JPS59111385A - Method of producing electronic circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of manufacturing an electronic circuit board used in industrial electronic equipment and general consumer electronic equipment.

Conventional configurations and their problems In recent years, there has been a growing demand for smaller and lighter electronic devices, and there has also been a growing trend toward high-mix, low-volume production. In order to meet these demands, high-density packaging of constituent circuit components is being carried out even in the electronic circuits that make devices function.

To explain the typical conventional manufacturing method for electronic circuit boards, there is first a manufacturing process for the blank board that makes up the electronic circuit. Photoresist is applied to a copper foil-covered laminate, and a desired conductor circuit pattern is formed on this. After exposing the copper foil to light through the film, unnecessary portions of the copper foil are etched to form a desired conductor circuit.

Electronic circuit components such as resistors and capacitors, which are chipped in size on the order of a few cryo angles, are placed at predetermined positions on the substrate on which the conductor circuit is formed, and the electronic circuit components are soldered by a soldering process. The terminals are connected to a conductor circuit to form an electronic circuit board. Soldering processes include the soldering process, in which a board on which chip-shaped electronic circuit components are placed is immersed in molten solder for a certain period of time, and the soldering process, in which solder paste is screen printed on a board on which a conductive circuit has been formed, and then the chip-shaped electronic circuit components are The solder reflow method, in which circuit components are placed on a board and heated at a predetermined temperature, has the advantage of allowing higher density mounting than the solder dispersion method.

The conventional electronic circuit board manufacturing method described above uses a negative pattern such as an exposure film for forming a conductor circuit or a screen for printing solder paste when using a solder reflow method. Therefore, a process of creating these negative patterns is required, and in order to change the circuit pattern, it is necessary to change from the negative pattern, and the workability from circuit pattern design to circuit formation is extremely poor, and the above-mentioned electronic equipment There was a problem in that it was not possible to respond quickly to the trend of high-mix, low-volume production.

Object of the Invention The object of the present invention is to eliminate the above-mentioned conventional drawbacks, and to provide an electronic circuit in which a conductor circuit is directly formed on a substrate without using a negative pattern, and the conductor circuit is connected to an electrical terminal of an electronic circuit component. The object of the present invention is to provide a method for manufacturing a board.

Structure of the Invention The method for manufacturing an electronic circuit board of the present invention includes arranging electronic circuit components at predetermined positions on an insulating substrate based on predetermined circuit design information, and then placing a predetermined conductor on the insulating substrate. A circuit is formed by a drawing means, and the electronic circuit component and the conductor circuit are electrically connected by the drawing means to directly form an electronic circuit on the insulating substrate. By forming the circuit and connecting the conductive circuit and the electrical terminals of the electronic circuit components, an electronic circuit board can be manufactured in an extremely short time.

Description of examples Hereinafter, the present invention will be explained based on examples.

FIG. 1 is a block diagram for explaining one embodiment of the present invention, and 1 stores circuit design information such as conductor circuit drawing information, types of electronic circuit components, and placement positions;
Based on this circuit design information, first control means controls electronic circuit component placement means 2 and drawing means 3, which will be described later; 2 is electronic circuit component placement means for placing electronic circuit components at predetermined positions on an insulating substrate , 3 is a drawing means for forming a conductor circuit and connecting the conductor circuit to an electrical terminal of an electronic circuit component.

As the insulating substrate used in the present invention, a substrate made of a ceramic material such as aluminum oxide glass or porcelain, or a resin material such as Uphenol, epoxy, polyester, or polyimide can be used. In the following explanation, a ceramic substrate will be explained as a representative example.

The present invention will be described in accordance with the embodiment shown in FIG. Place electronic circuit components in predetermined positions. The control means 1 is, for example, a microcomputer.

A minicomputer or the like can be used, and the selection is made depending on the amount of circuit design information. The electronic circuit component placement means 2 may be, for example, a device similar to a conventional chip mounter.

The ceramic substrate on which the electronic circuit components are arranged is supplied to the drawing means 3, the ceramic substrate is relatively moved according to the circuit design information from the control means 1, and the drawing head is used to place the ceramic substrate on which the electronic circuit components are arranged. A predetermined conductor circuit is formed. Further, the drawing head is used to connect the electrical terminals of the electronic circuit components arranged on the ceramic substrate to the conductive circuit.

As the drawing head, for example, an ink jet recording head can be used. FIG. 2 shows a cross-sectional view of an example of a drawing head. In the figure, reference numeral 4 denotes a base container of the drawing head, and a diaphragm 5 is formed on the negative side of the base container. A piezoelectric element 6 is driven by a drive source 10. 7 is a discharge port, 8 is a pressure chamber, and 9 is a pipe. The pressure chamber 8 is airtightly constituted by the base container 4 and the diaphragm 5, and is filled with paint for drawing a conductor circuit through the pipe 9.

To explain the operation of the drawing head, when an electric pulse is applied to the piezoelectric element 6 from the drive source 10 and the diaphragm 5 deforms convexly toward the pressure chamber 8, the internal volume of the pressure chamber 8 decreases and the pressure increases. , paint is ejected from the discharge lower. When the diaphragm 6 deforms in a convex manner toward the piezoelectric element 6, the internal volume of the pressure chamber 8 increases and the pressure decreases.As a result, paint is replenished via the tube 9.

The drawing of a conductor circuit by the drawing head and the connection between the electrical terminal of the electronic circuit component and the conductor circuit will be described in more detail. FIGS. 3 and 4 show the drawing and connection operations described above.

11 is the drawing head shown in FIG. 2; 12 is a conductive paint such as silver paste; 13 is a conductor circuit formed by discharging the conductive paint 12; 14 is a ceramic substrate;
5 is a chip-shaped electronic circuit component, and 16 is an electrical terminal of the electronic circuit component 16. When an electric current is applied to the drawing head 11, the conductive paint 12 is discharged and the ceramic substrate 1 is
It adheres to the surface of 4. At the same time, by moving the ceramic substrate 14 relative to the drawing head 11 based on the circuit design information, a conductor circuit 13 with a predetermined number of turns is obtained. The width of the conductor circuit 13 is mainly determined by the dimensions of the discharge lower and the distance between the discharge lower and the ceramic substrate, but if the distance between the discharge lower and the ceramic substrate 14 is large, the conductor circuit 13 and A bleed-like phenomenon occurs where the boundary with the ceramic substrate becomes unclear.
A short circuit may occur in the conductor circuit 13. Therefore, it is preferable that the distance is 5 or less.

When the conductive paint 12 is continuously discharged from the ceramic substrate 14 to the electrical terminals 16 of the electronic circuit component 15, the conductor circuit 13 and the electrical terminals 16 can be electrically connected as shown in FIG. In order to make the electrical connection more reliable, the ceramic substrate 14 and the drawing head 1 are connected near the connection part.
It is preferable that the relative velocity with respect to 1 is μ to 'Io at the time of drawing the conductor circuit 13. Further, as shown in FIG. 5, if the angle between the discharge direction of the conductive paint 12 and the ceramic substrate 7 near the connection part is made smaller than 90 degrees (preferably around 46 degrees), a more reliable connection can be achieved. can get.

In order to cure the conductive paint, it is necessary to perform heat treatment at a temperature and time depending on each conductive paint, and the present invention naturally includes this heat treatment step.

As described above, in this example, an electronic circuit board is formed by directly forming a conductive circuit connected to the electrical terminal of the electronic circuit part on an insulating substrate on which the electronic circuit part is arranged, using an inkjet jet recording head. This has resulted in a significant reduction in manufacturing man-hours.

FIG. 6 is a block diagram for explaining another embodiment of the present invention, in which the first control means 1, electronic circuit component arrangement means 2, and drawing means 3 are the control means and electronic circuit component arrangement means of the above embodiment, respectively. It has the same function as the means and drawing means. Reference numeral 17 designates placement position detection means for detecting the actual placement positions of electronic circuit components placed on a ceramic substrate, which is an insulating substrate; 18, circuit design information correction means; and 19, second control means.

This embodiment will be explained according to FIG. 6. First, a ceramic substrate is supplied to the electronic circuit component placement means 2, and the ceramic substrate is relatively moved according to the circuit design information from the first control means 1. Place the electronic circuit components at the position. This ceramic substrate is supplied to the arrangement position detecting means 1γ, and the actual arrangement position of the electronic circuit component is detected. The detected actual placement position information is transferred to the circuit design information modification means 18.

On the other hand, the circuit design information of the first control means 1 is transferred to the circuit design information correction means 18, and after being corrected with information on the actual placement positions of the electronic circuit components, it is transferred to the second control means 19.

Here, correction of circuit design information will be explained.

In this embodiment, the correction of circuit design information refers to, for example, errors in placement positions in electronic circuit component placement means.

In order to ensure that the electrical terminals of electronic circuit components and conductor circuits can be reliably connected against misalignment of electronic circuit components in a relatively small range, such as misalignment of electronic circuit components due to vibration, etc., This means modifying the conductor circuit drawing information. Therefore, a modification such as removing or adding a part of an electronic circuit component changes the circuit design information of the first control means.

The ceramic substrate on which the actual placement position of the electronic circuit component has been detected is supplied to the drawing means 3, and the ceramic substrate is relatively moved according to the corrected circuit design information from the second control means to arrange the electronic circuit component. A conductor circuit is formed on a ceramic substrate using a drawing head. Further, the drawing head is used to connect the electrical terminals of the electronic circuit components arranged on the ceramic substrate to the conductive circuit.

An example of the arrangement position detecting means 17 is shown in a block diagram in FIG. 2o is an image sensor camera, 21 is 2
Value conversion means, 22ij feature extraction means, 23 storage means, 1
4 indicates a ceramic substrate.

Ceramic substrate 1 on which electronic circuit components (not shown) are arranged
The surface of 4 is captured as image information by the image sensor camera 20, and this image information signal is converted into signals of ``1'' and 0'' by the binarization means 21.

The feature extraction means 22 extracts the boundary between the ceramic substrate 14 and the electronic circuit component from the binarized signal, converts this boundary into a plane coordinate value, and stores it in the storage means 23.

Although the first control means 11, circuit design information modification means 18, and second control means 19 are shown individually in FIG. 6, they can be integrated with the first control means. Furthermore, the binarization means 21, feature extraction means 22, and storage means 23 in FIG.
It can be integrated with the control means 1.

As described above, by providing the placement position detection means in this embodiment, it is possible to correct deviations in the placement positions of electronic circuit components and draw conductor circuits, thereby improving the manufacturing yield of circuit boards. There is.

Effects of the Invention As is clear from the above explanation, the present invention forms a conductor circuit directly on an insulating substrate on which electronic circuit components are arranged, and at the same time connects the electrical terminals of the electronic circuit components and the conductor circuit. This allows electronic circuit boards to be manufactured in an extremely short time, and is fully compatible with the recent trend in electronic equipment to produce a wide variety of products in small quantities.

[Brief explanation of the drawing]

FIG. 1 is a block diagram showing an embodiment of the present invention, FIG. 2 is a sectional view of a drawing head used in an embodiment of the invention, and FIGS. 3 to 5 are drawing means in an embodiment of the invention. FIG. 6 is a block diagram showing another embodiment of the present invention, and FIG. 7 is a configuration diagram showing an example of the arrangement position detecting means of the present invention. 1...First control means, 2...Electronic circuit component arrangement means, 3...Drawing means, 11...
...Drawing head. 17... Arrangement position detection means, 18...
Circuit design information correction means, 19... second control means, 20... image sensor camera, 21...
... Binarization means, 22 ... Feature extraction means, 2
3...Memorization means. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2 Figure 3 Figure 4 Figure 4 Figure 6/'/J Figure 7

Claims (1)

[Claims] (1) After arranging electronic circuit components at predetermined positions on an insulating substrate based on predetermined circuit design information, forming a conductive circuit in a predetermined shape on the insulating substrate by a drawing means, and . A method of manufacturing an electronic circuit board, characterized in that the electronic circuit component and the conductor circuit are electrically connected by the drawing means. @) Detecting the actual placement position of the electronic circuit component placed at a predetermined position on the insulating substrate, and correcting the circuit design information with the detected actual placement position information. The method of manufacturing an electronic circuit board according to claim 1, wherein a conductive circuit is formed on the insulating substrate based on the corrected circuit design information.