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JPS599571U - printed wiring board - Google Patents

printed wiring board

Info

Publication number
JPS599571U
JPS599571U JP10432982U JP10432982U JPS599571U JP S599571 U JPS599571 U JP S599571U JP 10432982 U JP10432982 U JP 10432982U JP 10432982 U JP10432982 U JP 10432982U JP S599571 U JPS599571 U JP S599571U
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
component connecting
connecting land
insulating coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10432982U
Other languages
Japanese (ja)
Inventor
清 内田
Original Assignee
沖電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 沖電気工業株式会社 filed Critical 沖電気工業株式会社
Priority to JP10432982U priority Critical patent/JPS599571U/en
Publication of JPS599571U publication Critical patent/JPS599571U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の印刷配線板の構造を示す要部平面図、第
2図はその断面図、第3図は本考案の一実施例を示す要
部平面図、第4図はその断面図である。 1・・・基板、2・・・部品接続用ランド部、3・・・
回路導体、4・・・絶縁被覆、5・・・間隙。
Fig. 1 is a plan view of the main part showing the structure of a conventional printed wiring board, Fig. 2 is a sectional view thereof, Fig. 3 is a plan view of the main part showing an embodiment of the present invention, and Fig. 4 is a sectional view thereof. It is. 1... Board, 2... Land portion for connecting components, 3...
Circuit conductor, 4... Insulating coating, 5... Gap.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板上に部品接続用ランド部と該部品接続用ランド部に
接続された回路導体を形成し、前記部品接続用ランド部
を除く部分に絶縁被覆を施す構造の印刷配線板において
、部品接続用ランド部と絶縁被覆とを接触させて回路導
体を絶縁被覆で完全に覆ったことを特徴とする印刷配線
板。
In a printed wiring board having a structure in which a component connecting land and a circuit conductor connected to the component connecting land are formed on the board, and an insulating coating is applied to a portion other than the component connecting land, the component connecting land is 1. A printed wiring board characterized in that a circuit conductor is completely covered with an insulating coating by contacting the circuit conductor with the insulating coating.
JP10432982U 1982-07-12 1982-07-12 printed wiring board Pending JPS599571U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10432982U JPS599571U (en) 1982-07-12 1982-07-12 printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10432982U JPS599571U (en) 1982-07-12 1982-07-12 printed wiring board

Publications (1)

Publication Number Publication Date
JPS599571U true JPS599571U (en) 1984-01-21

Family

ID=30245019

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10432982U Pending JPS599571U (en) 1982-07-12 1982-07-12 printed wiring board

Country Status (1)

Country Link
JP (1) JPS599571U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS534859A (en) * 1976-06-17 1978-01-17 Fujitsu Ltd Method of soldering printed board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS534859A (en) * 1976-06-17 1978-01-17 Fujitsu Ltd Method of soldering printed board

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