JPS59180451U - 電子部品の実装装置 - Google Patents
電子部品の実装装置Info
- Publication number
- JPS59180451U JPS59180451U JP7583783U JP7583783U JPS59180451U JP S59180451 U JPS59180451 U JP S59180451U JP 7583783 U JP7583783 U JP 7583783U JP 7583783 U JP7583783 U JP 7583783U JP S59180451 U JPS59180451 U JP S59180451U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- component mounting
- container
- lead
- mounting equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第１図は従来の電子部品の実装装置の断面図、第２図は
本考案の一実施例である電子部品の実装装置の断面図で
ある。− １・・・第１の容器、２・・・電子部品、３・・・第２
の容器、４・・・突起、５・・・リード、６・・・電子
部品の電気接続部。
本考案の一実施例である電子部品の実装装置の断面図で
ある。− １・・・第１の容器、２・・・電子部品、３・・・第２
の容器、４・・・突起、５・・・リード、６・・・電子
部品の電気接続部。
Claims (1)
- 箱型の第１の容器内に装着され〃集積回路素子等の電子
部品と外部のリードとを電気的に接続し、−該第１の容
器を箱型の第２の容器で施蓋してこれを封止した電子部
品の実装装置において、第１の容器内に前記リードを延
長させ、該リードを弾性変形させて前記電子部品に圧接
し、リードと電子部品とを電気的に接続したことを特徴
とする電子部品の実装装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7583783U JPS59180451U (ja) | 1983-05-20 | 1983-05-20 | 電子部品の実装装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7583783U JPS59180451U (ja) | 1983-05-20 | 1983-05-20 | 電子部品の実装装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59180451U true JPS59180451U (ja) | 1984-12-01 |
Family
ID=30205896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7583783U Pending JPS59180451U (ja) | 1983-05-20 | 1983-05-20 | 電子部品の実装装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59180451U (ja) |
-
1983
- 1983-05-20 JP JP7583783U patent/JPS59180451U/ja active Pending
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