JPS6113994U - electronic equipment - Google Patents
electronic equipmentInfo
- Publication number
- JPS6113994U JPS6113994U JP9777284U JP9777284U JPS6113994U JP S6113994 U JPS6113994 U JP S6113994U JP 9777284 U JP9777284 U JP 9777284U JP 9777284 U JP9777284 U JP 9777284U JP S6113994 U JPS6113994 U JP S6113994U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- utility
- model registration
- electronic
- electronic equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例でａは上面図、ｂは断面図、
第２図は別の実施例でａは断面図、ｂぱ下面図である。
１：電子部品、２，５：絶縁基板、３：外部接続リード
ピン、４：導体層、６：シールドヶース。FIG. 1 shows an embodiment of the present invention, in which a is a top view, b is a cross-sectional view,
FIG. 2 shows another embodiment, in which a is a sectional view and b is a bottom view. 1: Electronic component, 2, 5: Insulating board, 3: External connection lead pin, 4: Conductor layer, 6: Shield case.
Claims (4)
する導体層により被覆され、該絶縁基板の他面側に電子
部品が配置されたことを特徴とする電子装置。(1) An electronic device characterized in that one surface of an insulating substrate is covered with a conductor layer having a gap near a connecting conductor through-hole, and electronic components are arranged on the other surface of the insulating substrate.
おいて、電子部品が絶縁基板の他面上に搭載されたこと
を特徴とする電子装置。(2) Utility Model Registration The electronic device according to claim 1, characterized in that an electronic component is mounted on the other surface of the insulating substrate.
て、電子部品が絶縁基板の他面側に平行に配置された別
の回路基板上に搭載されたことを特徴とする電子装置。(3) Utility Model Registration The electronic device according to claim 1, characterized in that the electronic components are mounted on another circuit board arranged parallel to the other surface of the insulating substrate.
ずれかに記載の装置において、導体層が絶縁基板と共に
電子部品を包囲するシールドヶースの縁部にろう付けさ
れたことを特徴とする電子装置。(4) Utility model registration The device according to any one of claims 1 to 3, characterized in that the conductor layer is brazed to the edge of a shield case surrounding the electronic component together with the insulating substrate. electronic equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9777284U JPS6113994U (en) | 1984-06-29 | 1984-06-29 | electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9777284U JPS6113994U (en) | 1984-06-29 | 1984-06-29 | electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6113994U true JPS6113994U (en) | 1986-01-27 |
Family
ID=30657332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9777284U Pending JPS6113994U (en) | 1984-06-29 | 1984-06-29 | electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6113994U (en) |
-
1984
- 1984-06-29 JP JP9777284U patent/JPS6113994U/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6113994U (en) | electronic equipment | |
| JPS5920671U (en) | printed wiring board | |
| JPS58158443U (en) | hybrid integrated circuit board | |
| JPS5920675U (en) | Laminated structure of printed wiring board | |
| JPS6146769U (en) | Electronic circuit forming chip mounting equipment | |
| JPS59143070U (en) | integrated circuit board | |
| JPS6133464U (en) | Aluminum base board | |
| JPS6057154U (en) | flexible printed board | |
| JPS5897896U (en) | Chip circuit that also serves as a shield | |
| JPS5846472U (en) | printed wiring board | |
| JPS5937742U (en) | Heat dissipation structure | |
| JPS5872869U (en) | electronic circuit equipment | |
| JPS599571U (en) | printed wiring board | |
| JPS5918459U (en) | Electrical element mounting structure | |
| JPS60133698U (en) | Board mounting structure | |
| JPS58130365U (en) | Configuration of wiring board connector | |
| JPS6071192U (en) | Printed board | |
| JPS59189257U (en) | printed wiring board | |
| JPS5866668U (en) | printed wiring board | |
| JPS6057155U (en) | hybrid integrated circuit | |
| JPS6033466U (en) | electrical circuit board | |
| JPS58196869U (en) | Electrical component mounting structure on printed wiring board | |
| JPS60144263U (en) | printed wiring board | |
| JPS619867U (en) | Hybrid integrated circuit device | |
| JPS59149638U (en) | Microwave integrated circuit device mounting parts |