JPS59112857A - Atomizer pump - Google Patents
Atomizer pumpInfo
- Publication number
- JPS59112857A JPS59112857A JP22425882A JP22425882A JPS59112857A JP S59112857 A JPS59112857 A JP S59112857A JP 22425882 A JP22425882 A JP 22425882A JP 22425882 A JP22425882 A JP 22425882A JP S59112857 A JPS59112857 A JP S59112857A
- Authority
- JP
- Japan
- Prior art keywords
- nozzle plate
- melting point
- soft solder
- soft
- electric vibrator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 25
- 230000008018 melting Effects 0.000 claims abstract description 22
- 238000002844 melting Methods 0.000 claims abstract description 22
- 238000005219 brazing Methods 0.000 claims description 3
- 238000000889 atomisation Methods 0.000 claims description 2
- 239000007788 liquid Substances 0.000 abstract description 11
- 239000000919 ceramic Substances 0.000 abstract description 2
- 239000000446 fuel Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 7
- 238000005476 soldering Methods 0.000 description 3
- 230000005496 eutectics Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 244000062175 Fittonia argyroneura Species 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Special Spraying Apparatus (AREA)
- Electrostatic Spraying Apparatus (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、灯油などの液体燃料、水・薬液などの液体の
霧化ポンプに関するものであり、さらに詳しくは、圧電
振動子などの電気振動子を利用した霧化ポンプに関する
ものである。Detailed Description of the Invention Field of the Invention The present invention relates to an atomizing pump for liquid fuels such as kerosene and liquids such as water and chemicals. This relates to the atomization pump used.
従来例の構成とその問題点
従来この種の霧化〜ポンプは、１図に示すように構成さ
れている。すなわち電気振動子１の相対向する平滑面に
は、電極膜２ａ、２ｂが形成され電極膜２ｂとノズル板
３とは軟鑞４ａを介して接合がされていた。また、ノズ
ル板３の他方の面とボディー５は、軟鑞４ｂを介して接
合されていた。Conventional Structure and Problems Conventionally, this type of atomizing pump has a structure as shown in FIG. That is, electrode films 2a and 2b were formed on opposing smooth surfaces of the electric vibrator 1, and the electrode film 2b and the nozzle plate 3 were joined via a soft solder 4a. Further, the other surface of the nozzle plate 3 and the body 5 were joined via soft solder 4b.
電気振動子１は、主成分がＰｂＯ，ＴｉＯ２ｔ Ｚ ｒ
Ｏ２などからなるセラミック体で、円形中央部に開口部
を設けたりインク形状を有し、電極膜２ａ。The electric vibrator 1 has main components of PbO, TiO2t Z r
The electrode film 2a is a ceramic body made of O2 or the like, has an opening in the circular center, or has an ink shape.
２ｂは銀糸の厚膜用導電性ペーストの焼結体、あるいは
金属などの蒸着膜が用いられ、ノズル板３は厚さ約５０
μｍ程度の金属板がディスク状に加工され、その中央部
にはノズル孔６の貫通孔（孔径約７０〜１００μｍ）が
複数個設けられていた。2b is a sintered body of conductive paste for thick film made of silver thread, or a vapor-deposited film of metal, etc., and the nozzle plate 3 has a thickness of about 50 mm.
A metal plate with a diameter of approximately μm was processed into a disk shape, and a plurality of through holes (hole diameter approximately 70 to 100 μm) for nozzle holes 6 were provided in the center of the disk.
接合部の軟鑞４ａ、４ｂには、溶融点が約１８０°Ｃの
共晶半田が用いられていた。電極膜２ａは外部リード線
接続用電極であり、ボディー５には液体通路７および液
体室８が設けられていた。Eutectic solder having a melting point of about 180° C. was used for the soft solders 4a and 4b at the joints. The electrode film 2a is an electrode for connecting an external lead wire, and the body 5 is provided with a liquid passage 7 and a liquid chamber 8.
この構成では、２ケ所の接合部（軟鑞４ａ、４ｂ）に、
同じ溶融点の共晶半田を用いるため、先の接合部（軟＆
４−）が、次の半田付（軟鑞４ｂ）時の熱的影響を受け
、接合層の一部が再溶融し易くなシ接合層の変化（空隙
部や犀み変化など）で、特性が不安定になるという問題
を有していた。In this configuration, at the two joints (soft solders 4a and 4b),
Since eutectic solder with the same melting point is used, the joint (soft &
4-) is affected by the heat during the next soldering (soft soldering 4b), and a part of the bonding layer is likely to re-melt.Changes in the bonding layer (such as voids and changes in soldering), resulting in poor characteristics. The problem was that it became unstable.
発明の目的
本発明はかかる従来の問題を解消するもので、接合層が
熱的影響を受は難い構成とし、接合層の変化ならびに特
性の不安定さを抑制することを目的とする。OBJECTS OF THE INVENTION The present invention solves such conventional problems, and aims to provide a structure in which the bonding layer is not easily affected by heat, thereby suppressing changes in the bonding layer and instability of characteristics.
発明の構成
この目的を達成するために本発明は、電気振動子−ノズ
ル板、ノズル板−ボディーとの接合におい・で、融点の
異なった軟鑞を用いた接合構造をしたものである。すな
わち一方の接合部には高融点軟鑞、他方の接合部には一
方の固相点以下の融点を有す低融点軟鑞によシ接合をす
るものである。Structure of the Invention In order to achieve this object, the present invention has a joint structure in which soft solders having different melting points are used to join the electric vibrator to the nozzle plate and the nozzle plate to the body. That is, one joint is made using a high melting point soft solder, and the other joint is made using a low melting point soft solder having a melting point lower than the solidus point of the one.
この構成によって、前者の接合部は、後者の接合時の熱
的影響を受けても、接合層に空隙部や層厚さなどの変化
を生じることなく、特性も安定化が図れるという作用を
有する。With this configuration, even if the former joint is subjected to thermal effects during the latter joint, there will be no change in voids or layer thickness in the joint layer, and the characteristics can be stabilized. .
実施例の説明 以下、本発明の一実施例について説明をする。Description of examples An embodiment of the present invention will be described below.
図において、電気振動子１は、リング状（寸法：外径１
０門×内径４防厚さ１語）からなる圧電素子で、振動子
１の両平滑面側には電極膜２ａ、２ｂがパターン形成さ
れている。この電極膜２ｂとノズル板３とは、溶融点約
１８０〜２００ ’Ｃの軟鑞４ａを介して接合されてい
る。次いでノズル板３の他方の面をボディー５が、溶融
点約１３０〜１５０°Ｃの軟鑞４ｂを用いて接合されて
いる。In the figure, the electric vibrator 1 has a ring shape (dimensions: outer diameter 1
It is a piezoelectric element consisting of 0 gate x inner diameter 4 wall thickness 1 word), and electrode films 2a and 2b are patterned on both smooth surfaces of the vibrator 1. The electrode film 2b and the nozzle plate 3 are joined via a soft solder 4a having a melting point of about 180 to 200'C. Next, the body 5 is joined to the other surface of the nozzle plate 3 using soft solder 4b having a melting point of about 130 to 150°C.
ボディー５には、液体通路７および液体室８が設けられ
ている。The body 5 is provided with a liquid passage 7 and a liquid chamber 8.
上記構成において、電気振動子１（電極膜２ｂ含む〕−
ノズル板３、ノズル板３−ボディー５間の接合を融点の
異なる軟鑞を介した接合構造にしている。軟鑞の組合せ
は、前者の接合に高融点軟鑞、後者の接合には高融点軟
鑞の固相点以下の融点を有す低融点軟鑞が適している。In the above configuration, the electric vibrator 1 (including the electrode film 2b) -
The nozzle plate 3 and the nozzle plate 3-body 5 are joined using soft solders having different melting points. As for the combination of soft solders, a high melting point soft solder is suitable for the former joining, and a low melting point soft solder having a melting point lower than the solidus point of the high melting point soft solder is suitable for the latter joining.
このため前者の接合部は、後者の接合時の熱的影響を受
けても、接合層に空隙部や層厚さなどの変化を生じるこ
とがない。そのため、特性の安定化が図れる効果が得ら
れる。Therefore, even if the former bonding portion is subjected to thermal effects during the latter bonding, there will be no change in voids or layer thickness in the bonding layer. Therefore, the effect of stabilizing the characteristics can be obtained.
尚、前者の接合部に低融点軟鑞、後者の接合部に高融点
軟鑞を用い、軟鑞付手順を変えることによっても同様の
効果は得られる。The same effect can also be obtained by changing the soft brazing procedure by using a low melting point soft solder for the former joint and a high melting point soft solder for the latter joint.
発明の効果 本発明の霧化ポン−プによれば、次の効果が得られる。Effect of the invention According to the atomizing pump of the present invention, the following effects can be obtained.
（１）電気振動子（電極膜を含む）とノズル板の接合部
と、ノズル板とボディーの接合部の一方と他方で融点の
異なる鑞付をする先の接合部は熱的影響を受けても、接
合層に空隙部や層厚さの変化などが生じない。従って、
安定した特性を得られる効果がある。(1) The joint between the electric vibrator (including the electrode film) and the nozzle plate, and the joint between the nozzle plate and the body, which have different melting points on one side and the other, are subject to thermal influence. Also, no voids or changes in layer thickness occur in the bonding layer. Therefore,
This has the effect of providing stable characteristics.
図は本発明の一実施例の説明に用いた断面図である。
１・・・・・・電気振動子、２ａ・・印−電極膜、２ｂ
・・川・電極膜、３・・用ノズル板、４ａ・・・・・・
軟鑞、４ｂ・・・・°°軟鑞、５・・・・・・ボディー
、６・・川・ノズル孔、了・・・・・・液体通路、８・
・・・・・液体室。The figure is a sectional view used to explain one embodiment of the present invention. 1... Electric vibrator, 2a... Sign-electrode film, 2b
・・River・Electrode membrane, 3・・Nozzle plate, 4a・・・・
Soft solder, 4b...°°Soft solder, 5... Body, 6... River/nozzle hole, End... Liquid passage, 8...
...Liquid chamber.
Claims (3)
と、−ないし−以上のノズル孔を設けたノズル板と、こ
れらを支持するボディーとからなり、前記電極膜の一方
を含めた前記電気振動子と前記ノズル板との接合部と、
前記ノズル板の裏面とホゾイーとの接合部との一方を、
他方とは融点の異なった鑞で接合した霧化ポンプ。(1) Consists of an electric vibrator with an electrode film provided on opposing smooth surfaces, a nozzle plate with - or more nozzle holes, and a body supporting these, including one of the electrode films. a joint between the electric vibrator and the nozzle plate;
One of the joints between the back surface of the nozzle plate and the housing,
One atomization pump is joined with the other using a solder with a different melting point.
鑞付けをした特許請求の範囲第１項記載の鋺化ポンプ。(2) The electric vibrator and the nozzle plate are joined to each other by high melting point brazing.
前記高融点軟鑞の固相点以下の融点からなる、低る 融点状鑞付をした特許請求の範囲第ｖ項記載の霧化ポン
プ。(3) For the connection between the back of the nozzle plate and the body,
The atomizing pump according to claim 5, which has a low melting point brazing having a melting point lower than the solidus point of the high melting point soft solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22425882A JPS59112857A (en) | 1982-12-20 | 1982-12-20 | Atomizer pump |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22425882A JPS59112857A (en) | 1982-12-20 | 1982-12-20 | Atomizer pump |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59112857A true JPS59112857A (en) | 1984-06-29 |
| JPS648584B2 JPS648584B2 (en) | 1989-02-14 |
Family
ID=16810955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22425882A Granted JPS59112857A (en) | 1982-12-20 | 1982-12-20 | Atomizer pump |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59112857A (en) |
-
1982
- 1982-12-20 JP JP22425882A patent/JPS59112857A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS648584B2 (en) | 1989-02-14 |
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