JPS6155384U - - Google Patents
Info
- Publication number
- JPS6155384U JPS6155384U JP1984139414U JP13941484U JPS6155384U JP S6155384 U JPS6155384 U JP S6155384U JP 1984139414 U JP1984139414 U JP 1984139414U JP 13941484 U JP13941484 U JP 13941484U JP S6155384 U JPS6155384 U JP S6155384U
- Authority
- JP
- Japan
- Prior art keywords
- film
- circuit
- shield
- printing
- optical link
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Optical Communication System (AREA)
Description
第１図は本考案の光リンクパツケージの一実施
例を示す断面図、第２図及び第３図は従来の光リ
ンクパツケージの一例を示す図であり、第２図は
斜視図、第３図は断面図である。
２１，２２…窓、３１，３２，１７…金属製キ
ヤツプ、４１，４２…外部リード、５…発光素子
または受光素子、６…ＩＣチツプ、７…コンデン
サ、１８，２１，２２…メタライズ膜、１９，２
３…絶縁層、２４…アルミナ基板、２５…接続ス
ルーホール。
FIG. 1 is a sectional view showing an embodiment of the optical link package of the present invention, FIGS. 2 and 3 are views showing an example of a conventional optical link package, FIG. 2 is a perspective view, and FIG. is a sectional view. 2 1 , 2 2 ... window, 3 1 , 3 2 , 17 ... metal cap, 4 1 , 4 2 ... external lead, 5 ... light emitting element or light receiving element, 6 ... IC chip, 7 ... capacitor, 18, 21, 22...metalized film, 19,2
3... Insulating layer, 24... Alumina substrate, 25... Connection through hole.
Claims (1)
または受光素子、ＩＣチツプコンデンサ、窓付金
属シールドキヤツプ等を取り付けた組立回路膜と
、送信回路または受信回路を電磁シールドするシ
ールド膜と、印刷による導通部を有する絶縁膜と
の多層膜を有し、前記導通部を介して外部リード
を取り出すようにしたことを特徴とする光リンク
パツケージ。 (2) 組立回路膜とシールド膜は印刷後焼成され
たタングステンまたはモリブデンを主としたメタ
ライズ膜であつて、一部にニツケル、銀、金等の
めつき膜を有し、絶縁膜はセラミツクス基板とほ
ぼ同質のアルミナ等から成ることを特徴とする実
用新案登録請求の範囲第１項記載の光リンクパツ
ケージ。[Claims for Utility Model Registration] (1) At least an assembled circuit film in which a light emitting element or a light receiving element, an IC chip capacitor, a metal shield cap with a window, etc. are mounted on a ceramic substrate, and a shield that electromagnetically shields a transmitting circuit or a receiving circuit. 1. An optical link package comprising a multilayer film including a film and an insulating film having a conductive part formed by printing, and an external lead is taken out through the conductive part. (2) The assembly circuit film and shield film are metallized films mainly made of tungsten or molybdenum that are fired after printing, and have a plating film of nickel, silver, gold, etc. in part, and the insulating film is a ceramic substrate. The optical link package according to claim 1, which is made of alumina or the like having substantially the same quality as the above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984139414U JPS6155384U (en) | 1984-09-17 | 1984-09-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984139414U JPS6155384U (en) | 1984-09-17 | 1984-09-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6155384U true JPS6155384U (en) | 1986-04-14 |
Family
ID=30697792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984139414U Pending JPS6155384U (en) | 1984-09-17 | 1984-09-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6155384U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH028301A (en) * | 1988-06-24 | 1990-01-11 | Sanyo Special Steel Co Ltd | Manufacture of metal material by powder canning process |
| JP2017199792A (en) * | 2016-04-27 | 2017-11-02 | オムロン株式会社 | Electronic device and manufacturing method therefor |
| JP2020047939A (en) * | 2019-12-05 | 2020-03-26 | オムロン株式会社 | Electronic apparatus and method for manufacturing the same |
-
1984
- 1984-09-17 JP JP1984139414U patent/JPS6155384U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH028301A (en) * | 1988-06-24 | 1990-01-11 | Sanyo Special Steel Co Ltd | Manufacture of metal material by powder canning process |
| JP2017199792A (en) * | 2016-04-27 | 2017-11-02 | オムロン株式会社 | Electronic device and manufacturing method therefor |
| WO2017187865A1 (en) * | 2016-04-27 | 2017-11-02 | オムロン株式会社 | Electronic device and method for producing same |
| US10375867B2 (en) | 2016-04-27 | 2019-08-06 | Omron Corporation | Electronic device and method for producing same |
| JP2020047939A (en) * | 2019-12-05 | 2020-03-26 | オムロン株式会社 | Electronic apparatus and method for manufacturing the same |
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