JPS5952659U - hybrid integrated circuit - Google Patents
hybrid integrated circuitInfo
- Publication number
- JPS5952659U JPS5952659U JP14721982U JP14721982U JPS5952659U JP S5952659 U JPS5952659 U JP S5952659U JP 14721982 U JP14721982 U JP 14721982U JP 14721982 U JP14721982 U JP 14721982U JP S5952659 U JPS5952659 U JP S5952659U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- wiring pattern
- conductive member
- substrate material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 238000009429 electrical wiring Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図及び第２図は本考案に係るハイブリッドＩＣの斜
視図である。
１・２・・・基板材、３・・・接着剤、４・・・電気的
接続領域、５・・・配線パターン、６・・・導電性部材
、７・・・リード線。1 and 2 are perspective views of a hybrid IC according to the present invention. DESCRIPTION OF SYMBOLS 1 and 2... Substrate material, 3... Adhesive, 4... Electrical connection area, 5... Wiring pattern, 6... Conductive member, 7... Lead wire.
Claims (2)
た第１の基板材と第２の基板材の背面を互いに貼着する
ことによって形成された基板を介して互いに対向するよ
うに前記基板の両面の端部に設けられた複数の電気的接
続領域を有し、前記対向する電気的接続領域は、それぞ
れ同一面上の所要の配線パターンに接続しているもので
あり、かつ前記基板に外嵌する導電性部材によって電気
的に接続されているものであることを特徴とする混成集
積回路。(1) A first substrate material and a second substrate material, each having a predetermined electrical wiring pattern on its upper surface, are formed by adhering their back surfaces to each other. It has a plurality of electrical connection areas provided at the ends of both sides, and each of the opposing electrical connection areas is connected to a required wiring pattern on the same surface, and is external to the board. A hybrid integrated circuit characterized in that the circuit is electrically connected by a fitted conductive member.
ことを特徴とする実用新案登録請求の範囲第１項記載の
混成集積回路。(2) The hybrid integrated circuit according to claim 1, wherein the conductive member also serves as a lead wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14721982U JPS5952659U (en) | 1982-09-30 | 1982-09-30 | hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14721982U JPS5952659U (en) | 1982-09-30 | 1982-09-30 | hybrid integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5952659U true JPS5952659U (en) | 1984-04-06 |
Family
ID=30327451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14721982U Pending JPS5952659U (en) | 1982-09-30 | 1982-09-30 | hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5952659U (en) |
-
1982
- 1982-09-30 JP JP14721982U patent/JPS5952659U/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5952659U (en) | hybrid integrated circuit | |
| JPS6052639U (en) | photovoltaic device | |
| JPS60149202U (en) | Microwave integrated circuit device | |
| JPS58131638U (en) | Hybrid integrated circuit device | |
| JPS6117752U (en) | Tape carrier semiconductor device | |
| JPS58182343U (en) | printed circuit board equipment | |
| JPS5827947U (en) | Hybrid integrated circuit device | |
| JPS58131639U (en) | Hybrid integrated circuit device | |
| JPS5952668U (en) | hybrid integrated circuit | |
| JPS59138264U (en) | Wiring board equipment | |
| JPS58118769U (en) | printed wiring board | |
| JPS60111052U (en) | Hybrid IC | |
| JPS60106363U (en) | printed wiring board | |
| JPS5998672U (en) | hybrid integrated circuit | |
| JPS6081674U (en) | Ceramic hybrid integrated circuit device | |
| JPS6115753U (en) | semiconductor equipment | |
| JPS58146372U (en) | printed wiring board | |
| JPS6049669U (en) | Connection structure of chip carrier type package | |
| JPS6343430U (en) | ||
| JPS59128747U (en) | Lead frame for stacked hybrid integrated circuit devices | |
| JPS6073269U (en) | Electronic component mounting structure | |
| JPS5926266U (en) | hybrid integrated circuit | |
| JPS5974720U (en) | electronic components | |
| JPS60130672U (en) | printed wiring board | |
| JPS619867U (en) | Hybrid integrated circuit device |