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JPS61136547U - - Google Patents

Info

Publication number
JPS61136547U
JPS61136547U JP1985018027U JP1802785U JPS61136547U JP S61136547 U JPS61136547 U JP S61136547U JP 1985018027 U JP1985018027 U JP 1985018027U JP 1802785 U JP1802785 U JP 1802785U JP S61136547 U JPS61136547 U JP S61136547U
Authority
JP
Japan
Prior art keywords
metal piece
insulating
metal
integrated circuit
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985018027U
Other languages
Japanese (ja)
Other versions
JPH0333071Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985018027U priority Critical patent/JPH0333071Y2/ja
Publication of JPS61136547U publication Critical patent/JPS61136547U/ja
Application granted granted Critical
Publication of JPH0333071Y2 publication Critical patent/JPH0333071Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の実施例に係わる混成集積回路
の一部を示す断面図、第２図は第１図の放熱体の
断面図、第３図及び第４図は従来の混成集積回路
の一部を夫々示す断面図である。 １……半導体チツプ、４……金属基板、５……
セラミツク基板、６……導体、９……保護樹脂、
１２……放熱体、１２ａ，１２ｃ……第１及び第
２の金属片、１２ｂ……絶縁分離層。 FIG. 1 is a cross-sectional view showing a part of a hybrid integrated circuit according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of the heat sink shown in FIG. 1, and FIGS. 3 and 4 are cross-sectional views of a conventional hybrid integrated circuit. FIG. 1... Semiconductor chip, 4... Metal substrate, 5...
Ceramic substrate, 6... Conductor, 9... Protective resin,
12... Heat sink, 12a, 12c... First and second metal pieces, 12b... Insulating separation layer.

Claims (1)

【実用新案登録請求の範囲】 (1) 金属基板と、 第１の金属片と絶縁分離層と第２の金属片とか
ら成る積層体であり、前記絶縁分離層が前記第１
及び第２の金属片よりも薄く形成され、前記第１
の金属片が前記金属基板に固着されている放熱体
と、 前記放熱体の前記第２の金属片上に固着された
半導体チツプと、 前記金属基板上に形成された膜回路用絶縁層と
、 前記絶縁層上に形成された膜回路と を備えた混成集積回路。 (2) 前記絶縁分離層は、セラミツク層である実
用新案登録請求の範囲第(1)項記載の混成集積回
路。 (3) 前記第２の金属片は、その体積が前記第１
の金属片の体積よりも大きいものである実用新案
登録請求の範囲第(1)項記載の混成集積回路。 (4) 前記膜回路用絶縁層は、前記金属基板に固
着された絶縁基板である実用新案登録請求の範囲
第(1)項記載の混成集積回路。 (5) 前記膜回路用絶縁層は、前記金属基板上に
形成された絶縁膜である実用新案登録請求の範囲
第(1)項記載の混成集積回路。[Claims for Utility Model Registration] (1) A laminate consisting of a metal substrate, a first metal piece, an insulating separation layer, and a second metal piece, the insulating separation layer being the first metal piece.
and a second metal piece formed thinner than the first metal piece.
a heat sink having a metal piece fixed to the metal substrate; a semiconductor chip fixed on the second metal piece of the heat sink; an insulating layer for a membrane circuit formed on the metal substrate; A hybrid integrated circuit comprising a membrane circuit formed on an insulating layer. (2) The hybrid integrated circuit according to claim 1, wherein the insulating separation layer is a ceramic layer. (3) The second metal piece has a volume equal to that of the first metal piece.
The hybrid integrated circuit according to claim (1), which is larger than the volume of the metal piece. (4) The hybrid integrated circuit according to claim (1), wherein the membrane circuit insulating layer is an insulating substrate fixed to the metal substrate. (5) The hybrid integrated circuit according to claim (1), wherein the film circuit insulating layer is an insulating film formed on the metal substrate.
JP1985018027U 1985-02-12 1985-02-12 Expired JPH0333071Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985018027U JPH0333071Y2 (en) 1985-02-12 1985-02-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985018027U JPH0333071Y2 (en) 1985-02-12 1985-02-12

Publications (2)

Publication Number Publication Date
JPS61136547U true JPS61136547U (en) 1986-08-25
JPH0333071Y2 JPH0333071Y2 (en) 1991-07-12

Family

ID=30506279

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985018027U Expired JPH0333071Y2 (en) 1985-02-12 1985-02-12

Country Status (1)

Country Link
JP (1) JPH0333071Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013132644A1 (en) * 2012-03-09 2013-09-12 三菱電機株式会社 Semiconductor module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013132644A1 (en) * 2012-03-09 2013-09-12 三菱電機株式会社 Semiconductor module
US9443784B2 (en) 2012-03-09 2016-09-13 Mitsubishi Electric Corporation Semiconductor module including plate-shaped insulating members having different thickness

Also Published As

Publication number Publication date
JPH0333071Y2 (en) 1991-07-12

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