JPS63131160U - - Google Patents
Info
- Publication number
- JPS63131160U JPS63131160U JP2251087U JP2251087U JPS63131160U JP S63131160 U JPS63131160 U JP S63131160U JP 2251087 U JP2251087 U JP 2251087U JP 2251087 U JP2251087 U JP 2251087U JP S63131160 U JPS63131160 U JP S63131160U
- Authority
- JP
- Japan
- Prior art keywords
- dividing line
- divided
- board
- dividing
- solder resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の分割基板を示す断面図、第２
図は同分割基板を示す平面図である。
１……基板本体、２……銅箔パターン、３……
ソルダーレジスト、４……分割線。
Figure 1 is a sectional view showing the divided substrate of the present invention, Figure 2
The figure is a plan view showing the divided board. 1... Board body, 2... Copper foil pattern, 3...
Solder resist, 4... parting line.
Claims (1)
該分割線に沿つて分割して使用してなる分割基板
において、前記分割線上のソルダーレジストを剥
離したことを特徴とする分割基板。 Forming dividing lines such as perforations on the printed circuit board,
A divided board that is used by being divided along the dividing line, wherein the solder resist on the dividing line is peeled off.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2251087U JPS63131160U (en) | 1987-02-17 | 1987-02-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2251087U JPS63131160U (en) | 1987-02-17 | 1987-02-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63131160U true JPS63131160U (en) | 1988-08-26 |
Family
ID=30819963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2251087U Pending JPS63131160U (en) | 1987-02-17 | 1987-02-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63131160U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015195272A (en) * | 2014-03-31 | 2015-11-05 | 新光電気工業株式会社 | Semiconductor device and semiconductor manufacturing method |
-
1987
- 1987-02-17 JP JP2251087U patent/JPS63131160U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015195272A (en) * | 2014-03-31 | 2015-11-05 | 新光電気工業株式会社 | Semiconductor device and semiconductor manufacturing method |
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