JPS6046375A - 黒色酸化物被膜形成用溶液及びその溶液を使用して銅又は銅合金を誘電体に積層させる方法 - Google Patents
黒色酸化物被膜形成用溶液及びその溶液を使用して銅又は銅合金を誘電体に積層させる方法Info
- Publication number
- JPS6046375A JPS6046375A JP10440084A JP10440084A JPS6046375A JP S6046375 A JPS6046375 A JP S6046375A JP 10440084 A JP10440084 A JP 10440084A JP 10440084 A JP10440084 A JP 10440084A JP S6046375 A JPS6046375 A JP S6046375A
- Authority
- JP
- Japan
- Prior art keywords
- solution
- copper
- polymer
- ppm
- black
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
- C23C22/63—Treatment of copper or alloys based thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Chemical Treatment Of Metals (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US49708483A | 1983-05-23 | 1983-05-23 | |
US497084 | 1983-05-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6046375A true JPS6046375A (ja) | 1985-03-13 |
JPS6312142B2 JPS6312142B2 (de) | 1988-03-17 |
Family
ID=23975393
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10440084A Granted JPS6046375A (ja) | 1983-05-23 | 1984-05-23 | 黒色酸化物被膜形成用溶液及びその溶液を使用して銅又は銅合金を誘電体に積層させる方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS6046375A (de) |
DE (1) | DE3418359A1 (de) |
FR (1) | FR2549088A1 (de) |
GB (1) | GB2140827B (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62242531A (ja) * | 1986-04-15 | 1987-10-23 | 東芝ケミカル株式会社 | 銅張積層板の黒化処理方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3239090A1 (de) * | 1982-10-22 | 1984-04-26 | Bayer Ag, 5090 Leverkusen | Schwarz-metallisierte substratoberflaechen |
US4804575A (en) * | 1987-01-14 | 1989-02-14 | Kollmorgen Corporation | Multilayer printed wiring boards |
JP3400186B2 (ja) * | 1995-05-01 | 2003-04-28 | 三井金属鉱業株式会社 | 多層プリント配線板およびその製造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5613483A (en) * | 1979-07-14 | 1981-02-09 | Matsushita Electric Works Ltd | Artificial verdigris generating method |
JPS5723065A (en) * | 1980-07-11 | 1982-02-06 | Sanpo Shindo Kogyo Kk | Preparation of selective absorbing surface of solar energy collector |
JPS57143479A (en) * | 1981-03-02 | 1982-09-04 | Fujikura Ltd | Formation of insulating oxide film on copper or copper alloy |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2460896A (en) * | 1944-08-19 | 1949-02-08 | Enthone | Composition for blackening copper and copper alloy surfaces |
US2460898A (en) * | 1944-11-04 | 1949-02-08 | Enthone | Process and composition for coloring copper and copper alloy surfaces |
US2437441A (en) * | 1945-02-14 | 1948-03-09 | Associated Chemical Company | Coloring metal surfaces |
GB856928A (en) * | 1956-02-07 | 1960-12-21 | Lord Mfg Co | Treatment of metal surfaces |
DE1208972B (de) * | 1956-04-18 | 1966-01-13 | Hughes Aircraft Company, Culver City, Calif. (V. St. A.) | Verfahren zum Verbinden eines eine Kupferoberfläche aufweisenden Metalles mit einer Schicht aus polymeren Fluorkohlenwasserstofien |
US3530012A (en) * | 1965-12-23 | 1970-09-22 | Rasa Kasei Kk | Method of treating metal surfaces |
US3657023A (en) * | 1970-05-15 | 1972-04-18 | John J Grunwald | Composition for blackening copper |
BE789631A (fr) * | 1971-10-05 | 1973-02-01 | Dulux Australia Ltd | Procede perfectionne de formation de revetements de phosphate de zinc cristallin et solutions ameliorees pour former du phosphate de zinc |
JPS5165041A (en) * | 1974-12-04 | 1976-06-05 | Nippon Packaging Kk | Kinzokuno rinsanenhimakukeiseihoho |
CA1091914A (en) * | 1976-07-05 | 1980-12-23 | Hideo Kogure | Metal surface treatment liquid and rust preventive paint |
-
1984
- 1984-05-17 DE DE19843418359 patent/DE3418359A1/de not_active Withdrawn
- 1984-05-18 GB GB08412768A patent/GB2140827B/en not_active Expired
- 1984-05-23 JP JP10440084A patent/JPS6046375A/ja active Granted
- 1984-05-23 FR FR8408047A patent/FR2549088A1/fr not_active Withdrawn
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5613483A (en) * | 1979-07-14 | 1981-02-09 | Matsushita Electric Works Ltd | Artificial verdigris generating method |
JPS5723065A (en) * | 1980-07-11 | 1982-02-06 | Sanpo Shindo Kogyo Kk | Preparation of selective absorbing surface of solar energy collector |
JPS57143479A (en) * | 1981-03-02 | 1982-09-04 | Fujikura Ltd | Formation of insulating oxide film on copper or copper alloy |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62242531A (ja) * | 1986-04-15 | 1987-10-23 | 東芝ケミカル株式会社 | 銅張積層板の黒化処理方法 |
Also Published As
Publication number | Publication date |
---|---|
GB2140827A (en) | 1984-12-05 |
JPS6312142B2 (de) | 1988-03-17 |
DE3418359A1 (de) | 1984-11-29 |
FR2549088A1 (de) | 1985-01-18 |
GB8412768D0 (en) | 1984-06-27 |
GB2140827B (en) | 1986-09-10 |
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