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JPS5983071U - printed wiring board - Google Patents

printed wiring board

Info

Publication number
JPS5983071U
JPS5983071U JP18018182U JP18018182U JPS5983071U JP S5983071 U JPS5983071 U JP S5983071U JP 18018182 U JP18018182 U JP 18018182U JP 18018182 U JP18018182 U JP 18018182U JP S5983071 U JPS5983071 U JP S5983071U
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
substrate
conductive portion
land
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18018182U
Other languages
Japanese (ja)
Inventor
竹村 智之
Original Assignee
日立コンデンサ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立コンデンサ株式会社 filed Critical 日立コンデンサ株式会社
Priority to JP18018182U priority Critical patent/JPS5983071U/en
Publication of JPS5983071U publication Critical patent/JPS5983071U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の印刷配線板の平面図、第2図は本考案の
実施例の平面図を示す。 11・・・・・・基板、12・・・・・・印刷配線、1
8・・・・・・ランド、14・・・・・・ライン、15
・・・・・・非導電部。
FIG. 1 is a plan view of a conventional printed wiring board, and FIG. 2 is a plan view of an embodiment of the present invention. 11... Board, 12... Printed wiring, 1
8...Land, 14...Line, 15
...Non-conductive part.

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] (1)基板に任意の印刷配線を設けた印刷配線板におい
て、ランドの近傍のラインの一部に非導電部を設けるこ
とを特徴とする印刷配線板。
(1) A printed wiring board in which arbitrary printed wiring is provided on a substrate, characterized in that a non-conductive portion is provided in a part of the line near the land.
(2)非導電部が基板に設けられたスリットである実用
新案登録請求の範囲第1項記載の印刷配線板。
(2) The printed wiring board according to claim 1, wherein the non-conductive portion is a slit provided in the substrate.
JP18018182U 1982-11-29 1982-11-29 printed wiring board Pending JPS5983071U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18018182U JPS5983071U (en) 1982-11-29 1982-11-29 printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18018182U JPS5983071U (en) 1982-11-29 1982-11-29 printed wiring board

Publications (1)

Publication Number Publication Date
JPS5983071U true JPS5983071U (en) 1984-06-05

Family

ID=30390737

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18018182U Pending JPS5983071U (en) 1982-11-29 1982-11-29 printed wiring board

Country Status (1)

Country Link
JP (1) JPS5983071U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014183059A (en) * 2013-03-18 2014-09-29 Hitachi Automotive Systems Ltd Control apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014183059A (en) * 2013-03-18 2014-09-29 Hitachi Automotive Systems Ltd Control apparatus

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