JPS61127671U - - Google Patents
Info
- Publication number
- JPS61127671U JPS61127671U JP1108085U JP1108085U JPS61127671U JP S61127671 U JPS61127671 U JP S61127671U JP 1108085 U JP1108085 U JP 1108085U JP 1108085 U JP1108085 U JP 1108085U JP S61127671 U JPS61127671 U JP S61127671U
- Authority
- JP
- Japan
- Prior art keywords
- resist layer
- circuit pattern
- solder resist
- excluding
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
第１図は本考案の一実施例を示す断面図、第２
図は従来例を示す断面図である。
１……スルーホール基板、２……ソルダレジス
ト層、３……スルーホール、３ａ……部品挿通用
スルーホール、３ｂ……ランド、Ｐ……回路パタ
ーン。
Fig. 1 is a sectional view showing one embodiment of the present invention;
The figure is a sectional view showing a conventional example. 1...Through-hole board, 2...Solder resist layer, 3...Through hole, 3a...Through hole for inserting components, 3b...Land, P...Circuit pattern.
Claims (1)
通用のスルーホールその他の半田付けの必要な部
分を除く回路パターンの形成された表面部分にの
みソルダレジスト層を形成して成ることを特徴と
する印刷配線板。 Printing characterized by forming a solder resist layer only on the surface portion of an insulating substrate on which a circuit pattern is formed, excluding through-holes for inserting components and other areas requiring soldering. wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1108085U JPS61127671U (en) | 1985-01-29 | 1985-01-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1108085U JPS61127671U (en) | 1985-01-29 | 1985-01-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61127671U true JPS61127671U (en) | 1986-08-11 |
Family
ID=30492862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1108085U Pending JPS61127671U (en) | 1985-01-29 | 1985-01-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61127671U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2010052942A1 (en) * | 2008-11-06 | 2012-04-05 | イビデン株式会社 | Electronic component built-in wiring board and manufacturing method thereof |
-
1985
- 1985-01-29 JP JP1108085U patent/JPS61127671U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2010052942A1 (en) * | 2008-11-06 | 2012-04-05 | イビデン株式会社 | Electronic component built-in wiring board and manufacturing method thereof |