JP2623283B2 - Manufacturing method of chip type capacitor - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for manufacturing a capacitor.
The present invention relates to a method for manufacturing a chip-type capacitor suitable for surface mounting on a substrate.

[Conventional technology]

Conventionally, in order to realize a capacitor chip, the capacitor element was subjected to resin molding, the lead wire for external connection derived from the resin end face was bent along the resin side face, and faced the wiring pattern of the printed board .

Alternatively, for example, as in the invention described in Japanese Utility Model Publication No. 59-3557, a capacitor in which a conventional capacitor is housed in an exterior frame and lead wires are arranged on substantially the same plane as an end surface of the exterior frame has been proposed. . Further, as in the inventions described in JP-A-60-245116 and JP-A-60-245115,
A capacitor was placed on a bottomed cylindrical exterior frame, a lead wire was led out from a through hole in the bottom surface of the exterior frame, and this lead was bent so as to fit into a recess provided on the outer surface of the exterior frame. ing.

[Problems to be solved by the invention]

However, in a chip-type capacitor subjected to molding, there is a possibility that the capacitor element is thermally degraded due to thermal stress during molding. Further, there are many structural differences from the conventional capacitor, and the manufacturing method thereof is complicated.

Also, with the recent miniaturization of electronic components, the distance between lead wires derived from the electronic components may be extremely short, and may be 1 mm or less. Therefore, in the case of chip type capacitors that use ordinary capacitors, the distance between the lead wires led out is short, and when soldering on a printed circuit board, the molten solder may short-circuit the lead wires. there were.

In addition, the wiring pattern density of the printed circuit board also increases,
The distance between various types of lead wires has been required for efficient arrangement. Therefore, it is necessary to ensure a proper distance between the lead wires, that is, a distance that does not cause a short circuit due to solder, and realize a distance between various lead wires.

Conventionally, in response to this requirement, a groove has been provided on the bottom surface of the exterior frame, and a lead wire has been arranged in the groove. Therefore, the distance between the various lead wires is adjusted by adjusting the distance of the groove, but it is necessary to manufacture a mold for manufacturing the exterior frame for each request, which is not efficient. In addition, precision processing accuracy is required even for bending lead wires.

In addition, it is necessary to perform various bending processes on the lead wire, but unnecessary stress is applied to the lead wire and the capacitor element in this bending process, so that the mechanical strength of the lead wire becomes weak, It also causes deterioration of the electrical characteristics of the capacitor.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing a chip-type capacitor that appropriately maintains various distances between leads without changing the manufacturing of a normal capacitor.

[Means for solving the problem]

According to the present invention, a capacitor in which a distance between lead wires derived from an end face is formed at a desired interval in advance is housed in an exterior frame having a storage space suitable for an outer diameter of the capacitor, and one opening of the exterior frame is provided. After the lead wire is derived from the end face, the lead wire is bent along the open end face and the bottom face.

In another means, the distance between the lead wires is formed in advance in the outer diameter dimension of the capacitor abnormally, and is bent near the lead-out portion so as to be equal to or less than the inner diameter dimension of the storage space of the outer frame, and then the capacitor is attached to the outer frame. The lead wire is stored, and the lead wire is bent again at the lead-out portion to restore the lead wire to its original size.

Still another means is characterized in that the distance between the lead wires is formed in advance to be equal to or larger than the outer diameter of the capacitor, and this lead wire is inserted through an insertion groove provided on the inner surface of the storage space of the exterior frame.

(Operation)

In the chip-type capacitor according to the first aspect of the present invention shown in the drawings, the lead wire 3 of the capacitor 1 conforms to a desired interval, for example, a wiring pattern distance of a printed circuit board to be mounted before being housed in the outer frame 2. Formed at regular intervals. For this reason, after the capacitor 1 is housed in the outer frame 2, the lead wire 3 extends along the opening end surface and the bottom surface of the outer frame 2.
By merely bending the outer frame 2 at a substantially right angle in the bottom direction (the direction of the arrow X in the figure), the end portions can be arranged at a fixed distance from each other, that is, a distance matching the wiring pattern.

Further, in the manufacturing method according to the second aspect, the lead wire 3 of the capacitor 1 is formed in advance to a dimension equal to or larger than the outer diameter of the capacitor 1. Therefore, the lead wire 3 is returned to its original size, that is, the size larger than the outer diameter of the capacitor 1 after being housed in the exterior frame 2, and is bent substantially at right angles toward the bottom surface of the exterior frame 2. A wider distance between the leads can be realized as compared to the described invention.

When the capacitor 1 is stored in the outer frame 2, stress is applied to the lead wires 3, but the lead wires 3
Has little effect since it is only slightly bent at its leading portion.

Further, in the manufacturing method according to the third aspect, the insertion groove 8 is formed on the inner surface of the storage space 9 of the exterior frame 7. Therefore, even when the lead wire 3 is formed wider than the outer diameter of the capacitor 1, the lead wire 3 can be inserted into the insertion groove 8 when the capacitor 1 is stored in the exterior frame 7, and the lead wire 3 is deformed. You don't have to. Therefore, the stress applied to the lead wire 3 is eliminated as compared with the manufacturing method according to the second aspect.

〔Example〕

Next, an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view showing a chip type capacitor according to the present invention, and FIG. 2 is a process explanatory view of a chip type capacitor according to an embodiment of the present invention. FIG. 3 is a front view showing a structure of an exterior frame according to a third embodiment of the present invention.

The main body of the capacitor 1 houses a capacitor element formed by winding an electrode foil and electrolytic paper (not shown) in a bottomed cylindrical outer case 10 made of aluminum or the like as shown in FIG. 2 (a). In addition, the opening end of the outer case 10 is sealed with a sealing body 4, and a lead wire 3 led from a capacitor element is penetrated through the sealing body 4 and drawn out to the outside.

As shown in FIG. 2 (b), the lead wire 3 is
From the vicinity of the lead-out portion, are bent at substantially right angles in opposite directions to each other, are separated at a predetermined interval, and are then bent again in parallel.
This interval is made to match, for example, the interval between the wiring patterns of the printed circuit board to be mounted. The bending process of the lead wire 3 can use a conventional manufacturing method and a bending jig.

Next, as shown in FIG. 2 (c), the capacitor 1 is housed in an outer frame 2 having a cylindrical housing space adapted to the outer diameter and the outer shape of the capacitor 1. It is desired that the exterior frame 2 be made of a material having excellent heat resistance, and preferably, a heat-resistant synthetic resin such as epoxy, phenol, or polyimide having excellent heat resistance, or a ceramic material is suitable.

In this embodiment, the storage space of the exterior frame 2 is formed in a cylindrical shape having an inner diameter substantially the same as the outer diameter of the capacitor 1 because the external shape of the capacitor 1 is used in this embodiment. When a non-cylindrical capacitor, for example, a capacitor having an elliptical cross-sectional shape is used, an exterior frame having an elliptical cylindrical storage space suitable for the shape is used.

Further, as shown in the drawing, a projection 5 that covers a part of the opening is provided on one of the end surfaces of the exterior frame 2. The protrusion 5 comes into contact with the end face of the capacitor 1 housed in the housing space of the exterior frame 2. Therefore, the main body of the capacitor 1 is fixed in the exterior frame 2 by the projections 5 and the bent lead wires 3.

After the capacitor 1 is housed in the exterior frame 2 and the lead wire 3 is led out from the opening end face of the exterior frame 2, the lead wire 3 is shown along the opening end face and the bottom face of the exterior frame 2 in FIG. Bend at a substantially right angle in the direction of arrow X. Then, the lead wire 3 is housed in the groove 6 formed from the bottom surface to the side surface of the exterior frame 2 to obtain a chip type capacitor as shown in FIG.

When bending the lead wire 3, the lead wire 3
Is held by the holding jig, the stress on the inside of the capacitor 1 is reduced.

In this embodiment, the outer frame 2 provided with the groove portion 6 for accommodating the lead wire 3 is used. However, as described above, the distance between the lead wires 3 is determined before the outer frame 2 is accommodated. Therefore, the groove 6 is not always necessary, but it is effective to store the lead wire 3 in the groove 6 in order to secure stability on the bottom surface of the outer frame 2.

 Next, a second embodiment of the present invention will be described.

In the second embodiment of the present invention, the lead wires 3 shown in FIG. 2B are separated from each other by a distance longer than the outer diameter of the capacitor 1. Then, the lead wire 3 is bent slightly toward the center at the lead-out portion, so that the distance between the lead wires 3 is temporarily made shorter than the inner diameter of the storage space of the exterior frame 2. After the capacitor 1 is housed in the outer frame 2, the distance between the lead wires 3 is restored. Furthermore, the lead wire 3 is bent in the direction of the bottom surface of the exterior frame 2, and the front end thereof is exposed to the bottom surface of the exterior frame 2.

Next, a third embodiment of the present invention shown in FIG. 3 will be described.

In the third embodiment of the present invention, similarly to the second embodiment, the lead wires led out of the capacitor are separated from each other in advance so as to be longer than the outer diameter of the capacitor. When the capacitor is stored in the storage space 9 of the exterior frame 7, the lead wire is inserted into the insertion groove 8 provided on the inner surface of the storage space 9.
Further, the lead wire projecting from the opening end face of the exterior frame 7 is bent toward the exterior frame bottom in the same manner as in the first and second embodiments to form a chip-type capacitor.

In this embodiment, even when the distance between the lead wires is formed larger than the diameter of the capacitor, the lead wires are not inserted into the insertion grooves 8.
Through the opening of the storage space 9 to the outside. Therefore, as compared with the second embodiment, it is possible to omit the step of restoring the lead wire to the original size after forming the lead wire to be equal to or smaller than the inner diameter of the storage space of the outer frame and storing the lead wire in the outer frame.

In the bending process of the lead wire 3 in each of the above-described embodiments, a flat portion may be provided on a part of the lead wire 3 and the flat portion may be bent at the base point. In this case, the bending process is facilitated.

〔The invention's effect〕

As described above, according to the present invention, a capacitor in which the distance between the lead wires derived from the end face is formed at a desired interval in advance is housed in an exterior frame having a housing section adapted to the outer diameter of the capacitor, and After leading the lead wire from one open end face of the exterior frame, it is characterized by bending the lead wire along the open end face and the bottom surface, so the distance between the lead wires is formed by so-called forming processing before storing it in the exterior frame. It is determined. Since the conventional forming method and apparatus can be used for this forming process, it is easy to adjust the distance between the lead wires to the wiring pattern of the printed circuit board to be mounted. Further, unlike the related art, there is no need to provide a groove or the like on the bottom surface of the exterior frame and arrange a lead wire in the groove, and there is no need for precise processing accuracy.

In another means, the distance between the lead wires is formed in advance to be equal to or larger than the outer diameter of the capacitor, and is bent near the lead-out portion so as to be equal to or smaller than the inner diameter of the storage space of the outer frame. And the lead wire is bent again by the lead-out portion to recover the original dimensions. Therefore, similarly to the first means, the distance between the lead wires can be appropriately maintained, and a wider range can be obtained. Over the distance between the lead wires. When the distance between the lead wires is longer than the outer diameter of the capacitor body, a part of the lead wire is exposed from the side surface of the exterior frame, so that the soldering state can be easily checked.

Still another means is characterized in that the distance between the lead wires is formed in advance to be equal to or larger than the outer diameter of the capacitor, and this lead wire is inserted into the insertion groove provided on the inner surface of the storage space of the outer frame. An effect equivalent to the effect of the second means can be realized without stress on the lead wire.

When the lead wire is exposed from the side surface of the exterior frame, the solder layer adheres so as to be wound around the lead wire. Therefore, the contact area between the lead wire and the solder layer is larger than before,
A reliable connection can be made.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a chip type capacitor according to the present invention, and FIG. 2 is a process explanatory view of a chip type capacitor according to an embodiment of the present invention. FIG. 3 is a plan view showing the structure of the exterior frame according to the third embodiment. DESCRIPTION OF SYMBOLS 1 ... Condenser, 2, 7 ... Exterior frame, 3 ... Lead wire, 4 ... Sealing body, 5 ... Projection part, 6 ... Groove part, 8 ... Insertion groove, 9 ... Storage space, 10 ... ... outer case.

 ──────────────────────────────────────────────────続 き Continuing from the front page Jury President Teruo Hemi Judge Akira Suzuki Judge Noboru Nishiyama (56) References JP-A-1-175221 (JP, A) Jpn.

Claims (3)

(57) [Claims] The present invention has a storage space adapted to the outer diameter of a capacitor, and has open end faces provided at both ends of the storage space. One of the open end faces extends from a bottom surface to a lead-out portion of a lead wire of the capacitor. An exterior frame having a projection having a surface protruding from the opening end surface is prepared.After a plurality of lead wires derived from the end surface of the capacitor are formed at predetermined intervals in advance, the capacitor is stored in the storage space from the other opening end surface of the exterior frame. After the lead wire of the capacitor housed in the exterior frame is led out from the opening end surface where the projection is formed, the lead wire is bent along the bottom surface of the exterior frame while contacting the lead wire with the protruding surface of the projection. A method for manufacturing a chip-type capacitor, comprising: 2. A storage space suitable for the outer diameter of the capacitor is provided, and open end faces are provided at both ends of the storage space. One of the open end faces extends from a bottom surface to a lead-out portion of a lead wire of the capacitor. Prepare an exterior frame with a projection with a surface protruding from the opening end face, form the lead wire derived from the end face of the capacitor with a separation dimension greater than the outer diameter dimension of the capacitor in advance, and derive the lead wire Bending in the vicinity of the portion, forming the separation of the lead wire to be equal to or less than the inner diameter of the storage space of the exterior frame, storing the capacitor in the storage space from the other open end face of the exterior frame, and forming the projection of the lead wire of the capacitor. After the lead wire is drawn out from the open end face of the outer frame, the lead wire is bent again near the lead-out portion to restore the separation distance at the tip of the lead wire to the original size, and the lead wire is returned. Method for manufacturing a chip type capacitor, wherein the folding serial along the bottom surface of the outer frame while in contact with the protruding surface of the protrusion. 3. A storage space suitable for the outer diameter of the capacitor is provided, and open end faces are provided at both ends of the storage space. One of the open end faces extends from a bottom surface to a lead-out portion of a lead wire of the capacitor. A projection having a surface protruding from the opening end face is provided.An exterior frame having an insertion groove through which the lead wire of the capacitor is inserted is provided on the inner surface of the storage space, and a plurality of lead wires derived from the end face of the capacitor are prepared in advance. After the capacitor is formed in a predetermined shape, the capacitor is housed in the housing space from the other opening end face of the exterior frame, and after the lead wire of the capacitor housed in the exterior frame is led out from the end face of the opening where the projection is formed through the insertion groove. A method of manufacturing a chip-type capacitor, comprising bending a lead wire along a bottom surface of an exterior frame while abutting a lead wire on a surface of the projecting portion.