JPH0268446U - - Google Patents
Info
- Publication number
- JPH0268446U JPH0268446U JP14864588U JP14864588U JPH0268446U JP H0268446 U JPH0268446 U JP H0268446U JP 14864588 U JP14864588 U JP 14864588U JP 14864588 U JP14864588 U JP 14864588U JP H0268446 U JPH0268446 U JP H0268446U
- Authority
- JP
- Japan
- Prior art keywords
- package
- mounted semiconductor
- mount
- packaging
- making
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の平面図、第２図は
第１図の側面図、第３図は第１図の背面図、第４
図は本考案の他の実施例の平面図、第５図は第４
図の側面図である。
１……はんだ付け用の電極、２……セラミツク
ケース、３……セラミツクキヤツプ、４……半導
体素子、５……リード。
Figure 1 is a plan view of one embodiment of the present invention, Figure 2 is a side view of Figure 1, Figure 3 is a rear view of Figure 1, and Figure 4 is a rear view of Figure 1.
The figure is a plan view of another embodiment of the present invention, and FIG.
FIG. 1... Electrode for soldering, 2... Ceramic case, 3... Ceramic cap, 4... Semiconductor element, 5... Lead.
Claims (1)
同一外部電極をパツケージの表面および裏面の両
面に配列し、これにより、該パツケージのいずれ
の面に対しても実装可能にしたことを特徴とする
表面実装型半導体装置のパツケージ。 In the packaging of surface-mounted semiconductor devices,
1. A package for a surface-mounted semiconductor device, characterized in that the same external electrodes are arranged on both the front and back surfaces of the package, thereby making it possible to mount the package on either surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14864588U JPH0268446U (en) | 1988-11-14 | 1988-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14864588U JPH0268446U (en) | 1988-11-14 | 1988-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0268446U true JPH0268446U (en) | 1990-05-24 |
Family
ID=31420152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14864588U Pending JPH0268446U (en) | 1988-11-14 | 1988-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0268446U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08213504A (en) * | 1995-02-03 | 1996-08-20 | Matsushita Electron Corp | Resin-sealed semiconductor device and manufacture thereof |
-
1988
- 1988-11-14 JP JP14864588U patent/JPH0268446U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08213504A (en) * | 1995-02-03 | 1996-08-20 | Matsushita Electron Corp | Resin-sealed semiconductor device and manufacture thereof |