JPS6341205B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a laminated composite component in the form of a substrate containing a plurality of capacitors.

A multilayer chip capacitor is known in which a large number of dielectric layers and electrode layers are alternately stacked and external terminals are attached to the sides of the stack. However, multilayer chip capacitors merely constitute unit elements of electronic circuits.

In the present invention, the dielectric layer has a sufficient area to mount various electronic elements (resistors, coils, diodes, transistors, etc.), and a plurality of electrode layers are alternately laminated with the dielectric layer in parallel. Furthermore, the dielectric layer is composed of dielectrics made of two or more different materials, and therefore,
It is a composite component that integrates a large number of capacitors with very different capacitance values. Therefore, the composite component of the present invention not only allows these capacitors to be connected arbitrarily to obtain an arbitrary capacitance value, but also
This composite part can also be used as a printed circuit board by applying printed wiring to the front and back sides. In a preferred embodiment, printed wiring and resistors can be printed on both sides of the composite component of the present invention. This allows the necessary circuit to be constructed simply by soldering transistors and the like. The central features of the invention are that dielectric layers of different materials are used, that a plurality of parallel capacitors are formed for each dielectric material, and that the surface of the laminate is used for various components. It can be used as a substrate.

Embodiments of the present invention will be described in detail below with reference to the drawings.

1 to 5 show plan views of each layer of the laminated composite part. As shown in Figure 1, this component has a component in which a plurality of electrode layers 2, 3, 4, 5, 6 made of Al-Pd or Pd are formed on an insulator or dielectric layer 1 by printing, etc. . The upper ends of the electrode layers 2 to 6 are exposed on the upper side of the dielectric layer 1 as lead-out portions T ₁ to T ₅ . Note that these electrode layers 2, 3, 4,
In order to obtain desired capacitance values, electrode areas 5 and 6 are each configured to have a predetermined size. The components shown in FIG. 2 are laminated on top of the layers shown in FIG. For example, by covering the entire surface of the dielectric layer 1,
A dielectric layer 7 having a high dielectric constant such as BaTiO ₃ is formed, and electrode layers 2' to 6' having lead-out portions T1 _' to _T5 ' exposed at the lower side of the laminate are formed on the lower side. are formed to face the electrode layers 2 to 6, respectively. In order to prevent thermal shrinkage distortion, warping, or cracking due to differences in thermal expansion coefficients between dielectric layers of different types, a dielectric layer 7 and a dielectric layer 7 as shown in FIG. A dielectric layer 8 (for example, a mixed sintered body of TiO ₂ and BaTiO ₃ ) having a thermal expansion coefficient intermediate to that of the body layer 13 is formed on the entire surface, and further there are drawn parts T ₆ to T 5 between the drawn parts T ₁ to T ₅ . Electrode layers 9 to 12 with T ₉ are formed. Furthermore, as shown in FIG. 4, a dielectric layer 13 made of, for example, TiO ₂ and having a low dielectric constant is formed over the entire surface. The material of the dielectric layer 13 is different from the material of the dielectric layer 7. This is to prepare a large number of capacitors whose capacitance values vary greatly even if the dimensions of the electrode layers are almost the same. On the upper surface of the dielectric layer 13, there are electrode layers 9' to 1 opposite to the lower electrode layers 9 to 12, respectively.
2' is formed by printing or the like. T ₆ ′ to T ₉ ′ are lead-out portions of the electrode layers 9′ to 12′, and are provided between the lead-out portions T ₁ ′ to T ₅ ′ shown in FIG. Finally, as shown in FIG. 5A, a dielectric layer 14 is applied over the entire surface of the stack. FIG. 5A is an external view showing a completed product of the laminated composite part according to the present invention. FIG. 5B shows a sectional view taken along line AA' in FIG. 5A.

Although the above laminated structure is unique to the present invention, the manufacturing method thereof may be the same as that for conventionally known laminated chip capacitors. For example, each layer may be laminated by printing a paste of each raw material powder in the order shown in FIGS. 1 to 5, and then fired at a high temperature to form an integrated sintered body. Finally, as shown in FIG. 5, external terminals (indicated by the same reference numerals) are baked into the lead-out portions T ₁ to T ₉ and T ₁ ′ to T ₉ ′ exposed on the sides of the laminate. In addition, if necessary, connect terminal T ₁₀ ,
T ₁₁ and T ₁₂ are baked. Note that the electrode layers 1 to 12 and 1' to 12' are selected to have various areas depending on the design purpose.

FIG. 6 is a perspective view showing an application of the laminated composite part of the present invention. In the figure, 20 corresponds to FIGS. 1-2, and 30 corresponds to FIGS. 3-5. The front and back surfaces of the composite component configured as shown in FIGS. 1 to 5 are planes with spaces, and printed wiring 15 is applied thereto as necessary. In this embodiment, resistors R ₁ , R ₂ , R ₃ , and R ₄ made of ruthenium oxide or the like are further printed and baked. Note that not only resistors but also inductance elements, transformer transistors, diodes, etc. can be arranged and fixed on the front and back surfaces. Furthermore, external terminals T ₁ , T _{2 ,} etc. can also be interconnected depending on the circuit design. T ₁ ′ and T ₆ ′ in the figure are examples.

As described above, according to the present invention, it is possible to provide a laminated composite component having a large number of various capacitors with arbitrary capacitance values. For example, a composite component having capacitors with different capacitance values in a wide range from several tens of pF to several thousand pF can be easily constructed by combining different dielectric materials. Since resistors and the like can be placed and printed wiring using the front and back sides of the composite component, a compact integrated circuit can be obtained. Moreover, since all external terminals are exposed on the sides, it is easy to mount and solder this composite component onto a printed circuit board.

Although the embodiment has been described using two types of dielectrics and each layer consisting of a single layer, three or more types of dielectrics may be used, and each capacitor may include multiple layers of dielectrics and electrode layers. It can also be constructed as an alternating laminate of.

[Brief explanation of drawings]

FIG. 1 is a plan view of the lowest layer of the composite component of the present invention, FIG. 2 is a plan view of the second portion, FIG. 3 is a plan view of the third portion, and FIG. 4 is a plan view of the fourth portion. FIG. 5A shows a plan view of the top layer portion. FIG. 5B is a sectional view taken along line A-A' of A. FIG. 6 is a perspective view of a composite component of the present invention, with resistors and printed wiring provided on the surface. The main parts in the diagram are as follows. 1: Bottom dielectric layer, 7: Dielectric layer made of first material, 8: Intermediate dielectric layer, 13: Dielectric layer made of second material, 14: Top dielectric layer, 2, 3, 4,
5, 6: electrode layer (first set), 2', 3', 4', 5',
6': Electrode layer (second set), 9, 10, 11, 12:
Electrode layer (third set), 9', 10', 11', 12':
Electrode layer (4th set).

Claims (1)

[Claims] 1. In a composite component consisting of a mutually laminated body of a dielectric layer and an electrode layer for forming a capacitor, each having a surface area sufficient to mount various electronic elements on the surface of the laminated body, the laminated body has a first dielectric constant. a first parallel capacitor section consisting of an alternating stack of dielectric layers and a plurality of electrode layers; a second dielectric layer having a dielectric constant different from that of the dielectric layer of the first capacitor section; a second parallel capacitor section made of an alternating laminate with electrode layers; and a second parallel capacitor section provided between adjacent dielectric layers of the first and second parallel capacitor sections;
A composite component characterized in that it is constituted by an integral sintered body whose basic structure is a dielectric layer having a thermal expansion coefficient between those of these dielectric layers.