JPS62227796A - Integrated circuit card - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an IC card with a built-in IC chip.

Conventional technology Identification cards used to identify individuals have traditionally used magnetic or optical reading methods, but they lacked permanence and could be changed, making the security of identification difficult. was low. For this reason, recently, IC cards with built-in IC chips have been attracting attention as identification cards.

These IC cards have a larger storage capacity than conventional magnetic stripe cards, so they can be used to store the history of deposits and savings in bankbooks, and for credit cards to store transaction history such as shopping and medical care. In this regard, various application systems such as the storage of personal health data are being considered.

Conventionally, this type of card has been used as shown in Figures 3 to 5.
An IC having almost the same thickness as the card base material 1 is inserted into a hole 3 that is the size of the IC module 2 by using an end mill or a press mold into a 660 μm thick card base material 1 that is laminated or pressed in sheet form. Insert module 2, about 1ooμmw made of PVC
Layer 4.5 oversheets on the front and back, 1oo to 1
It was heated to 60° C., pressurized at 16 to 35 9/cra, and laminated for several tens of minutes.

As shown in FIG. 3, the IC module 2 is usually formed by forming a connecting terminal part 7 on the first surface of an insulating substrate 6 using metal foil or plating, and die-bonding an IC chip 8 on the opposite surface of the insulating substrate 6. It is connected to the wiring pattern on the insulating substrate θ by bonding with the gold wire 9, inner lead bonding with the fill carrier, etc., and a part of the wiring pattern is electrically connected to the connection terminal portion 7, and further, the spacer 10 is connected to the wiring pattern on the insulating substrate θ.
is pasted on the insulating substrate 6 so as to surround the IC chip 8, and the I
The C chip 8 was made by coating it with a sealant 11 such as epoxy resin.

Problems to be Solved by the Invention IC cards are required to have a thickness of 0.76ffff, which is the same as conventional magnetic stripe cards, as is being considered for standardization by the International Organization for Standardization (I5O). The thickness and structure of the module 2 are subject to significant restrictions.

For example, the IC chip 8 must not be destroyed or the IC card structure must be destroyed or damaged even if various external stresses are applied, so the ISO standard is 86mm'1.64WM.
The bending strength in the longitudinal direction of an IC card of the size is that the bending strength in the longitudinal direction is 250 times at a speed of 30 times/minute, and the bending strength is 100 times in total by repeating front and back. It is suggested that the same test be done.

In order to protect the IC chip 8 from these external stresses, the IC module 2 containing the IC chip 8 must be
Attempts have been made to make the IC chip 8 as hard as possible to reduce the influence of external stress on the IC chip 8.

However, if the IC module 2 is hardened, stresses such as bending and twisting will be concentrated on the corners of the IC module 2 embedded in the card base material 1, resulting in cracks, discoloration, etc. on the surface oversheet 4. This may reduce the aesthetic and commercial value of the IC card.

Means for Solving the Problem In order to solve this problem, the present invention provides a structure in which a hard IC module containing an IC chip inserted into a hole in a card base material has approximately the same thickness as the card base material, and The corner portion that contacts the oversheet is rounded.

Function: With this configuration, even if stress such as bending or twisting is applied to the IC card, it is possible to protect the built-in IC chip because it is a hard IC module, and because the corners of the hard IC module are rounded. , the stress on the contacting oversheet is dispersed and no cracking or colorlessness occurs.

Embodiment Hereinafter, one embodiment of the present invention will be explained based on the accompanying drawings.

In FIG. 1, the IC module 12 is formed by etching a copper foil and then plating with nickel or gold to form a connecting terminal portion 14 on the first surface of an insulating substrate 13 with a thickness of 100 μm. After bonding the IC chip 16 to the second surface, use the gold wire 16 to bond the IC chip 16 to the second surface.
5 is connected to the wiring pattern on the insulating substrate 13, and a part of the wiring pattern is connected to the insulating substrate 13.
The IC chip 16 is electrically connected to the upper connection terminal portion 14, a spacer 17 is pasted on the insulating substrate 13 so as to surround the IC chip 15, and the IC chip 16 is coated with a sealant 18 such as an epoxy resin.
It is made to have a thickness of about 560 μm. R19 can be provided on the front and back corners of the IC module 12 created in this manner by polishing, router processing, or the like.

Next, the above IC module 12 is inserted into the hole 21 provided in the card base material 20 made of the polyvinyl chloride sheet No. 56011771, and the oversheet 22 and the card base are inserted so that the surface of the connection terminal section 14 of the IC module 12 is exposed. Oversheet 23 on the opposite side of material 2o
Laminate and create an IC card.

In the IC card created in this way, even if external stress such as bending or twisting is applied, it is dispersed by the support cuff 5fR19, which concentrates on the corners of the IC module 12, so that the stress on the oversheet 22°23 is dispersed. Even small sheets prevent cracks and discoloration of the oversheet 22 and 23 from occurring.

Effects of the Invention As described above, according to the present invention, since the corners of the hard IC module embedded in the card paste material are rounded, the oversheet is less likely to be damaged and the aesthetic commercial value can be increased. , it is a dog of industrial utility value.

[Brief explanation of drawings]

FIG. 1 is a sectional view of an IC card according to an embodiment of the present invention, FIG. 2 is an exploded perspective view showing the structure of the IC card, and FIGS. 3, 4, and 5 are conventional IC cards. It is a sectional view showing a card, and a high plan view and a 9-side plan view. 12...IC module nope 13...Insulating board, 14...Connection terminal section, 15...
IC chip, 19...R, 20...card paste material, 21...hole, 22.23...
...Oversheet. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 1 Figure 2 Figure 3 Figure 4 Figure 5

Claims (1)

[Claims] An IC card characterized in that a hard IC module containing an IC chip inserted into a hole in a card base material has approximately the same thickness as the card base material, and has a radius at a corner portion in contact with an oversheet.