JPS59138264U - Wiring board equipment - Google Patents
Wiring board equipmentInfo
- Publication number
- JPS59138264U JPS59138264U JP3244783U JP3244783U JPS59138264U JP S59138264 U JPS59138264 U JP S59138264U JP 3244783 U JP3244783 U JP 3244783U JP 3244783 U JP3244783 U JP 3244783U JP S59138264 U JPS59138264 U JP S59138264U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- electronic component
- wiring
- board
- lead terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の配線基板装置を示す正面図、第２図ない
し第５図は本考案の配線基板装置の一実施例を示すもの
で、第２図は分解斜視図、第３図は平面図、第４図は第
３図Ａ−Ａ線に沿う断面図、第５図は第３図Ｂ−Ｅ３線
に沿う断面図、第６図、第７図および第８図は夫々互い
に異なる他の実施例を示す断面図である。
１・・・配線基板、２・・・電子部品、１１・・・電子
部品、１２．１３・・・配線基板、１４・・・リード端
子、１５・・・配置部、１６．２１・・・配線パターン
、１７゜２２・・・導電ペースト、１８．２３・・・絶
縁ペースト、２０・・・配置孔。
１４ １１ −
第８図
２１（２２）
ゝ１８
第６図Fig. 1 is a front view showing a conventional wiring board device, Figs. 2 to 5 show an embodiment of the wiring board device of the present invention, Fig. 2 is an exploded perspective view, and Fig. 3 is a plan view. Figure 4 is a sectional view taken along line A-A in Figure 3, Figure 5 is a sectional view taken along line B-E3 in Figure 3, and Figures 6, 7, and 8 are different from each other. FIG. DESCRIPTION OF SYMBOLS 1... Wiring board, 2... Electronic component, 11... Electronic component, 12.13... Wiring board, 14... Lead terminal, 15... Arrangement part, 16.21... Wiring pattern, 17°22... Conductive paste, 18.23... Insulating paste, 20... Arrangement hole. 14 11 - Figure 8 21 (22) ゝ18 Figure 6
Claims (1)
電子部品の配置部を有し且つ少なくとも表面が導電ペー
ストからなるとともに前記電子部品のリード端子と接続
する配線パターンを前記配置部を囲み並べて形成した一
方の配線基板と南前記部品の配置孔を有し且つ少なくと
も表面が導電ペーストからなるとともに前記電子部品の
リード端子と接続する配線パターンを有する他方のフレ
キシブル配線基板とを備え、前記配線基板の配置部に前
記電子部品を配置するとともに、前記フレキシブル配置
基板を、そのパターン形成面が前記配線基板のパターン
形成面と対面し且つ前記電子部品を囲む状態で前記配線
基板の上側に配置し、前記配線基板およびフレキシブル
配線基板に夫々形成した各配線パターンは前記電子部品
のリード端子を挾んでその上下面に接着してなる配線基
板装置。An electronic component having lead terminals lined up and protruding from a peripheral side thereof, and a placement area for the electronic component, at least a surface of which is made of conductive paste, and a wiring pattern connected to the lead terminals of the electronic component surrounding the placement area. One wiring board formed side by side and the other flexible wiring board having a hole for arranging the component, at least a surface of which is made of conductive paste, and having a wiring pattern connected to a lead terminal of the electronic component; The electronic component is placed in the placement portion of the board, and the flexible placement board is placed above the wiring board in such a manner that its patterned surface faces the patterned surface of the wiring board and surrounds the electronic component. and a wiring board device in which the wiring patterns formed on the wiring board and the flexible wiring board sandwich lead terminals of the electronic component and are bonded to the upper and lower surfaces thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3244783U JPS59138264U (en) | 1983-03-07 | 1983-03-07 | Wiring board equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3244783U JPS59138264U (en) | 1983-03-07 | 1983-03-07 | Wiring board equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59138264U true JPS59138264U (en) | 1984-09-14 |
Family
ID=30163267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3244783U Pending JPS59138264U (en) | 1983-03-07 | 1983-03-07 | Wiring board equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59138264U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008300588A (en) * | 2007-05-31 | 2008-12-11 | Renesas Technology Corp | Electronic apparatus, and manufacturing method thereof |
-
1983
- 1983-03-07 JP JP3244783U patent/JPS59138264U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008300588A (en) * | 2007-05-31 | 2008-12-11 | Renesas Technology Corp | Electronic apparatus, and manufacturing method thereof |
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