JPS6025159U - リ−ドフレ−ム - Google Patents
リ−ドフレ−ムInfo
- Publication number
- JPS6025159U JPS6025159U JP1983117523U JP11752383U JPS6025159U JP S6025159 U JPS6025159 U JP S6025159U JP 1983117523 U JP1983117523 U JP 1983117523U JP 11752383 U JP11752383 U JP 11752383U JP S6025159 U JPS6025159 U JP S6025159U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- external lead
- bent
- lead part
- radius
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
図は本考案実施例を用いた回路構体断面図である。
１・・・・・・可撓性フィルム、２・・・・・・チップ
載置部、３・・・・・・外部リード部、４・・・・・・
半導体ＩＣチップ、５・・・・・・金属細線、６・・・
・・・外囲樹脂体、７・・・・・・回路配線用基板、８
・・・・・・配線接続部。
載置部、３・・・・・・外部リード部、４・・・・・・
半導体ＩＣチップ、５・・・・・・金属細線、６・・・
・・・外囲樹脂体、７・・・・・・回路配線用基板、８
・・・・・・配線接続部。
Claims (1)
- 可撓性絶縁基体上に、金属箔の半導体チップ載置部およ
び外部リード部を有し、前記外部リード部を曲げ半径０
． ５７７１７７１以下で９０°〜１８０°折り曲げた
構造のリードフレーム。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983117523U JPS6025159U (ja) | 1983-07-28 | 1983-07-28 | リ−ドフレ−ム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983117523U JPS6025159U (ja) | 1983-07-28 | 1983-07-28 | リ−ドフレ−ム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6025159U true JPS6025159U (ja) | 1985-02-20 |
| JPS6336703Y2 JPS6336703Y2 (ja) | 1988-09-28 |
Family
ID=30270498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983117523U Granted JPS6025159U (ja) | 1983-07-28 | 1983-07-28 | リ−ドフレ−ム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6025159U (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05211204A (ja) * | 1991-11-29 | 1993-08-20 | Akira Kitahara | 表面実装電子部品 |
| JPH06120411A (ja) * | 1992-10-07 | 1994-04-28 | Nec Corp | 実装型パッケージ |
| JP2012094713A (ja) * | 2010-10-27 | 2012-05-17 | Shindengen Electric Mfg Co Ltd | 樹脂封止型半導体装置及び弾性接続子 |
-
1983
- 1983-07-28 JP JP1983117523U patent/JPS6025159U/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05211204A (ja) * | 1991-11-29 | 1993-08-20 | Akira Kitahara | 表面実装電子部品 |
| JPH06120411A (ja) * | 1992-10-07 | 1994-04-28 | Nec Corp | 実装型パッケージ |
| JP2012094713A (ja) * | 2010-10-27 | 2012-05-17 | Shindengen Electric Mfg Co Ltd | 樹脂封止型半導体装置及び弾性接続子 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6336703Y2 (ja) | 1988-09-28 |
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