JPH01218004A - Manufacture of chipped capacitor - Google Patents

Abstract

PURPOSE:To provide a chipped capacitor capable of properly keeping a distance between lead wires of various kinds by housing a capacitor in an outer frame having a housing space and folding the lead wires from an opening end of the outer frame along the bottom of the frame. CONSTITUTION:The title capacitor is formed by housing a capacitor element in a bottomed cylindrical outer casing 10, sealing a casing 10 opening end with a sealant member 4, and taking out a lead wire 3 led from the capacitor element to the outside after passing it through the sealant member 4. The lead wires 3 are folded substantially at a right angle in opposite directions to each other from the vicinity of a lead-out part of the sealant member 4, separating away them in a predetermined interval, and again folding them parallely. The capacitor 1 is housed in an outer frame 2 having a cylindrical housing space. The lead wires 3 are folded substantially at a right angle in the direction of an arrow X along the opening end surface and bottom of the outer frame 2. Hereby, a chipped capacity is assured which properly keeps an interval between lead wires 3 of various kinds.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a capacitor, and particularly to a method for manufacturing a chip-type capacitor suitable for surface mounting on a substrate.

[Conventional technology]

Conventionally, in order to make a capacitor into a chip, the capacitor element was molded with resin, and the lead wire for external connection led out from the end of the resin was bent along the side of the resin.
It was facing the wiring pattern of the printed circuit board.

Alternatively, for example, as in the idea described in Japanese Utility Model Publication No. 59-3557, it has been proposed that a conventional capacitor is housed in an exterior frame, and the lead wires are arranged on approximately the same plane as the end face of the exterior frame. . Also, JP-A-60-24511
As in the inventions described in Japanese Patent Application No. 60-245115, a capacitor is arranged in a bottomed cylindrical outer frame, and a single wire is led out from a through hole at the bottom of the outer frame.
It has been proposed that this lead wire is bent so as to fit into a recess provided on the outer surface of the exterior frame.

[Problem to be solved by the invention]

However, in chip-type capacitors that are molded, there is a risk that the capacitor element will be thermally degraded due to thermal stress during the molding process.

In addition, there are many parts that are structurally different from conventional capacitors.
The manufacturing method is also complicated.

Furthermore, with recent miniaturization of electronic components, the distance between lead wires led out from electronic components has become extremely short, and may be less than 1n. Therefore, in a chip capacitor that uses a normal capacitor, the distance between the lead wires led out to the outside is short, and when it is mounted on a printed circuit board and soldered, the molten solder may short-circuit the lead wires. was there.

Furthermore, the wiring pattern density of printed circuit boards has increased, and distances between various lead wires have become required for efficient arrangement. Therefore, it is necessary to realize distances between various lead wires while ensuring an appropriate distance between the lead wires, that is, while ensuring a distance that prevents short circuits due to solder.

Conventionally, in response to this request, a groove was provided on the bottom of the exterior frame.
A lead wire was placed in the groove. Therefore, the distance between the various lead wires can be adjusted by adjusting the distance between the grooves, but this is not efficient as it requires creating a mold for each requirement when manufacturing the exterior frame. Also, precise processing accuracy is required in the bending process of lead wires.

Furthermore, it is necessary to perform various bending processes on the lead wires, but this bending process places unnecessary stress on the lead wires and capacitor elements, which not only weakens the mechanical strength of the lead wires, but also It also causes deterioration of the electrical characteristics of the capacitor.

An object of the present invention is to provide a method for manufacturing a chip-type capacitor that maintains appropriate distances between various lead wires without changing the structure of a conventional capacitor.

[Means to solve the problem]

In this invention, a capacitor, in which the distance between the lead wires led out from the end face is formed in advance at a desired interval, is housed in an exterior frame having a storage space that matches the external dimensions of the capacitor, and then the lead wires are inserted into the openings of the exterior frame. It is characterized by being bent from the end face to the bottom face.

In another method, the distance between the lead wires is formed in advance to be larger than the outer diameter of the capacitor, and the capacitor is attached to the outer frame by bending it near the lead-out part and temporarily fixing it to the inner diameter of the storage space of the outer frame. After being stored, the lead wire is bent again at the lead-out portion to restore its original size.

Still another method is characterized in that the distance between the lead wires is formed in advance to be equal to or larger than the outer diameter of the capacitor, and the lead wires are inserted into insertion grooves provided on the inner surface of the housing space of the exterior frame.

[For production]

In the chip-type capacitor according to the invention according to claim 1 shown in the drawing, the lead wires 3 of the capacitor 1 are arranged at a desired distance, for example, a wiring back distance of a printed circuit board to be mounted, before being housed in the outer frame 2. are formed at intervals of

Therefore, after storing the capacitor 1 in the exterior frame 2, the lead wire 3 is simply bent at a nearly right angle in the direction of the bottom surface of the exterior frame 2 (in the direction of arrow X in the figure) along the open end surface and bottom surface of the exterior frame 2. , the tip portions can be arranged at a fixed distance from each other, that is, at a distance that matches the wiring pattern.

Further, in the manufacturing method according to claim 2, the capacitor 1
The lead wire 3 is formed in advance to have a size larger than the outer diameter of the capacitor 1. Therefore, after storing the lead wire 3 in the exterior frame 2, the lead wire 3 is returned to its original size, that is, a dimension larger than the outer diameter of the capacitor 1, and is bent at a substantially right angle toward the bottom of the exterior frame 2, as claimed in claim 1. A wider distance between the leads can be achieved compared to the described invention.

Note that when the capacitor 1 is housed in the exterior frame 2, stress is applied to the lead wire 3, but since the lead wire 3 is only slightly bent at its lead-out portion, there is almost no effect.

Furthermore, in the manufacturing method according to claim 3, an insertion 'a8 is formed on the inner surface of the storage space 9 of the outer frame 7. Therefore, even if the lead wire 3 is formed wider than the outer diameter of the capacitor 1, the lead wire 3 can be inserted into the insertion groove 8 when the capacitor 1 is housed in the outer frame 7, and the lead vA3 is deformed. There's no need. Therefore, compared to the manufacturing method according to the second aspect, stress applied to the lead wire 3 is eliminated.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a chip-type capacitor according to the present invention, and FIG. 2 is a process explanatory diagram of the chip-type capacitor according to an embodiment of the present invention.

Further, FIG. 3 is a front view showing the structure of an exterior frame according to a third embodiment of the present invention.

The main body of the capacitor 1 includes a capacitor element formed by winding electrode foil and electrolytic paper (not shown), which is housed in a bottomless cylindrical outer case IO made of aluminum or the like, as shown in FIG. 2(a). The open end of the exterior case 10 is sealed with a sealing body 4, and the lead wire 3 led from the capacitor element
is formed by penetrating the sealing body 4 and pulling it out to the outside.

As shown in FIG. 2(b), the lead wires 3 are bent at substantially right angles in opposite directions from the vicinity of the lead-out portion of the sealing body 4, spaced apart at a constant interval, and then bent parallel to each other again. This interval is made to match, for example, the interval between the wiring patterns of the printed circuit board to be mounted.

Note that the lead Na3 can be bent using conventional manufacturing methods and bending jigs.

Next, this capacitor 1 is housed in an exterior frame 2 having a cylindrical housing space that matches the outer diameter and shape of the capacitor 1, as shown in FIG. 2(C). It is desirable to use a material with excellent heat resistance for the exterior frame 2, and preferably heat-resistant synthetic resins such as epoxy, phenol, polyimide, etc., which have excellent heat resistance, ceramic materials, etc. are suitable.

The storage space of the exterior frame 2 is formed into a cylindrical shape with an inner diameter that is approximately the same as the outer diameter of the capacitor 1, since this embodiment uses a capacitor 1 having a cylindrical external shape. When using a non-cylindrical capacitor, for example, a capacitor having an elliptical cross-sectional shape, an exterior frame having an elliptical cylindrical storage space suitable for the shape is used.

Further, as shown in the drawing, a protrusion 5 is provided on one end surface of the exterior frame 2 to cover a part of the opening. This protrusion 5 comes into contact with the end surface of the capacitor 1 housed in the housing space of the exterior frame 2 . Therefore, the main body of the capacitor 1 is fixed within the exterior frame 2 by the protrusion 5 and the bendable lead wire 3.

After storing the capacitor 1 in the exterior frame 2, connect the lead wire 3.
2 (C1) along the opening end surface and bottom surface of the exterior frame 2.
Bend it almost at right angles in the direction of arrow X shown in . Then, the lead wire 3 is housed in the groove 6 formed from the bottom to the side surface of the exterior frame 2, thereby obtaining a chip-type capacitor as shown in FIG.

Note that when bending the lead wire 3, if a part of the lead wire 3 is held with a holding jig, stress on the inside of the capacitor l is reduced.

Furthermore, in this embodiment, the outer frame 2 is provided with a groove 6 for storing the lead wires 3, but as mentioned above, the distance between the lead wires 3 is determined before storing them in the outer frame 2. Although the groove 6 is not necessarily necessary, the lead wire 3 is inserted into the groove 6 in order to ensure stability on the bottom surface of the exterior frame 2.
It is effective to store it in

Next, a second embodiment of the invention will be described.

In the second embodiment of the present invention, the lead wires 3 shown in FIG. The distance between the lead wires 3 is made shorter than the inner diameter of the housing space of the outer frame 2. After storing the capacitor 1 in the outer frame 2, the distance between the lead wires 3 is changed to the original value. Further, the lead wire 3 is bent in the direction of the bottom surface of the exterior frame 2 so that its tip portion faces the bottom surface of the exterior frame 2.

Next, a third embodiment of the present invention shown in FIG. 3 will be described.

In the third embodiment of this invention, similarly to the second embodiment,
The lead wires led out from the capacitor are separated in advance by a distance longer than the outer diameter of the capacitor.

When storing the capacitor in the storage space 9 of the exterior frame 7, the lead wires are inserted into the insertion grooves 8 provided on the inner surface of the storage space 9. Furthermore, the lead wires protruding from the open end surface of the exterior frame 7 are bent toward the bottom surface of the exterior frame, similarly to the first and second embodiments, to form a chip-type capacitor.

In this embodiment, even when the distance between the lead wires is formed to be larger than the diameter of the capacitor, the lead wires are inserted through the insertion groove 8 and guided to the outside from the opening of the storage space 9. Therefore, compared to the second embodiment, the lead wires are temporarily fixed,
Furthermore, a process of restoring the product after storing it in the exterior frame may be required. Furthermore, reliability can be improved without putting unnecessary stress on the lead wires.

In addition, in the bending process of the lead wire 3 in each of the above embodiments, a flat part may be provided in a part of the lead wire 3 and the lead wire 3 may be bent using this flat part as a base point. In this case, the bending process becomes easy.

〔Effect of the invention〕

As described above, in the present invention, a capacitor in which the distance between the lead wires led out from the end face is formed in advance at a desired interval is housed in an exterior frame having a storage space that matches the external dimensions of the capacitor, and then the lead wires are removed. Since it is characterized by being bent along the bottom surface from the open end surface of the exterior frame, the distance between the lead wires is determined by a so-called forming process before being housed in the exterior frame. This forming process is
Since conventional processing methods and equipment can be used, it is easy to match the distance between the lead wires to the wiring pattern of the printed circuit board to be mounted. Further, there is no need to provide a groove or the like in the bottom of the outer frame and arrange a lead wire in the groove as in the conventional case, and there is no need for precise processing accuracy.

In another method, the distance between the lead wires is formed in advance to be larger than the outer diameter of the capacitor, and the capacitor is attached to the outer frame by bending it near the lead-out part and temporarily fixing it to the inner diameter of the storage space of the outer frame. After being stored, the lead wires are bent again at the lead-out part to restore the original dimensions, so as with the first method, the distance between the lead wires can be maintained appropriately, and it can also be used over a wider range. It is possible to achieve a lead wire distance of Also, if the distance between the lead wires is longer than the outer diameter of the capacitor body, a portion of the lead wires will be exposed from the side of the outer frame, making it easier to check the soldering condition. .

Still another method is characterized in that the distance between the lead wires is formed in advance to be equal to or larger than the outer diameter of the capacitor, and the lead wires are inserted into insertion grooves provided on the inner surface of the storage space of the exterior frame. , the same effect as that of the second means can be achieved without stress on the lead wire.

Note that when the lead wire is exposed from the side surface of the exterior frame, the solder layer is wrapped around and attached to the lead wire. Therefore, the contact area between the lead wire and the solder layer is expanded compared to the conventional method, and a reliable connection can be achieved.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a chip-type capacitor according to the present invention, and FIG. 2 is a process explanatory diagram of the chip-type capacitor according to an embodiment of the present invention. Moreover, FIG. 3 is a plan view showing the structure of the exterior frame according to the third embodiment. DESCRIPTION OF SYMBOLS 1... Capacitor, 2.7... Exterior frame, 3... Lead wire, 4... Sealing body, 5... Projection, 6... Groove, 8... Insertion groove, 9 ...Storage space, 10...Exterior case.

Claims (3)

[Claims] (1) After storing a capacitor whose lead wires drawn out from the end face are formed at a desired distance in advance in an exterior frame that has a storage space that matches the external dimensions of this capacitor, the lead wires are connected to the open end face of the exterior frame. A method for manufacturing a chip-shaped capacitor, which is characterized by bending the capacitor along the bottom surface. (2) After forming the distance between the lead wires in advance to be equal to or larger than the outer diameter of the capacitor, bending them near the lead-out part and temporarily fixing them to the inner diameter of the storage space in the outer frame, and storing the capacitor in the outer frame. 2. The method of manufacturing a chip capacitor according to claim 1, further comprising bending the lead wire again at the lead-out portion to restore the original size. (3) The distance between the lead wires is formed in advance to be equal to or larger than the outer diameter of the capacitor, and the lead wires are inserted into insertion grooves provided on the inner surface of the storage space of the exterior frame. A method for manufacturing chip capacitors.