Country Link
JP (1) JPS62250136A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6452034A (en) * 1987-08-19 1989-02-28 Mitsubishi Electric Corp Copper alloy for terminal and connector
JP2012251226A (en) * 2011-06-06 2012-12-20 Mitsubishi Materials Corp Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
CN103890205A (en) * 2011-11-14 2014-06-25 三菱综合材料株式会社 Copper alloy and copper alloy forming material
US9587299B2 (en) 2011-10-28 2017-03-07 Mitsubishi Materials Corporation Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, rolled copper alloy material for electronic equipment, and part for electronic equipment
US10032536B2 (en) 2010-05-14 2018-07-24 Mitsubishi Materials Corporation Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
US10153063B2 (en) 2011-11-07 2018-12-11 Mitsubishi Materials Corporation Copper alloy for electronic devices, method of manufacturing copper alloy for electronic devices, copper alloy plastic working material for electronic devices, and component for electronic devices

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62116742A (en) * 1985-11-14 1987-05-28 Furukawa Electric Co Ltd:The Highly flexible conductive copper alloy
JPS62247039A (en) * 1985-12-16 1987-10-28 Furukawa Electric Co Ltd:The Copper alloy for electronic appliance

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62116742A (en) * 1985-11-14 1987-05-28 Furukawa Electric Co Ltd:The Highly flexible conductive copper alloy
JPS62247039A (en) * 1985-12-16 1987-10-28 Furukawa Electric Co Ltd:The Copper alloy for electronic appliance

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6452034A (en) * 1987-08-19 1989-02-28 Mitsubishi Electric Corp Copper alloy for terminal and connector
US10032536B2 (en) 2010-05-14 2018-07-24 Mitsubishi Materials Corporation Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
US10056165B2 (en) 2010-05-14 2018-08-21 Mitsubishi Materials Corporation Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
JP2012251226A (en) * 2011-06-06 2012-12-20 Mitsubishi Materials Corp Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
US9587299B2 (en) 2011-10-28 2017-03-07 Mitsubishi Materials Corporation Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, rolled copper alloy material for electronic equipment, and part for electronic equipment
US10153063B2 (en) 2011-11-07 2018-12-11 Mitsubishi Materials Corporation Copper alloy for electronic devices, method of manufacturing copper alloy for electronic devices, copper alloy plastic working material for electronic devices, and component for electronic devices
CN103890205A (en) * 2011-11-14 2014-06-25 三菱综合材料株式会社 Copper alloy and copper alloy forming material
US10458003B2 (en) 2011-11-14 2019-10-29 Mitsubishi Materials Corporation Copper alloy and copper alloy forming material

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Publication number Publication date
JPH0379417B2 (en) 1991-12-18

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