[go: up one dir, main page]

JPS6115751U - Mounting structure of IC on circuit board - Google Patents

Mounting structure of IC on circuit board

Info

Publication number
JPS6115751U
JPS6115751U JP10088884U JP10088884U JPS6115751U JP S6115751 U JPS6115751 U JP S6115751U JP 10088884 U JP10088884 U JP 10088884U JP 10088884 U JP10088884 U JP 10088884U JP S6115751 U JPS6115751 U JP S6115751U
Authority
JP
Japan
Prior art keywords
circuit board
mounting structure
mounting
utility
model registration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10088884U
Other languages
Japanese (ja)
Inventor
太介 上原
Original Assignee
セイコーエプソン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by セイコーエプソン株式会社 filed Critical セイコーエプソン株式会社
Priority to JP10088884U priority Critical patent/JPS6115751U/en
Publication of JPS6115751U publication Critical patent/JPS6115751U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の二枚基板の場合のＩＣ実装例の図、（断
面図）第２図は今回考案した実装例の図、第３図■は今
回考案した実装例であり、ＩＣどおしがずれている図（
断面図）、第３図■は第３図■の実装例を平面的に見た
図であり、ＩＣがずれていることを表わす図である。 １・・・上ＩＣ． ２・・・下ＩＣ． ３・・・上基板
、４・・・下基板、５・・・コンデンサ・トランジスタ
等の電気素子、６・・・コネクタ、７・・・モールド材
。Figure 1 is a diagram of an IC mounting example in the case of a conventional two-board board, (cross-sectional view) Figure 2 is a diagram of a mounting example devised this time, and Figure 3 ■ is a diagram of a mounting example devised this time. Figures that are misaligned (
3 is a plan view of the mounting example shown in FIG. 3, and shows that the IC is misaligned. 1...Upper IC. 2...Lower IC. 3... Upper substrate, 4... Lower substrate, 5... Electric elements such as capacitors and transistors, 6... Connector, 7... Mold material.

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）少なくとも２枚以上の基板を有し、少なくとも２
枚以上の回路基板にＩＣが実装されている、電子携帯機
器に於で、対向する回路基板の向かい合う回路基板面に
ＩＣを実装したことを特徴とするＩＣの回路基板への実
装構造。(1) It has at least two or more substrates, and at least two
A structure for mounting an IC on a circuit board in an electronic portable device in which the IC is mounted on more than one circuit board, characterized in that the IC is mounted on opposing circuit board surfaces of opposing circuit boards. （２） ＩＣを実装する場合、向かい合う’ＩＣ （
それぞ′れのＩＣは、モールド材でおおわれているもの
，゜とする。 ）どおし、少なくとも厚い所を逃げた様に配置及び実装
した実用新案登録請求の範囲第１項記載のＩＣ実装構造
。(2) When mounting an IC, the facing 'IC (
It is assumed that each IC is covered with a molding material. ) The IC mounting structure according to claim 1 of the utility model registration claim, which is arranged and mounted so that at least the thickest parts are avoided.
JP10088884U 1984-07-04 1984-07-04 Mounting structure of IC on circuit board Pending JPS6115751U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10088884U JPS6115751U (en) 1984-07-04 1984-07-04 Mounting structure of IC on circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10088884U JPS6115751U (en) 1984-07-04 1984-07-04 Mounting structure of IC on circuit board

Publications (1)

Publication Number Publication Date
JPS6115751U true JPS6115751U (en) 1986-01-29

Family

ID=30660329

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10088884U Pending JPS6115751U (en) 1984-07-04 1984-07-04 Mounting structure of IC on circuit board

Country Status (1)

Country Link
JP (1) JPS6115751U (en)

Similar Documents

Publication Publication Date Title
JPS58188684U (en) electronic display device
JPS6115751U (en) Mounting structure of IC on circuit board
JPS58138365U (en) Dummy pattern for reinforcing flexible printed circuits
JPS5958949U (en) Card with built-in IC, etc.
JPS6138973U (en) hybrid integrated circuit
JPS5872871U (en) electronic components
JPS58111969U (en) Mounting structure on flexible electric circuit board
JPS59107173U (en) Printed circuit board connection structure
JPS585375U (en) High frequency circuit board structure
JPS59121856U (en) Printed board
JPS59143093U (en) Electronic component mounting board
JPS6134771U (en) printed wiring board
JPS6078158U (en) hybrid integrated circuit board
JPS6076058U (en) Electronic component mounting structure
JPS596887U (en) Mounting board for electronic equipment, etc.
JPS6071192U (en) Printed board
JPS606231U (en) Structure of hybrid integrated circuit
JPS6045494U (en) Hybrid integrated circuit device
JPS60192475U (en) printed wiring board equipment
JPS5983044U (en) hybrid integrated circuit
JPS60149172U (en) flexible circuit board
JPS611996U (en) Buzzer structure of small electronic equipment
JPS5918442U (en) Hybrid integrated circuit device
JPS60125766U (en) Mold exterior chip parts
JPS5970365U (en) printed wiring board