JPS59107173U - Printed circuit board connection structure - Google Patents
Printed circuit board connection structureInfo
- Publication number
- JPS59107173U JPS59107173U JP21883U JP21883U JPS59107173U JP S59107173 U JPS59107173 U JP S59107173U JP 21883 U JP21883 U JP 21883U JP 21883 U JP21883 U JP 21883U JP S59107173 U JPS59107173 U JP S59107173U
- Authority
- JP
- Japan
- Prior art keywords
- connection structure
- printed circuit
- circuit board
- opening
- board connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来例に係る各基板の対向状態を示す外観斜視
図、第２図はその接続構造図、第３図ａ。
ｂはそれぞれ異なる実施例に係るフレキシブル基 板の
外観斜視図、第４図は一実施例に係る接続構造図である
。
１・・・ベース基板、１ａ・・・導体層、１ｂ・・・接
続部、２・・・フレキシブル基板、２ａ・・・接続部、
２ｂ・・・開口部、３・・・溶融半田。FIG. 1 is an external perspective view showing the facing state of each board according to a conventional example, FIG. 2 is a connection structure diagram thereof, and FIG. 3a. 4b is an external perspective view of a flexible board according to a different embodiment, and FIG. 4 is a connection structure diagram according to one embodiment. DESCRIPTION OF SYMBOLS 1... Base board, 1a... Conductor layer, 1b... Connection part, 2... Flexible board, 2a... Connection part,
2b...opening, 3...molten solder.
Claims (2)
同志を熔融半田で固定することにより接続するようにじ
た接続構造において、一方の基板の接続部に開口部を形
成し、この開口部により熔融半田への加熱力を助長し、
且つこの開口部に熔融半田を浸入させて、互いの接続部
同志を固定したことを特徴とするプリント基板の接続構
造。(1) In a connection structure in which two substrates are connected by fixing the connecting portions provided on their respective conductor layers with molten solder, an opening is formed in the connecting portion of one substrate, This opening facilitates heating power to the molten solder,
A printed circuit board connection structure characterized in that the connection parts are fixed to each other by infiltrating molten solder into the opening.
口部を形成した基板はフレキシブル基板であることを特
徴とするプリント基板の接続構造。(2) Utility Model Registration The printed circuit board connection structure according to claim (1), characterized in that the board on which the opening is formed is a flexible board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21883U JPS59107173U (en) | 1983-01-07 | 1983-01-07 | Printed circuit board connection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21883U JPS59107173U (en) | 1983-01-07 | 1983-01-07 | Printed circuit board connection structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59107173U true JPS59107173U (en) | 1984-07-19 |
Family
ID=30131966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21883U Pending JPS59107173U (en) | 1983-01-07 | 1983-01-07 | Printed circuit board connection structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59107173U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0379472U (en) * | 1989-12-06 | 1991-08-13 | ||
| JP2017130093A (en) * | 2016-01-21 | 2017-07-27 | Smk株式会社 | Connector tail, touch sensor, and electronic apparatus |
-
1983
- 1983-01-07 JP JP21883U patent/JPS59107173U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0379472U (en) * | 1989-12-06 | 1991-08-13 | ||
| JP2017130093A (en) * | 2016-01-21 | 2017-07-27 | Smk株式会社 | Connector tail, touch sensor, and electronic apparatus |
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