[go: up one dir, main page]

JPS6136854B2 - - Google Patents

Info

Publication number
JPS6136854B2
JPS6136854B2 JP6955280A JP6955280A JPS6136854B2 JP S6136854 B2 JPS6136854 B2 JP S6136854B2 JP 6955280 A JP6955280 A JP 6955280A JP 6955280 A JP6955280 A JP 6955280A JP S6136854 B2 JPS6136854 B2 JP S6136854B2
Authority
JP
Japan
Prior art keywords
epoxy resin
resin composition
weight
component
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP6955280A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56166225A (en
Inventor
Akio Nishikawa
Masanori Segawa
Hiroshi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6955280A priority Critical patent/JPS56166225A/ja
Publication of JPS56166225A publication Critical patent/JPS56166225A/ja
Publication of JPS6136854B2 publication Critical patent/JPS6136854B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Organic Insulating Materials (AREA)
JP6955280A 1980-05-27 1980-05-27 Epoxy resin composition Granted JPS56166225A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6955280A JPS56166225A (en) 1980-05-27 1980-05-27 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6955280A JPS56166225A (en) 1980-05-27 1980-05-27 Epoxy resin composition

Publications (2)

Publication Number Publication Date
JPS56166225A JPS56166225A (en) 1981-12-21
JPS6136854B2 true JPS6136854B2 (fr) 1986-08-20

Family

ID=13406000

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6955280A Granted JPS56166225A (en) 1980-05-27 1980-05-27 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS56166225A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03119849U (fr) * 1990-03-19 1991-12-10

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61260658A (ja) * 1985-05-15 1986-11-18 Toshiba Chem Corp 樹脂封止型半導体装置
JPS63128018A (ja) * 1986-11-19 1988-05-31 Sunstar Giken Kk エポキシ樹脂組成物
JPS63207816A (ja) * 1987-02-23 1988-08-29 Ube Ind Ltd 半導体封止用エポキシ樹脂組成物
US4963640A (en) * 1989-02-13 1990-10-16 Mobay Corporation Process and compositions for production of moldings
US4937366A (en) * 1989-02-13 1990-06-26 Mobay Corporation Process and compositions for production of moldings
JPH03236105A (ja) * 1990-02-09 1991-10-22 Kazuyoshi Uematsu 導電体の絶縁，防錆用シーリング剤

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03119849U (fr) * 1990-03-19 1991-12-10

Also Published As

Publication number Publication date
JPS56166225A (en) 1981-12-21

Similar Documents

Publication Publication Date Title
JPS6136854B2 (fr)
JP2000248151A (ja) 半導体封止用樹脂組成物及び樹脂封止型半導体装置
JP2003213081A (ja) エポキシ樹脂組成物および半導体装置
EP0761709A2 (fr) 1-Imidazolylméthyl-2-naphtols comme catalyseurs de durcissement de résines époxydes
JPH07242799A (ja) 半導体封止用エポキシ樹脂組成物
JP2560469B2 (ja) エポキシ系樹脂組成物
JPS621609B2 (fr)
JPH06256364A (ja) 有機ケイ素化合物、その製法及びそれを含有する樹脂組成物
JPH1160898A (ja) 半導体封止用樹脂組成物及び樹脂封止型半導体装置
JPH06102750B2 (ja) エポキシ樹脂組成物及びその硬化物
JPH0249329B2 (fr)
JP3450260B2 (ja) エポキシ樹脂組成物およびコイル注型物
JPH0528243B2 (fr)
JPS6159328B2 (fr)
JP2689805B2 (ja) 半導体封止用エポキシ樹脂組成物
JPS6248686B2 (fr)
JPS6138729B2 (fr)
JPH10176035A (ja) 半導体封止用エポキシ樹脂組成物
JP2001114983A (ja) エポキシ樹脂組成物およびエポキシ樹脂の製造方法
JP2882274B2 (ja) 半導体封止用エポキシ樹脂組成物及び半導体装置
JPS6136844B2 (fr)
JPH0967426A (ja) エポキシ樹脂組成物およびそれから得られる注型絶縁物
JP2002037983A (ja) エポキシ樹脂組成物
JPS62260820A (ja) 重合用組成物
JPS60226522A (ja) エポキシ樹脂組成物