JPS637016B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a composite component, and more particularly to a method for manufacturing a composite electronic component using printing and lamination techniques.

Until now, integration technologies such as ICs and LSIs have been developed and have greatly helped in the compounding and miniaturization of electronic components, but there is still no sufficiently practical technology for inductors, capacitors, and resistors, and Upsizing was inevitable. Micromodules are the only composite parts that can freely have these multiple functions. Micromodule technology involves preparing multiple wafers of a certain thickness and square shape on which various functional elements are mounted and the necessary wiring, and each wafer has connection terminal pins protruding from its four sides. Support rods are inserted into alignment holes or alignment notches and stacked at regular intervals. Due to this structure, the size of the micromodule is not only quite large, but also requires troublesome work such as attaching lead wires between terminal pins. Moreover, even if the wafer itself is configured as designed, deviations from the designed characteristics often occur when modularized due to stray capacitance and resistance due to lead wires.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method for manufacturing an integrated compact composite electronic component having various functional element parts.

The present invention provides a composite electronic component with superior properties without the drawbacks associated with conventional micromodules.

Briefly stated, the present invention provides at least one type (single or plural pieces of each) of a laminate for an inductor, a laminate for a capacitor, and a laminate for a resistor manufactured by a lamination method. , these are superimposed, combined by applying compressive force, and then sintered at a predetermined firing temperature to create an integrated sintered body. This is a method of manufacturing a composite electronic component comprising coating external terminals.

Composite electronic components obtained through such lamination, superimposition, and firing have a solid, monolithic structure as a whole, so they are mechanically and electrically stable, and the process is consistent, making it possible to It is no longer necessary to create functional elements using completely different methods, the connection distance of the circuit is shortened, and the characteristic values as designed can be achieved, and the standardized L, C, and R laminates can be appropriately combined to create a predetermined circuit. Since it can be provided with various functions, it can provide many benefits such as simplifying the process and achieving mass production.

In the present invention, a laminate does not necessarily mean a single inductor, capacitor, or resistor, but generally refers to a large-area laminate having a large number of identical elements, which are cut into individual pieces before or after firing. It should be understood that it is made into a laminate of.

The inductor laminate used in the present invention includes one having a transformer function. The inductor laminate is made of an insulating sheet (including porcelain, dielectric material, and magnetic material, preferably magnetic ferrite) formed by stretching a paste made by bonding insulating powder with a binder such as butyral resin, or a soft magnetic material. It consists of an alternating laminate of an insulating sheet made by printing powder paste or the like, and a coil-forming conductor made by printing a paste of heat-resistant metal powder such as Pd, Ag-Pd, etc. on the surface of the insulating sheet. In this case, the conductor is formed so as to extend from surface to surface of the insulating sheet and to form a coil shape as a whole.

The capacitor laminate used in the present invention is formed by alternately laminating insulating sheets and conductors similar to the inductor laminate. In this case, the conductor is formed to be an electrode having a facing area that sandwiches the insulating sheet. The powder in the insulator sheet is preferably selected from dielectrics (TiO ₂ , BaTiO _{3 ,} etc.).

The laminated body for a resistor used in the present invention is an insulating sheet similar to the laminated body for an inductor (preferably one made mainly of porcelain powder such as alumina, phoristerite, steatite, etc.), and a resistor such as ruthenium oxide. This is a laminate made by printing a paste of body powder.

In addition, since various laminates are piled up and compressed and combined and then fired, large differences in thermal shrinkage between each laminate may cause cracks or distortions, so A sheet having properties (referred to as a damper material) may be interposed. Note that the surface of the composite component obtained by the method of the present invention can be used as a surface equivalent to that of a printed wiring board. For example, printed wiring can be applied to the surface of a composite component to attach active components such as transistors.

Next, examples of the present invention will be described. Although only the case where the insulating sheet is formed by the printing method is illustrated, it should be understood that the case where the insulating sheet is formed by the stretching method is also included. Further, although a wide-area insulating sheet is used, for convenience of explanation, it will be described as being divided into each unit.

1 to 7 show an example of a method for manufacturing the laminate A for an inductor. First, an insulating sheet 1 is printed as shown in FIG. 1, and a conductor 2 is printed thereon as shown in FIG. At this time, the conductor 2 has a lead-out portion exposed at the lower side of the insulating sheet 1. Next, as shown in Fig. 3, an insulating magnetic sheet 3 is printed leaving the end of the conductor 2, and then a conductor 4 to be connected to the conductor 2 is printed as shown in Fig. 4, and then as shown in Fig. 5. An insulating magnetic sheet 5 is printed leaving the end of the conductor 4, and a conductor 6 connected to the conductor 4 is printed on it. At this time, the conductor 6 is exposed on the upper side of the laminate. An insulator sheet 7 is further printed as shown in FIG. The inductor laminate A thus obtained is actually the first
As shown in FIG. 5, the unit elements A (the dotted lines are imaginary lines and indicate the positions that should be the outer periphery of the unit elements) are arranged in an orderly manner vertically and horizontally in the form of a single thick sheet.

8 to 11 show a method of manufacturing a laminate for a capacitor. First, an insulator sheet 8 is printed as shown in FIG. 8, and then an electrode 9 having a lead-out portion on the left side of the upper side is printed. Next, as shown in FIG.
is printed on the entire surface, and furthermore, as shown in FIG. 10, an electrode 11 having a lead-out portion on the lower left side of the laminate is printed so as to overlap the lower electrode 9 with a dielectric sheet 10 interposed therebetween, and further, as shown in FIG. Print the insulator sheet 12 as shown below. The formed laminate B has a shape in which unit laminates B' are arranged vertically and horizontally, as shown in FIG.

12 to 14 show a method of manufacturing a laminate for a resistor. First, as shown in FIG. 12, an insulator sheet 13 is printed, a resistor 14 is printed on that surface, and then a first
The lead conductors 15 and 16 are printed as shown in FIG. 3, and an insulator sheet 17 is printed thereon as shown in FIG. 17. The thus obtained laminate C is a thick sheet in which the unit laminates C' are arranged vertically and horizontally as shown in FIG.

In FIG. 15, it should be noted that the outer dimensions of the unit laminates A', B', and C' of the laminates A, B, and C are the same, and the intervals are also the same.

Next, as shown in FIG.
are properly aligned vertically, and the stacked bodies are superimposed as shown in FIG. 16, and the entire surface is compressed (tightened) from above and below to obtain an integral stacked body. This superimposed body has a cutting line 18 along the outline of the unit laminated body,
It is cut in step 19 and then fired in a firing furnace. Alternatively, it can be simply scored at lines 18 and 19 and folded along the scores after firing in a firing oven to form a stack of units, ie, a composite electronic component.

FIG. 18 is an enlarged perspective view of the composite component thus obtained with external terminals formed thereon. That is, since the lead-out part of the inductor conductor is exposed on the side of the sintered stacked body, a conductive paste (silver,
External terminal 2 by baking a paste of copper powder etc.
0, 21, external terminals 22, 23 are baked on the lead-out part of the capacitor electrode, and resistors 15, 16 are attached.
External terminals 24 and 25 are attached and baked on the drawn-out portion. If a connection is required between these terminals, a conductor for such connection can be applied and baked at the same time as these terminals are applied and baked.

As already mentioned, an integrated circuit can be constructed by using the paste on the surface of the superimposed body in FIG. 18 to fix printed wiring, transistors, and other elements.

As described above, the present invention has been described with reference to a single embodiment, but many variations are possible. First, the number of layers in each of the laminates A, B, and C can be changed arbitrarily. Furthermore, the material of the insulating sheet can be changed in various ways. It is also possible to interpose an intermediate sheet between each of the laminates A, B, and C to avoid bonding between layers and problems of cracking and distortion. Also, laminates A, B, C
It will also be clear that it is not necessary that all sides of the insulating sheet 7, 12, 17 etc. be protected.

With the above configuration, the method of the present invention can provide a composite part with a monolithic structure. If you prepare a number of standardized laminates A, B, and C, you can stack them in an appropriate order and in an appropriate number, compress them, fire them, and form external terminals. A wide variety of composite parts can be manufactured from the laminates. In addition, the benefits already mentioned, such as stiffness and stabilization of properties, can be obtained.

[Brief explanation of the drawing]

1 to 7 are plan views showing the sequential steps in manufacturing the laminate for an inductor used in the present invention, and FIGS. 8 to 11 are plan views showing the sequential steps in manufacturing the laminate for a capacitor used in the present invention. 12 to 14 are plan views showing the sequential steps of manufacturing a laminate for a resistor used in the present invention, and FIG. 15 is a plan view showing the present invention for manufacturing an L, C, R composite part. A perspective view showing the first step of the method,
FIG. 16 is a perspective view showing the second step, FIG. 17 is a perspective view showing the third step, and FIG. 18 is a perspective view of the completed laminated composite part. The main parts in the figure are as follows. A: Laminated body for inductor, B: Laminated body for capacitor, C: Laminated body for resistor, 20, 21, 22, 23, 24: External terminal.

Claims (1)

[Claims] 1. A plurality of unfired insulator sheets and a plurality of conductors of about half a turn are alternately laminated, and at that time, the starting end of the conductor on a specific insulator sheet and the lower side of the conductor are laminated alternately. The termination of the conductor is made through one edge of the particular insulating sheet that is inward from the periphery of the adjacent insulating sheet, and thus the surface of the insulating sheet A laminate A for forming an inductor having at least one coil-shaped conductor extending from the surface to the surface thereof, and a laminate for forming a capacitor comprising a plurality of unfired insulator sheets and electrodes formed on these surfaces. B and/or a resistance forming laminate C consisting of a plurality of unfired insulating sheets and a resistor formed on these surfaces are superimposed on the above laminate A, and a compressive force is applied to integrate them. A method for producing a composite component, the method comprising: forming a composite body into a body, then firing at a predetermined firing temperature, and further forming an external terminal around the superimposed body to electrically connect the conductor to an electrode and/or a resistor. . 2. The method for manufacturing a composite component according to claim 1, wherein the insulators in the laminates A, B, and C are magnetic. 3. The method of manufacturing a composite component according to claim 1, wherein the insulator in the laminate A is a magnetic material, and the insulator in the laminate B is a dielectric. 4. Claim 1, wherein the insulator in the laminate A is formed from a magnetic powder paste, and the insulator in the laminate B is formed from a dielectric powder paste.
Method for manufacturing composite parts described in Section 1. 5. The method for manufacturing a composite component according to any one of claims 1 to 4, wherein the conductor and the electrode are heat resistant.