JPH02142109A - Integrated circuit component - Google Patents

Abstract

PURPOSE:To set the capacitance value of a capacitor at a desired value, to improve the yield of a product and to attain economization by forming additional electrodes onto the laminating type ceramic capacitor through thick-film printing and connecting a regulating capacitor shaped between the additional electrodes or between the additional electrode and an internal electrode in parallel or in series with a built-in capacitor. CONSTITUTION:Additional electrodes 14-18 composed of a conductor film are formed onto the rear of a substrate 1 through thick-film printing. The electrode 14 shapes a regulating capacitor having capacitance DELTAC1 between the electrode 14 and the internal electrode 3a of the outermost section of a built-in capacitor, and sections among the electrodes 15 and 16, 17 and 18 form regulating capacitors having capacitance DELTAC2, DELTAC3 among the opposed sides of the electrodes respectively. Internal electrodes 3a on one hand are connected to an external terminal electrode 12a, while on the other hand internal electrodes 3b are connected to an external terminal electrode 12b, the additional electrode 14 is bonded with the internal electrode 3b through the external terminal electrode 12b and regulating capacitors are formed opposed to the internal electrodes 3a.

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention uses a multilayer ceramic capacitor network or a network of capacitors and inductors as a substrate, and thick film printed wiring is applied to the front and back surfaces of the substrate. The present invention relates to an integrated circuit component in which the ends drawn out from each wiring are connected through external terminals provided on the side surface of a substrate, and particularly relates to a structure for adjusting the capacity of a built-in capacitor.

(Prior art): Figure J44 shows an integrated circuit component using a conventional multilayer ceramic capacitor as a substrate. It will be done. On the back side of the board l, there are a negative conductor 4 and a secondary conductor 5.
, a resistance circuit consisting of an insulating layer 6 made of glass or the like and a resistance layer 7 is formed.

A land 8 is formed on the surface of the substrate l, and a terminal lO of an electronic component 9 such as a transistor or an IC is connected to the land 8 by a kilometer.
It is connected and installed via +11. 5 A plurality of external terminal electrodes 12 are formed on the side surface of the plate 1 to be connected to the built-in capacitor, the electronic component 9, or the conductor 4 or 5 connected to the resistance layer 7. Further, for attachment, predetermined ones of the external terminal electrodes 12 are connected to the conductor pattern 19 on the substrate 13 by half 0311.

(Invention or problem to be solved) In such integrated circuit parts, transistors and IC
The circuit characteristics of the electronic component 9 are obtained by connecting the capacitor built into the board 1 and the resistance circuit on the back side of the board 1 through the external terminal electrode 12. Depending on the IC, the capacitance of the capacitor built into the board l The allowable value for the capacitor network was narrow, and it was sometimes difficult to keep the capacitance values of all the built-in capacitors within the standard.

In other words, in a multilayer ceramic capacitor network, the capacitance value is determined by the thickness between the built-in internal electrodes 3, the number of layers, and the opposing area, or there are manufacturing variations, so there is a deviation of about ±10% depending on the manufacturing lot. was occurring. Are the product characteristics satisfactory within this range?
In order to manufacture a circuit with a high yield, which requires a capacitance value tolerance of, for example, within ±5%, it is necessary to carry out selection, which poses a problem in that the yield of the product is poor.

SUMMARY OF THE INVENTION In view of the problems of the prior art described above, it is an object of the present invention to provide a multilayer chip component having a capacitance value adjustment structure that can improve product yield and achieve economicalization.

(Means for Solving the Problems) In order to achieve the above object, the present invention uses a multilayer ceramic capacitor network or a network of capacitors and an interfacer as a substrate, and performs thick film printed wiring on the front and back surfaces of the substrate, The end drawn out from each wiring,
In integrated circuit components that are connected through external terminals on the side of the board, additional electrodes are provided on the multilayer ceramic capacitor 7 by thick film printing, and formed between multiple additional electrodes or between the additional electrodes and internal electrodes. The feature is that the adjustment capacitor is connected in parallel or in series with the originally built-in capacitor.

(Function) In the structure of the present invention, the capacitance and Q of the capacitor built into the board are set in advance to a low value, and the capacitance value is increased by connecting the capacitor in parallel to compensate for the lack of capacity. It is possible to keep it within the specifications.

(Embodiment) An embodiment of the present invention is shown in FIGS. 1 to 3. Figure 1 is a perspective view of the intermediate product of the board, viewed from the back side.
18 is an additional electrode C made of a conductor film formed by thick film printing on the back surface of the substrate l, and the electrode 14 forms a :A-adjustable capacitor with a capacitance ΔC1 between it and the outermost internal electrode 3a of the built-in capacitor. , electrodes 15 and 16, and between electrodes 17 and 18 form adjustment capacitors having capacitances ΔC2 and ΔC3 between opposite sides of the electrodes, respectively.

FIG. 2 is a sectional view showing an integrated circuit component constructed using a substrate on which such additional electrodes 14 to 18 are formed, and the same reference numerals as in FIG. 4 indicate the same components.

Fig. 3 is a diagram explaining the connection structure between the adjustment capacitor and the built-in capacitor, and 3a (shown with chain lines) and 3b (not shown with solid lines) are the plurality of sheets that constitute the capacitor built into the board l. An additional electrode 14, which is an internal electrode, one electrode 3a is connected to the external terminal electrode 12a, and the other electrode 3b is connected to the external terminal' electrode 12b, forming an adjustment capacitor, is not shown with a solid line and is connected to the external terminal. An internal electrode 3a is connected to the internal electrode 3b via the electrode 12b and is indicated by a chain line.
Opposed to form an adjustment capacitor. This connection structure connects the outermost internal electrode 3a and the additional knee eL pole 1 to a built-in capacitor composed of a plurality of internal electrodes 3a and 3b.
It has a structure in which the A-adjustable capacitor formed between 4 and 4 is connected in parallel. The capacitance value ΔC1 of this adjustment capacitor is determined by the area of the additional electrode 14, the additional electrode 14 and the internal electrode 3a.
It is determined by the distance from the terminal, and its capacity is added to the built-in capacitor. As the capacitance t1-value ΔC1, a value of up to several hundred 9F can be obtained depending on the dielectric constant of the substrate 1. Therefore, by measuring the capacitance value of the built-in capacitor in the intermediate product before the formation of the additional electrode 14 on the substrate l of a certain production lot, and forming an additional electrode of a size that makes up for the shortage, the desired capacity can be achieved. You can get id (f).

In the case of the old feeder electrodes 15 and 16, 17 and 18, the target capacitance value can be obtained by adjusting the length and spacing inside the pair, and these are connected in parallel or series to the corresponding built-in capacitors.

After making these adjustments, an insulating layer 6 made of glass or the like is formed on the capacitor network that has obtained a predetermined capacitance value of 1, and a resistance circuit consisting of a conductor 5 and a resistor 7 is formed thereon. covered by.

In the above embodiments, the substrate l is shown as having only a capacitor network, but the present invention can also be applied to a structure in which an inductor is formed by overlapping a capacitor network, or a structure in which the electronic component 9 is not mounted on the board It can also be applied to

(Effects of the Invention) According to the present invention, since it is possible to set the capacitance value of the capacitor to a desired value, the yield of the product is improved and economicalization is achieved.

[Brief explanation of the drawing]

1 to 3 show an embodiment of the present invention,
Figure 1 is a perspective view showing an example of forming additional electrodes on the back side of the substrate;
3 is a sectional view of an integrated circuit component, FIG. 3 is an explanatory diagram of wiring, and FIG. 4 is a sectional view of a conventional integrated circuit component in an installed state.

Claims (1)

[Claims] A multilayer ceramic capacitor network or a network of capacitors and inductors is used as a substrate, thick film printed wiring is applied to the front and back sides of the substrate, and the ends drawn out from each wiring are connected through external terminals applied to the side of the substrate. In integrated circuit components, additional electrodes are provided on a multilayer ceramic capacitor by thick film printing, and an adjustment capacitor formed between multiple additional electrodes or between an additional electrode and an internal electrode is originally built in. An integrated circuit component characterized by being connected in parallel or series with a capacitor.