JPS6030530U - capacitor - Google Patents
capacitorInfo
- Publication number
- JPS6030530U JPS6030530U JP12123583U JP12123583U JPS6030530U JP S6030530 U JPS6030530 U JP S6030530U JP 12123583 U JP12123583 U JP 12123583U JP 12123583 U JP12123583 U JP 12123583U JP S6030530 U JPS6030530 U JP S6030530U
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- external electrode
- serves
- slit
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims description 35
- 230000002093 peripheral effect Effects 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 21
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は角形チップ部品の構成を示す説明図、第２図は
円筒形チップ部品の構成を示す説明図、第３図はチップ
部品がフェイスボンディングされる基板面を示す側面図
、第４図はチップ部品を第３図の基板面へ自動実装する
状態を示す説明図、第５図は角形チップ部品の自動装着
を示す説明図、第６図は円筒形チップ部品の自動装着を
示す説明図、第７図は本考案に係るコンデンサの第１実
施例を示す説明図、第８図は第２実施例を示す説明図、
第９図は第３実施例を示す説明図、第１０図は第４実施
例を示す説明図、第１１図乃至第１５図は第″５乃至第
９実施例を示すコンデンサの外部電極側端面の説明図、
第１６図は第１峡施例を示す説明図、第１７図は第１１
実施例を示す説明図、第１８図及び第１９図は第１２及
び第Ｂ実施例を示すコンデンサを後端面より見た説明図
、第２０図は第１４実施例を示す説明図、第２１図は第
１５実施例を示す説明図、第２２図は第１峡施例を示す
説明図、第２３図は第１７実施例を示す説明図、第２４
図は第１＠施例を示す説明図、第２５図は第１峡施例を
示す説明図、第２６区は第２咲施例を示す説明図、第２
７図は第２１実施例を示す説明図、第２８図は第ｎ実施
例を示す断面図、第２９図は第２歿施例を示す断面図で
ある。
１１・・・コンデンサ本体、１２．１３・・・外部電極
、１４．１５・・・平面部を有する枠状板、１６・・・
枠体、１６Ａ、１６Ｂ、１６Ｃ，１６Ｄ、１６Ｅ、１６
Ｆ、３７Ａ、３７Ｂ・・・平面部、１７，１８．３９・
・・貫通孔、１９＝、２０・・・溝、２１・・・突部、
２２〜２９・・・突起、３０〜３３・・・スリット、３
４．３９・・・切欠き部。
・」
第６図
１２ １３ １２ １３１２ １
３ １２ １３FIG. 1 is an explanatory diagram showing the configuration of a square chip component, FIG. 2 is an explanatory diagram showing the configuration of a cylindrical chip component, FIG. 3 is a side view showing the substrate surface to which the chip component is face-bonded, and FIG. 4 is an explanatory diagram showing the state in which chip components are automatically mounted on the board surface of FIG. 3, FIG. 5 is an explanatory diagram showing automatic mounting of square chip components, and FIG. 6 is an explanatory diagram showing automatic mounting of cylindrical chip components. , FIG. 7 is an explanatory diagram showing the first embodiment of the capacitor according to the present invention, FIG. 8 is an explanatory diagram showing the second embodiment,
Fig. 9 is an explanatory diagram showing the third embodiment, Fig. 10 is an explanatory diagram showing the fourth embodiment, and Figs. An explanatory diagram of
Fig. 16 is an explanatory diagram showing the first embodiment, and Fig. 17 is an explanatory diagram showing the 11th embodiment.
18 and 19 are explanatory diagrams showing the 12th and B embodiments of the capacitor seen from the rear end surface. FIG. 20 is an explanatory diagram showing the 14th embodiment, and FIG. 21 22 is an explanatory diagram showing the 15th embodiment, FIG. 22 is an explanatory diagram showing the 1st embodiment, FIG. 23 is an explanatory diagram showing the 17th embodiment, and 24th
The figure is an explanatory diagram showing the 1st @ Example, Figure 25 is an explanatory diagram showing the 1st Gorge Example, Section 26 is an explanatory diagram showing the 2nd Saki Example,
7 is an explanatory diagram showing the twenty-first embodiment, FIG. 28 is a sectional view showing the nth embodiment, and FIG. 29 is a sectional view showing the second embodiment. DESCRIPTION OF SYMBOLS 11... Capacitor main body, 12.13... External electrode, 14.15... Frame-shaped plate having a plane part, 16...
Frame, 16A, 16B, 16C, 16D, 16E, 16
F, 37A, 37B...Plane part, 17, 18. 39.
...Through hole, 19=, 20...Groove, 21...Protrusion,
22-29...Protrusion, 30-33...Slit, 3
4.39... Notch part.・” Figure 6 12 13 12 1312 1
3 12 13
Claims (10)
ら外部へ引き出された構造のコンデンサにおいて、前記
コンデンサ本体の外周面周囲に少（とも一つの部材から
成る枠体を構成し、前記外部電極の一部を前記部材と反
対の外周面側のほぼ同一平面上に位置するように成形し
たことを特徴とするコンデンサ。(1) In a capacitor having a structure in which at least two or more external electrodes are drawn out from the capacitor main body, a frame made of at least one member is constructed around the outer peripheral surface of the capacitor main body, and the external electrodes A capacitor characterized in that a part of the capacitor is formed so as to be located substantially on the same plane on the outer peripheral surface side opposite to the member.
材と、この部材にほぼ対向し前記コンデンサ本体の下面
となる部材と、これら２つの部材に連接し前記外部電極
が貫通する孔若しくはスリットを有する部材とから構成
されることを特徴とする実用新案登録請求の範囲第１項
記載のコンデンサ。(2) The frame body includes a member that serves as the upper surface of the capacitor body, a member that substantially opposes this member and serves as the lower surface of the capacitor body, and a hole or slit that is connected to these two members and through which the external electrode passes. A capacitor according to claim 1, characterized in that the capacitor is comprised of a member having:
材と、この部材にほぼ対向し前記コンデンサ本体の下面
となると共に前記外部電極が貫通する孔若しくはスリッ
トを有する部材と、これら２つの部材に連接する部材と
から構成されることを特徴とする実用新案登録請求の範
囲第１項記載のコンデンサ。(3) The frame body includes a member that serves as the upper surface of the capacitor body, a member that substantially opposes this member and serves as the lower surface of the capacitor body, and has a hole or slit through which the external electrode passes, and these two members. A capacitor according to claim 1, characterized in that the capacitor comprises a member connected to the capacitor.
、る部材と、この部材に連接し前記外部電極が貫通する
孔若しくはスリットを有する部材とから構成されること
を特徴とする実用新案登録請求の範囲第１項記載のコン
デンサ。(4) Utility model registration characterized in that the frame body is composed of a member that serves as the upper surface of the capacitor body, and a member that is connected to this member and has a hole or slit through which the external electrode passes. A capacitor according to claim 1.
する部材は、その下端部に前記外部電極の一部を配設す
るスリット若しくは切欠きが形成されていることを特徴
とする実用新案登録請求の範囲第４項記載のコンデンサ
。(5) A utility model registration request characterized in that the member having a hole or slit through which the external electrode passes has a slit or notch formed at its lower end in which a part of the external electrode is disposed. A capacitor according to range 4.
材と、この部材にほぼ対向し前記コンデンサ本体の下面
となると共に前記外部電極が貫通する孔若しくはスリッ
トを有する部材とから構成されていることを特徴とする
実用新案登録請求の範囲第１項記載のコンデンサ。(6) The frame body is composed of a member that serves as the upper surface of the capacitor body, and a member that substantially opposes this member, serves as the lower surface of the capacitor body, and has a hole or slit through which the external electrode passes. A capacitor according to claim 1 of the utility model registration claim, characterized in that:
サ本体を収納する筒体状に構成されていることを特徴と
する実用新案登録請求の範囲第１項記載のコンデンサ。(7) The capacitor according to claim 1, wherein the frame body has a cylindrical shape with both ends open and housing the capacitor body inside.
記外部電極が貫通する孔を備えた部材で閉塞され内部に
前記コンデンサ本体を収納する箱体状に構成されている
ことを特徴とする実用新案登録請求の範囲第１項記載の
コンデンサ。(8) The frame has a box-like shape, with one end open and the other end closed with a member having a hole through which the external electrode passes, and the capacitor main body is housed inside. A capacitor according to claim 1 of the utility model registration claim, characterized in that:
面に前記外部電極の一部を埋設する溝若しくは切欠きが
形成されていることを特徴とする実用新案登録請求の範
囲第２項、第３項、第６項、第７項又は第８項記載のコ
ンデンサ。(9) The member serving as the lower surface of the capacitor body has a groove or notch formed therein in which a part of the external electrode is buried. The capacitor according to item 3, 6, 7 or 8.
面に前記外部電極の厚さ若しくは線径とほぼ同等の高さ
を有する突部が配設されていることを特徴とする実用新
案登録請求の範囲第２項、第３項、第６項、第７項又は
第８項記載のコンデンサ。 ■ 前記枠体は、その内面に前記コンデンサ本体の形状
に適合する溝又は前記コンデンサ本体を保持するための
突起が形成されていることを特徴とする実用新案登録請
求の範囲第１項、第２項又は第６項記載のコ゛ンデンサ
。(10) A request for registration of a utility model, characterized in that the member serving as the lower surface of the capacitor body is provided with a protrusion having a height substantially equal to the thickness or wire diameter of the external electrode on its lower surface. A capacitor according to the second, third, sixth, seventh, or eighth range of the range. (2) The frame body is characterized in that a groove that conforms to the shape of the capacitor body or a protrusion for holding the capacitor body is formed on the inner surface of the frame body. The capacitor according to item 6 or item 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12123583U JPS6030530U (en) | 1983-08-03 | 1983-08-03 | capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12123583U JPS6030530U (en) | 1983-08-03 | 1983-08-03 | capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6030530U true JPS6030530U (en) | 1985-03-01 |
| JPH0126102Y2 JPH0126102Y2 (en) | 1989-08-04 |
Family
ID=30277557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12123583U Granted JPS6030530U (en) | 1983-08-03 | 1983-08-03 | capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6030530U (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS619832U (en) * | 1984-06-23 | 1986-01-21 | エルナ−株式会社 | Chip type electrolytic capacitor |
| JPS6247120U (en) * | 1985-09-12 | 1987-03-23 | ||
| JPH01152611A (en) * | 1987-12-09 | 1989-06-15 | Nippon Chemicon Corp | Chip-type capacitor |
| JPH01218004A (en) * | 1988-02-26 | 1989-08-31 | Nippon Chemicon Corp | Manufacture of chipped capacitor |
| JPH01227414A (en) * | 1988-03-07 | 1989-09-11 | Nippon Chemicon Corp | Chip-type capacitor |
| JPH01257314A (en) * | 1987-12-09 | 1989-10-13 | Nippon Chemicon Corp | Chip-type capacitor |
| JPH01278711A (en) * | 1988-04-30 | 1989-11-09 | Nippon Chemicon Corp | Chip type capacitor |
| JPH0228912A (en) * | 1988-07-19 | 1990-01-31 | Nippon Chemicon Corp | Chip type capacitor |
| JPH02116725U (en) * | 1989-03-06 | 1990-09-19 | ||
| JPH02116727U (en) * | 1989-03-08 | 1990-09-19 | ||
| JPH0327038U (en) * | 1989-07-26 | 1991-03-19 | ||
| JP2006041068A (en) * | 2004-07-26 | 2006-02-09 | Matsushita Electric Ind Co Ltd | Horizontal surface mount electrolytic capacitor |
| JP2012216731A (en) * | 2011-04-01 | 2012-11-08 | Mitsubishi Electric Corp | Printed circuit board |
| JP2020194938A (en) * | 2019-05-30 | 2020-12-03 | サン電子工業株式会社 | Vibration-proof case and capacitor device including the same |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5237248U (en) * | 1975-09-10 | 1977-03-16 | ||
| JPS5271037U (en) * | 1975-11-22 | 1977-05-27 | ||
| JPS5391368A (en) * | 1977-01-20 | 1978-08-11 | Nippon Electric Co | Electronic parts |
| JPS54107048U (en) * | 1978-01-12 | 1979-07-27 | ||
| JPS5540517U (en) * | 1978-09-05 | 1980-03-15 | ||
| JPS55120150U (en) * | 1979-02-19 | 1980-08-26 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5174349A (en) * | 1974-12-24 | 1976-06-28 | Iyokiki Anzen Gijutsu Kenkyuku | CHIKARAHEIKO SOCHI |
-
1983
- 1983-08-03 JP JP12123583U patent/JPS6030530U/en active Granted
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5237248U (en) * | 1975-09-10 | 1977-03-16 | ||
| JPS5271037U (en) * | 1975-11-22 | 1977-05-27 | ||
| JPS5391368A (en) * | 1977-01-20 | 1978-08-11 | Nippon Electric Co | Electronic parts |
| JPS54107048U (en) * | 1978-01-12 | 1979-07-27 | ||
| JPS5540517U (en) * | 1978-09-05 | 1980-03-15 | ||
| JPS55120150U (en) * | 1979-02-19 | 1980-08-26 |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS619832U (en) * | 1984-06-23 | 1986-01-21 | エルナ−株式会社 | Chip type electrolytic capacitor |
| JPS6247120U (en) * | 1985-09-12 | 1987-03-23 | ||
| JPH01152611A (en) * | 1987-12-09 | 1989-06-15 | Nippon Chemicon Corp | Chip-type capacitor |
| JPH01257314A (en) * | 1987-12-09 | 1989-10-13 | Nippon Chemicon Corp | Chip-type capacitor |
| JPH01218004A (en) * | 1988-02-26 | 1989-08-31 | Nippon Chemicon Corp | Manufacture of chipped capacitor |
| JPH01227414A (en) * | 1988-03-07 | 1989-09-11 | Nippon Chemicon Corp | Chip-type capacitor |
| JPH01278711A (en) * | 1988-04-30 | 1989-11-09 | Nippon Chemicon Corp | Chip type capacitor |
| JPH0228912A (en) * | 1988-07-19 | 1990-01-31 | Nippon Chemicon Corp | Chip type capacitor |
| JPH02116725U (en) * | 1989-03-06 | 1990-09-19 | ||
| JPH02116727U (en) * | 1989-03-08 | 1990-09-19 | ||
| JPH0327038U (en) * | 1989-07-26 | 1991-03-19 | ||
| JP2006041068A (en) * | 2004-07-26 | 2006-02-09 | Matsushita Electric Ind Co Ltd | Horizontal surface mount electrolytic capacitor |
| JP2012216731A (en) * | 2011-04-01 | 2012-11-08 | Mitsubishi Electric Corp | Printed circuit board |
| JP2020194938A (en) * | 2019-05-30 | 2020-12-03 | サン電子工業株式会社 | Vibration-proof case and capacitor device including the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0126102Y2 (en) | 1989-08-04 |
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