JPS62227797A - Integrated circuit card - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an IC card with a built-in IC chip.

Conventional technology Identification cards used to identify individuals have traditionally used magnetic or optical reading methods, but they lacked permanence and could be changed, making the security of identification difficult. was low. For this reason, recently, IC cards with built-in IC chips have been attracting attention as identification cards.

This type of IC card has a larger storage capacity than conventional magnetic stripe cards.

A variety of application systems are being considered for banking, such as storing the history of cash deposits and savings in a passbook, for credit, for storing transaction history such as shopping, and for medical, for storing personal health data.

Conventionally, this type of card has been used as shown in Figures 3 to 6.
A hole 3 of the size of the IC module 2 is made to have a thickness almost the same as that of the card base material 1 by using an end mill or a press mold into a 650 μm thick card base material 1 that has been laminated or pressed or in the form of a sheet. Insert the IC module 2 with the

Oversheets 4.6 made of polyvinyl chloride and having a thickness of about 100 μm were stacked on the front and back sides, heated to 100 to 160° C., pressurized at 16 to 3 tskg/d, and laminated for several minutes.

As shown in FIG. 3, the IC module 2 typically has a connecting terminal portion 7 formed on the first surface of an insulating substrate 6 using metal foil or plating, and an IC chip 8 is die-bonded on the opposite surface of the insulating substrate 6. It is connected to the wiring pattern on the insulating substrate 6 by bonding with the gold wire 9, inner lead bonding with the fill carrier, etc., and part of the wiring pattern 5 is electrically connected to the connection terminal part 7, and further, the spacer 10 is connected to the wiring pattern on the insulating substrate 6.
The '1z IC chip 8 was pasted on an insulating substrate 6 so as to be surrounded, and the IC chip 8 was coated with a sealant 11 such as epoxy resin.

Problems to be Solved by the Invention IC cards are required to have a thickness of 0.76 ttm, which is the same as conventional magnetic stripe cards, as is being considered for standardization by the International Organization for Standardization (I5O).

The thickness and structure of the IC module 2 to be buried are subject to significant restrictions. For example, the IC chip 8 must not be destroyed or the IC card structure must be destroyed or damaged even if various external stresses are applied.

According to the ISO standard, the bending strength in the longitudinal direction of an IC card with a size of 86 wti x 54 machining is 20
It is proposed that the shoes should be worn 260 times at a speed of 30 times per minute, with one front and back being repeated for a total of 1,000 times, and that the same test as the longitudinal direction be conducted with 10 questions on the short sides.

In order to protect the IC chip 8 from these external stresses, the IC module 2 containing the ICC chip must be
Attempts have been made to make the IC chip 8 as hard as possible to reduce the influence of external stress on the IC chip 8.

However, if the IC module 2 is made hard.

Stresses such as bending and twisting will be concentrated on the corners of the IC module 2 embedded in the card base material 1, causing cracks and discoloration on the surface oversheet 4. There was a decrease in value.

Means for Solving the Problem In order to solve this problem, the present invention provides a structure in which a hard IC module containing an IC chip inserted into a hole in a card base material has approximately the same thickness as the card base material. Moreover, the corner portion that contacts the oversheet is tapered.

Function: With this configuration, even if stress such as bending or twisting is applied to the IC card, it is possible to protect the built-in IC chip because it is a hard IC module, and since there are tapers in the corners of the hard IC module, Stress on the contacting oversheet is dispersed, preventing cracking and discoloration.

Embodiment One embodiment of the present invention will be described below with reference to the accompanying drawings.

In FIGS. 1 and 2, the IC module 12 is 100
The connection terminal portion 14 is formed on the first surface of the μm thick insulating substrate 13 by etching copper foil and then nickel plating or gold plating, and the IC chip 16 is formed on the opposite second surface of the insulating substrate 13. After die bonding, use the gold wire 16 to attach the IC.
The bonding pad portion of the chip 15 is connected to the wiring pattern on the insulating substrate 13, and a part of the wiring pattern is electrically connected to the connecting terminal portion 14 on the insulating substrate 13.

Further, a spacer 17 is pasted on the insulating substrate 13 so as to surround the IC chip 16, and the IC chip 16 is coated with a sealant 18 such as epoxy resin to have a thickness of about 660 μm. The front and back corners around the IC module 12 created in this way are polished.

■Taper 19 can be provided by cutting, router processing, etc.

Next, the above IC module 12 (made of a 5,560 μm polyvinyl chloride sheet) is inserted into the hole 21 provided in the card base material 2o, and the oversheet 22 and the card are inserted so that the surface of the connection terminal portion 14 of the IC module 12 is exposed. An IC card is produced by laminating an oversheet 23 on the opposite side of the base material 20.

The IC card created in this way.

Even if external stress such as bending or twisting is applied, the stress concentrated on the corner of the IC module 12 is reduced by taper 1.
9, the stress on the oversheet material 22.23 is also reduced, and cracks and discoloration of the oversheet material 22.23 do not occur.

Effects of the Invention As described above, according to the present invention, since the corner portions of the hard IC module embedded in the card base material are tapered, the oversheet is less likely to be damaged and the aesthetic commercial value can be increased. , has great industrial utility value.

[Brief explanation of drawings]

FIG. 1 is a sectional view of an IC card according to an embodiment of the present invention, FIG. 2 is an exploded perspective view showing the structure of the IC card, and FIGS. 3, 4, and 6 are conventional IC cards. FIG. 2 is a sectional view and a true plan view showing the card. 12...IC module, 13...Insulating substrate, 14...Connection terminal section, 16...
・IC chip 519...Taper, 20...
... Card paste material, 21 ... Hole, 22, 2a
...Oversheet. Name of agent: Patent attorney Toshio Nakao and 1 other person 1st
Figure 1211] Figure 3 Figure 4 Figure 5

Claims (1)

[Claims] An IC card characterized in that a hard IC module containing an IC chip to be inserted into a hole in a card base material has approximately the same thickness as the card base material, and has a taper at a corner portion in contact with an oversheet.