JPS62147358U

JPS62147358U -

Info

Publication number: JPS62147358U
Application number: JP3593686U
Authority: JP
Priority date: 1986-03-12
Filing date: 1986-03-12
Publication date: 1987-09-17
Also published as: JPH0319229Y2

Description

[Brief explanation of the drawing]

第１図乃至第９図は本考案の実施例を示すもの
であり、第１図は半導体装置を樹脂封止した状態
を示すリードフレームの一部切欠平面図、第２図
は該リードフレームの要部を示す一部切欠拡大底
面図、第３図はタイバー部分の切断加工に関する
説明図、第４図は第３図の―線における拡大
断面図、第５図乃至第８図はいずれも切断用肉薄
部の他の形状例を示す断面図、第９図はタイバー
カツト面の一例を示す一部切欠拡大斜視図である
。第１０図乃至第１６図は従来例を示すものであ
り、第１０図は従来のリードフレームを用いた場
合における半導体装置の樹脂封止作用の説明図、
第１１図はその樹脂封止状態を示すリードフレー
ムの一部切欠平面図、第１２図乃至第１４図はそ
のタイバー部分及びダム内の樹脂成形体の切断加
工に関する説明図、第１５図はそのリード部分の
折曲加工に関する説明図、第１６図はその製品を
示す正面図である。１２……リードフレーム、１３……縁枠、１４
……縁枠、１５……タイバー、１６……リード、
１８……ダム、１９……切断用肉薄部、１９ａ…
…条溝。 1 to 9 show embodiments of the present invention. FIG. 1 is a partially cutaway plan view of a lead frame showing a state in which a semiconductor device is sealed with resin, and FIG. 2 is a partially cutaway plan view of the lead frame. A partially cutaway enlarged bottom view showing the main parts, Fig. 3 is an explanatory diagram of the cutting process of the tie bar part, Fig. 4 is an enlarged sectional view taken along the - line in Fig. 3, and Figs. 5 to 8 are all cutaways. FIG. 9 is a cross-sectional view showing another example of the shape of the thin portion, and FIG. 9 is a partially cutaway enlarged perspective view showing an example of the tie bar cut surface. 10 to 16 show conventional examples, and FIG. 10 is an explanatory diagram of the resin sealing effect of a semiconductor device when a conventional lead frame is used;
Fig. 11 is a partially cutaway plan view of the lead frame showing its resin-sealed state, Figs. 12 to 14 are explanatory diagrams of the tie bar portion and cutting of the resin molded body in the dam, and Fig. 15 is the same. FIG. 16, which is an explanatory diagram regarding the bending process of the lead portion, is a front view showing the product. 12...Lead frame, 13...Edge frame, 14
...Edge frame, 15...Tie bar, 16...Lead,
18...Dam, 19...Thin section for cutting, 19a...
…Groove.

Claims

[Scope of Claim for Utility Model Registration] (1) In a lead frame for resin sealing of electronic components, which is provided with a plurality of required leads, a frame for supporting the leads, and a tie bar connecting at least the above-mentioned leads. A lead frame for resin sealing of an electronic component, characterized in that a thin cutting portion having a desired shape along the cutting direction is formed at a predetermined cutting location of the tie bar. (2) Claim No. 1 of Utility Model Registration in which one end edge of a tie bar with a thin section for cutting is extended to a position close to a cavity in a mold for resin sealing of electronic components. Lead frame for resin sealing of electronic components listed in ). (3) Claims (1) or 2) where the thin cutting portion formed on the tie bar is formed from a groove of a required depth that communicates between the two end positions of the tie bar in the cutting direction. A lead frame for resin sealing of electronic components as described in (2).