JPS62165539U - - Google Patents
Info
- Publication number
- JPS62165539U JPS62165539U JP5414886U JP5414886U JPS62165539U JP S62165539 U JPS62165539 U JP S62165539U JP 5414886 U JP5414886 U JP 5414886U JP 5414886 U JP5414886 U JP 5414886U JP S62165539 U JPS62165539 U JP S62165539U
- Authority
- JP
- Japan
- Prior art keywords
- container
- wiring board
- thick film
- film wiring
- brazed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Measuring Fluid Pressure (AREA)
Description
第１図は本考案の一実施例のろう付けされる各
部材を示す断面図、第２図は半導体圧力センサの
一部破砕断面図、第３図は第１図におけるスペー
サの平面図、第４図は第１図の各部材のろう付け
後の断面図である。
２１：容器底板、５：厚膜配線基板、５１：厚
膜配線、８：スペーサ、８１：溝、９：はんだ板
。
FIG. 1 is a sectional view showing each member to be brazed according to an embodiment of the present invention, FIG. 2 is a partially exploded sectional view of a semiconductor pressure sensor, and FIG. 3 is a plan view of the spacer in FIG. FIG. 4 is a sectional view of each member shown in FIG. 1 after being brazed. 21: Container bottom plate, 5: Thick film wiring board, 51: Thick film wiring, 8: Spacer, 81: Groove, 9: Solder plate.
Claims (1)
収容され、半導体チツプが容器を貫通する導圧管
に、厚膜配線基板が容器底板にそれぞれろう付け
されるスペーサを介して支持されるものにおいて
、厚膜配線基板と容器の間に介在するスペーサの
少なくとも配線基板とのろう付け面に溝を有する
ことを特徴とする半導体圧力センサ。 A pressure-sensitive semiconductor chip and a thick film wiring board are housed in a container, and the semiconductor chip is supported by a pressure impulse pipe passing through the container, and the thick film wiring board is supported by a spacer that is brazed to the bottom plate of the container. A semiconductor pressure sensor characterized in that a spacer interposed between a thick film wiring board and a container has a groove at least on a surface to be brazed with the wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5414886U JPS62165539U (en) | 1986-04-10 | 1986-04-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5414886U JPS62165539U (en) | 1986-04-10 | 1986-04-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62165539U true JPS62165539U (en) | 1987-10-21 |
Family
ID=30880875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5414886U Pending JPS62165539U (en) | 1986-04-10 | 1986-04-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62165539U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5666375A (en) * | 1979-10-31 | 1981-06-04 | Kazuichi Kikuchi | Brazing structure of annular body |
| JPS58146827A (en) * | 1982-02-25 | 1983-09-01 | Fuji Electric Co Ltd | Semiconductor pressure sensor |
| JPS60219609A (en) * | 1984-04-13 | 1985-11-02 | Sharp Corp | Manufacture of magnetic method |
-
1986
- 1986-04-10 JP JP5414886U patent/JPS62165539U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5666375A (en) * | 1979-10-31 | 1981-06-04 | Kazuichi Kikuchi | Brazing structure of annular body |
| JPS58146827A (en) * | 1982-02-25 | 1983-09-01 | Fuji Electric Co Ltd | Semiconductor pressure sensor |
| JPS60219609A (en) * | 1984-04-13 | 1985-11-02 | Sharp Corp | Manufacture of magnetic method |
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